公开(公告)号：US20200157332A1

公开(公告)日：2020-05-21

申请号：US16632584

申请日：2017-10-19

Applicant: Shengyi Technology Co., Ltd.

Inventor： Chiji GUAN ,  Xianping ZENG ,  Guangbing CHEN ,  Haosheng XU

IPC: C08L25/08 ,  C08J5/24 ,  C08L83/04 ,  C09D183/04 ,  H05K1/02 ,  C09D125/08 ,  B32B5/02 ,  B32B5/26 ,  H05K1/03 ,  C08G77/00

Abstract: A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.

公开(公告)号：US10584222B2

公开(公告)日：2020-03-10

申请号：US15555826

申请日：2015-09-18

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping Zeng ,  Guangbing Chen ,  Chiji Guan ,  Wenhua Yang

IPC: C08J5/24 ,  B32B5/26 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  C08F257/02 ,  H05K1/03 ,  C08L9/06 ,  B32B15/14 ,  C08F279/02 ,  B32B7/04 ,  B32B37/10 ,  C08L71/12

Abstract: Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

公开(公告)号：US10513608B2

公开(公告)日：2019-12-24

申请号：US15736887

申请日：2017-03-29

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long Xi ,  Jiang Li ,  Yongjing Xu

IPC: C08L79/06 ,  C08J5/24 ,  H05K1/03 ,  H05K3/46 ,  C08L63/00

Abstract: The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and achieves a low coefficient of thermal expansion.

公开(公告)号：US10343383B2

公开(公告)日：2019-07-09

申请号：US15525665

申请日：2014-12-02

Applicant: Shengyi Technology Co., Ltd.

Inventor： Hui Li ,  Kehong Fang

IPC: B32B27/38 ,  B32B27/26 ,  B32B27/20 ,  B32B27/18 ,  B32B27/04 ,  B32B15/092 ,  C08G59/32 ,  C08G59/38 ,  C08G59/42 ,  C08G59/68 ,  C08L63/00 ,  C08J5/24 ,  H05K1/03 ,  B32B27/28 ,  B32B27/30 ,  C08J5/04 ,  C08L79/04 ,  C08G73/06 ,  C08G61/02 ,  C08L61/14 ,  H05K1/02

Abstract: A thermosetting resin composition and a prepreg and a laminated board prepared therefrom. The thermosetting resin composition contains the following components in parts by weight: 50-150 parts of a cyanate; 30-100 parts of an epoxy resin; 5-70 parts of styrene-maleic anhydride; 20-100 parts of a polyphenyl ether; 30-100 parts of a halogen-free flame retardant; 0.05-5 parts of a curing accelerator; and 50-200 parts of a filler. The prepreg and laminated board prepared from the thermosetting resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance and moisture resistance, etc., and are suitable for use in a halogen-free high-frequency multilayer circuit board.

公开(公告)号：US10280343B2

公开(公告)日：2019-05-07

申请号：US15521359

申请日：2015-12-08

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Young Ji Tae ,  Young Seok Park ,  Byeong In Ahn

IPC: C09J151/00 ,  C09J163/00 ,  C09J7/00 ,  B32B7/12 ,  B32B15/08 ,  B32B27/28 ,  C09J9/00 ,  C09J11/08 ,  H05K1/03 ,  C09J7/10 ,  H05K1/09 ,  C08G59/40 ,  C08G59/50

Abstract: The present invention relates to an adhesive resin composition including a styrene-ethylene-butylene-styrene copolymer with a specific chemical structure, an epoxy resin, an acid anhydride compound, and a curing catalyst, an adhesive film obtained from the resin composition, and a flexible metal laminate including the adhesive film.

公开(公告)号：US20180362762A1

公开(公告)日：2018-12-20

申请号：US15736887

申请日：2017-03-29

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Long XI ,  Jiang LI ,  Yongjing XU

IPC: C08L79/06 ,  C08L63/00 ,  C08J5/24 ,  H05K1/03 ,  H05K3/46

Abstract: The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention greatly promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and can achieve a low coefficient of thermal expansion.

公开(公告)号：US10149380B2

公开(公告)日：2018-12-04

申请号：US14647672

申请日：2013-01-21

Applicant: Shengyi Technology Co., Ltd.

