Abstract:
The present invention relates to a slot die coating apparatus. A slot die coating apparatus according to an embodiment of the present invention includes: a slot die configured to perform a coating process by applying ink to a substrate; an image capturing unit disposed adjacent to the slot die and configured to capture a state of the slot die and a state of ink applied to the substrate during the coating process; and a control unit configured to compare an image captured by the image capturing unit with a reference image and control an operation of the slot die and a transfer of the substrate.
Abstract:
The present invention relates to melter for processing substantially solid, free-flowing adhesive particulate and supplying liquid adhesive. The melter has a tank for receiving adhesive, a heating device coupled with said tank for heating and liquefying adhesive particles, at least one pump for conveying the liquid adhesive, and a filling device for filling the tank with the substantially solid, free-flowing adhesive particulate. The filling device is arranged such that adhesive particulate can be fed into the tank through an inlet opening of said tank. The invention also relates to a filling device for filling a tank of an adhesive melter with substantially solid, free-flowing adhesive particles.
Abstract:
An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.
Abstract:
A temperature manipulated viscosity control module for stabilizing fluid viscosity in dispensing applications at (or near) the point-of-application. Connected to a central heating/cooling supply unit, the module both senses temperature and viscosity (and, in the case of waterborne materials, pH as well) and regulates the viscosity of the fluid being dispensed by manipulating the temperature of that fluid. This configuration is a combination of technologies applied together to maintain consistent temperature of the fluid and the sensors to assure that process conditions are consistent for measurement, control, and application.
Abstract:
An applicator (102) for delivering a glutinous substance (168) to a workpiece (170) from an end-effector (101) is disclosed. The applicator (102) comprises a body (110) and a plunger (186). The plunger (186) comprises a gate (118), movable within an outlet portion (182) of a first channel (115) of the body (110) between, inclusively, an open position, allowing the glutinous substance (168) to flow from an inlet (116) of the first channel (115) to an outlet (117) of the first channel (115) and a closed position, preventing the glutinous substance (168) from flowing from the inlet (116) of the first channel (115) to the outlet (117) of the first channel (115). The applicator (102) further comprises an actuator (131), selectively operable to move the plunger (186) such that the gate (118) moves between, inclusively, the open position and the closed position.
Abstract:
An adhesive dispensing system is configured to automatically reduce the temperature of adhesive material to reduce degradation of the adhesive caused by holding the adhesive at an application temperature during periods of low throughput. To this end, a controller of the system operates a heater unit to maintain a unit set point temperature to heat and melt adhesive until a set threshold time has elapsed since the most recent supply of adhesive to the system by a fill system. Once the time elapsed since the most recent supply of adhesive exceeds the set threshold time, the heater unit is reduced in temperature to reduce the temperature of adhesive. This reduction is temperature is large enough to minimize degradation and outgassing but small enough to enable rapid warm-up times after a new supply of adhesive occurs.
Abstract:
The substrate coating device (10) includes a slit nozzle (1), a first camera (3), a second camera (4), a control section (5), a pump (8), and a pressure control chamber (9). The control section (5) controls the supply of the coating liquid from the pump (8) to the slit nozzle (1) in accordance with the result of comparison between a bead shape imaged by the first camera (3) and a reference shape. The control section (5) also controls the air pressure on the upstream side of the slit nozzle (1) by the pressure control chamber (9) in accordance with the result of comparison between a distance measured from an image taken by the second camera (4) and a reference distance.
Abstract:
A hot glue application system includes a melter and components attached to the melter. The components comprise at least one heatable feed hose, and at least one heatable application valve. The components comprise a data storage medium which is configured to be machine-readable which comprises on at least one of data transmitted for a component-specific control parameter, during an initialization, cyclically, and when a change is made in a system configuration.
Abstract:
In a coating apparatus 100 provided by the present invention an electrode material paste 12 is coated onto an elongated collector 10, to form thereby a coating film 14 of predetermined width in the longitudinal direction of the collector. The coating apparatus 100 includes: a discharge nozzle 20 that discharges the paste 12 onto the collector 10, Which is an object to be coated; a transport pipe 30 that transports the paste 12 up to the discharge nozzle 20; a viscosity measurement unit 40 that measures the viscosity of the paste 12 that is transported within the transport pipe 30; and a gap control unit 50 that modifies a size H of the clearance between the discharge nozzle 20 and the collector 10 on the basis of the viscosity measured by the viscosity measurement unit 40.
Abstract:
A method of sensing defects in the application of hot melt adhesive to a structure. An infrared sensor is used to capture an infrared image of at least the location of the structure where the adhesive is supposed to have been applied. Different areas of the image are separately interrogated by reviewing each area to detect the presence or absence of adhesive. The interrogation is used to determine whether or not the application of the adhesive is of acceptable quality.