公开(公告)号：US06171972B2

公开(公告)日：2001-01-09

申请号：US09191966

申请日：1998-11-13

Applicant: Mehran Mehregany ,  Christopher A. Bang ,  Kevin C. Stark

Inventor： Mehran Mehregany ,  Christopher A. Bang ,  Kevin C. Stark

IPC: H01L2100

CPC classification number: B05B1/3436 ,  B81B2201/051 ,  B81C1/00531

Abstract: A method for forming micromachined devices out of a polycrystalline silicon substrate using deep reactive ion etching to form the micromachined device. The method comprises the steps of providing a bulk material substrate of polycrystalline silicon, and etching the bulk material using deep reactive ion etching to form the micromachined device. The present invention also includes a method for forming a micromachined device comprising the steps of providing a first layer of single crystal silicon and etching a first set of elements on the first layer. The method further includes the steps of providing a second layer of single crystal silicon, etching a second set of elements on the second layer, and joining the first and second layers together such that the crystal planes of the first layer and the second layer are misaligned and such that the first set and the second set of elements are properly aligned.

Abstract translation: 使用深反应离子蚀刻从多晶硅衬底形成微加工器件以形成微机械加工器件的方法。 该方法包括以下步骤：提供多晶硅的散装材料基板，并使用深反应离子蚀刻来蚀刻散装材料以形成微机械加工装置。 本发明还包括一种用于形成微加工装置的方法，包括以下步骤：提供第一层单晶硅并蚀刻第一层上的第一组元件。 该方法还包括以下步骤：提供第二层单晶硅，蚀刻第二层上的第二组元件，以及将第一和第二层接合在一起，使得第一层和第二层的晶面失配 并且使得第一组和第二组元件被适当对准。

公开(公告)号：US11760625B2

公开(公告)日：2023-09-19

申请号：US16613269

申请日：2018-05-23

Applicant: Heriot-Watt University

Inventor： Maiwenn Kersaudy-Kerhoas ,  Antonio Liga

IPC: B81B5/00 ,  F16K99/00 ,  G01N35/10 ,  G05D7/06

CPC classification number: B81B5/00 ,  F16K99/0001 ,  G01N35/1072 ,  G05D7/0694 ,  B81B2201/051 ,  B81B2207/99

Abstract: A microfluidic device (100) for mixing a liquid L is provided. The microfluidic device (100) comprises a microfluidic chamber (20), having an inlet (30), and arranged to receive the liquid L therein. In use, the microfluidic device (100) is arranged to control translation through the liquid L of a body B introduced therein, wherein the translation of the body B is due to a potential field acting on the body. In this way, the controlled translation of the body B mixes the liquid L in the microfluidic chamber (20).

公开(公告)号：US11686327B2

公开(公告)日：2023-06-27

申请号：US16493344

申请日：2017-04-07

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Erik D. Torniainen ,  Alexander Govyadinov ,  Pavel Kornilovich ,  David P. Markel

IPC: F04F7/00 ,  B01L3/00 ,  B81B1/00 ,  F04B53/10

CPC classification number: F04F7/00 ,  B01L3/50273 ,  B01L3/502738 ,  B81B1/006 ,  F04B53/10 ,  B01L2200/141 ,  B01L2200/16 ,  B01L2400/0605 ,  B81B2201/051 ,  B81B2203/0338

Abstract: The present disclosure is drawn to inertial pumps. An inertial pump can include a microfluidic channel, a fluid actuator located in the microfluidic channel, and a check valve located in the microfluidic channel. The check valve can include a moveable valve element, a narrowed channel segment located upstream of the moveable valve element, and a blocking element formed in the microfluidic channel downstream of the moveable valve element. The narrowed channel segment can have a width less than a width of the moveable valve element so that the moveable valve element can block fluid flow through the check valve when the moveable valve element is positioned in the narrowed channel segment. The blocking element can be configured such that the blocking element constrains the moveable valve element within the check valve while also allowing fluid flow when the moveable valve element is positioned against the blocking element.

公开(公告)号：US11673797B2

公开(公告)日：2023-06-13

申请号：US17192126

申请日：2021-03-04

Applicant: Shanghai Industrial μTechnology Research Institute

Inventor： Shinan Wang

IPC: B81C1/00 ,  B81B1/00 ,  G01L9/00

CPC classification number: B81C1/00047 ,  B81B1/002 ,  G01L9/0042 ,  B81B2201/0264 ,  B81B2201/051 ,  B81B2203/0315 ,  B81C2201/0143 ,  B81C2201/0146 ,  B81C2201/0181

Abstract: A microstructure and a method for manufacturing the same includes: disposing a liquid film on a surface of a substrate, wherein a solid-liquid interface is formed where the liquid film is in contact with the substrate; and irradiating the substrate with a laser of a predetermined waveband to etch the substrate at the solid-liquid interface, wherein the position where the laser is irradiated on the solid-liquid interface moves at least along a direction parallel to the surface of the substrate, and the absorption rate of the liquid film for the laser is greater than the absorption rate of the substrate for the laser.