Inventor： Guangbing Chen ,  Xianping Zeng

IPC: H05K1/03 ,  C08J5/24 ,  C08K5/5425 ,  C08K5/549 ,  C08L71/12 ,  C08L83/04 ,  B32B15/14 ,  B32B15/20 ,  C08G65/48 ,  C08K5/3417 ,  C08K5/53 ,  C08L71/00 ,  C08G77/20 ,  H05K3/02

Abstract: Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.

公开(公告)号：US20180037736A1

公开(公告)日：2018-02-08

申请号：US15555212

申请日：2015-09-18

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xianping ZENG ,  Guangbing CHEN ,  Chiji GUAN ,  Wenhua YANG

IPC: C08L71/12 ,  B32B15/085 ,  C08J5/24 ,  C08L25/10 ,  C08L47/00 ,  B32B27/08 ,  B32B15/20

CPC classification number: C08L71/126 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/08 ,  C08F279/02 ,  C08F290/062 ,  C08J5/24 ,  C08J2309/06 ,  C08J2325/10 ,  C08J2347/00 ,  C08J2371/02 ,  C08J2371/12 ,  C08J2409/00 ,  C08J2409/06 ,  C08J2425/10 ,  C08J2447/00 ,  C08J2471/02 ,  C08L9/06 ,  C08L25/10 ,  C08L47/00 ,  C08L51/08 ,  C08L71/12 ,  C08L2201/02 ,  C08K5/14 ,  C08K3/36 ,  C08K5/3415 ,  C08F220/40

Abstract: The present invention relates to the technical field of copper clad laminates and relates to a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of vinyl thermosetting polyphenylene ether and a bifunctional maleimide or a multifunctional maleimide; and, (B) a polyolefin resin. The present invention, by employing the prepolymer of vinyl thermosetting polyphenylene ether and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the vinyl thermosetting polyphenylene ether and the polyolefin resin. An aqueous glue solution so mixed is uniform and consistent, the prepreg has a uniform expression, and a substrate resin area is free of a phase-separation problem. In addition, the maleimide employed is either the bifunctional maleimide or the multifunctional maleimide, relative to a monofunctional maleimide, a substrate so prepared is provided with increased heat resistance, a reduced thermal expansion coefficient, extended thermal stratification time, and increased thermal decomposition temperature.

公开(公告)号：US20180016387A1

公开(公告)日：2018-01-18

申请号：US15305759

申请日：2016-03-29

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Haosheng Xu ,  Xianping Zeng ,  Liexiang He

IPC: C08G59/26 ,  C08K7/18 ,  C08G59/68 ,  C08G59/42 ,  C08K3/36 ,  C08K5/00 ,  C08L63/00 ,  H05K1/03 ,  C08J5/24

Abstract: The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.

公开(公告)号：US20170354032A1

公开(公告)日：2017-12-07

申请号：US15539291

申请日：2015-07-06

Applicant: Shengyi Technology Co., Ltd.

Inventor： Xiaosheng SU ,  Suwen YE ,  Guofang TANG

IPC: H05K1/03 ,  B32B27/20 ,  B32B15/082 ,  B32B27/04 ,  C08J3/09

CPC classification number: B32B27/283 ,  B32B15/08 ,  B32B15/082 ,  B32B15/20 ,  B32B27/04 ,  B32B27/20 ,  B32B2307/3065 ,  B32B2457/08 ,  C08J3/09 ,  C09J183/04 ,  H05K1/03 ,  H05K1/0353

Abstract: Provided are a halogen-free phosphorus-free silicon resin composition, and prepreg and laminated board using the same, and printed circuit board, the silicon resin composition comprising the following components in parts by solid weight: 50-90 parts of an organic silicon resin, 20-80 parts of a vinyl-terminated silicon oil, 0.1-5 parts of a viscosity enhancing agent, 0-60 parts of a filler, 0.0001-0.5 parts of a catalyst, and 0.00001-0.1 parts of an inhibitor, a mole ratio between Si—H in a cross-linking agent and Si-Vi in the organic silicon resin being 1.0-1.7. The resin body of the resin composition is a thermosetting silicon resin, and the laminated board prepared thereby has good heat and flame resistance and an extremely low dielectric constant (Dk) and dielectric loss (Df).