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公开(公告)号：US20170009074A1
公开(公告)日：2017-01-12
申请号：US15120549
申请日：2015-02-11
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Long Xi , Yueshan He , Biwu Wang
Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.
Abstract translation: 本发明涉及一种无机阻燃树脂组合物，其基于有机固体的重量份，包含（A）1至10重量份的双马来酰亚胺树脂，（B）30至60重量份的 苯并恶嗪树脂，（C）10〜40重量份聚环氧化合物，（D）5〜25重量份含磷阻燃剂，（E）1〜25重量份固化剂， 是胺固化剂和/或酚醛树脂固化剂。 本发明还提供了由所述树脂组合物制备的用于印刷电路的预浸料，层压材料，层压材料。
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公开(公告)号：US11180617B2
公开(公告)日：2021-11-23
申请号：US15737661
申请日：2017-05-15
Applicant: Shengyi Technology Co., Ltd.
Abstract: The present invention relates to a method for preparing a benzoxazine-containing resin composition and a prepreg and a laminate made therefrom. The method for preparing a benzoxazine-containing resin composition is adding an acidic filler to a benzoxazine-containing resin composition. By adding an acidic filler to the benzoxazine-containing resin composition, the present invention promotes greatly the polymerization reaction of benzoxazine and epoxy resin, reduces the curing temperature required for polymerization of benzoxazine and epoxy resin. The laminate prepared from the benzoxazine-containing resin composition, to which an acidic filler is added, has high anti-stripping stability, high glass transition temperature, low water absorption, high heat resistance, high bending strength and good processability, and can achieve low coefficient of thermal expansion.
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公开(公告)号：US10696844B2
公开(公告)日：2020-06-30
申请号：US15120549
申请日：2015-02-11
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Long Xi , Yueshan He , Biwu Wang
IPC: B32B27/38 , B32B27/20 , B32B27/42 , B32B15/08 , B32B27/28 , C08L79/04 , C08L63/00 , C08J5/24 , H05K1/03 , C08K5/5399 , C08K5/521 , B32B27/16 , C08L79/08 , C08K5/3445 , C08K3/36 , C08L61/06 , C08L61/34 , C08K3/22 , B32B15/092 , B32B27/18
Abstract: The present invention relates to a halogen-free flame-retardant resin composition, based on the weight parts of organic solids, comprising (A) from 1 to 10 parts by weight of bismaleimide resin, (B) from 30 to 60 parts by weight of benzoxazine resin, (C) from 10 to 40 parts by weight of polyepoxy compound, (D) from 5 to 25 parts by weight of phosphorous-containing flame retardant, and (E) from 1 to 25 parts by weight of curing agent, which is amine curing agent and/or phenolic resin curing agent. The present invention further provides prepregs, laminates, laminates for printed circuits prepared from said resin composition.
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公开(公告)号：US10513608B2
公开(公告)日：2019-12-24
申请号：US15736887
申请日：2017-03-29
Applicant: SHENGYI TECHNOLOGY CO., LTD.
Inventor： Long Xi , Jiang Li , Yongjing Xu
Abstract: The present invention relates to a process for preparing a resin composition comprising benzoxazine, a prepreg and a laminate prepared therefrom. Said resin composition comprising benzoxazine is prepared by adding an acidic filler into the resin composition comprising benzoxazine, wherein said resin composition comprising benzoxazine comprises a benzoxazine resin, an epoxy resin A1 having an epoxy equivalent of 150-450, and an epoxy resin A2 having an epoxy equivalent of 451-1000. By adding an acidic filler into the resin composition, the present invention promotes the polymerization of benzoxazine and epoxy resins, and decreases the curing temperature needed for the polymerization of benzoxazine and epoxy resins. The laminates prepared from the resin composition added with an acidic filler have a high anti-stripping stability, a high glass transition temperature, a low water absorption, a high heat resistance, a high bending strength and a better processability, and achieves a low coefficient of thermal expansion.
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