公开(公告)号：US20180237325A1

公开(公告)日：2018-08-23

申请号：US15751693

申请日：2016-08-12

Applicant: Corning Incorporated

Inventor： Xinghua Li ,  Richard Curwood Peterson ,  Christopher Clark Thompson ,  Ezra Morgan Yarnell

IPC: C03B19/14 ,  C03B23/203 ,  C03C23/00 ,  C03B17/02 ,  B32B17/06

CPC classification number: C03B19/1453 ,  B32B17/06 ,  B33Y10/00 ,  B33Y70/00 ,  B81B2201/051 ,  B81C99/0025 ,  C03B17/02 ,  C03B19/1492 ,  C03B23/203 ,  C03B23/245 ,  C03C23/0025

Abstract: An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.

公开(公告)号：US09891189B2

公开(公告)日：2018-02-13

申请号：US15477982

申请日：2017-04-03

Applicant: International Business Machines Corporation

Inventor： Sebastian U. Engelmann ,  Stephen M. Rossnagel ,  Ying Zhang

IPC: G01N27/403 ,  G01N27/414 ,  B82B1/00 ,  B82B3/00 ,  G01N33/487

CPC classification number: G01N27/4146 ,  B01L3/502707 ,  B01L3/502761 ,  B01L2200/0663 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/0896 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/0181 ,  B82B1/005 ,  B82B3/008 ,  G01N27/4145 ,  G01N33/48721

Abstract: Techniques for fabricating horizontally aligned nanochannels are provided. In one aspect, a method of forming a device having nanochannels is provided. The method includes: providing a SOI wafer having a SOI layer on a buried insulator; forming at least one nanowire and pads in the SOI layer, wherein the nanowire is attached at opposite ends thereof to the pads, and wherein the nanowire is suspended over the buried insulator; forming a mask over the pads, the mask having a gap therein where the nanowire is exposed between the pads; forming an alternating series of metal layers and insulator layers alongside one another within the gap and surrounding the nanowire; and removing the nanowire to form at least one of the nanochannels in the alternating series of the metal layers and insulator layers. A device having nanochannels is also provided.

公开(公告)号：US20170370876A1

公开(公告)日：2017-12-28

申请号：US15477982

申请日：2017-04-03

Applicant: International Business Machines Corporation

Inventor： Sebastian U. Engelmann ,  Stephen M. Rossnagel ,  Ying Zhang

IPC: G01N27/414 ,  B82B1/00 ,  B82B3/00 ,  G01N33/487

CPC classification number: G01N27/4146 ,  B01L3/502707 ,  B01L3/502761 ,  B01L2200/0663 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/0896 ,  B81B2201/051 ,  B81C1/00119 ,  B81C2201/0181 ,  B82B1/005 ,  B82B3/008 ,  G01N27/4145 ,  G01N33/48721

Abstract: Techniques for fabricating horizontally aligned nanochannels are provided. In one aspect, a method of forming a device having nanochannels is provided. The method includes: providing a SOI wafer having a SOI layer on a buried insulator; forming at least one nanowire and pads in the SOI layer, wherein the nanowire is attached at opposite ends thereof to the pads, and wherein the nanowire is suspended over the buried insulator; forming a mask over the pads, the mask having a gap therein where the nanowire is exposed between the pads; forming an alternating series of metal layers and insulator layers alongside one another within the gap and surrounding the nanowire; and removing the nanowire to form at least one of the nanochannels in the alternating series of the metal layers and insulator layers. A device having nanochannels is also provided.

公开(公告)号：US09527724B2

公开(公告)日：2016-12-27

申请号：US13989897

申请日：2011-11-28

Applicant: Thierry Luc Alain Dannoux ,  Paulo Gaspar Jorge Marques ,  Ronan Tanguy

Inventor： Thierry Luc Alain Dannoux ,  Paulo Gaspar Jorge Marques ,  Ronan Tanguy

IPC: B81C1/00 ,  B01L3/00 ,  C03B23/24

CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0887 ,  B81B2201/051 ,  B81C1/00357 ,  B81C2203/036 ,  C03B23/245

Abstract: Embodiments of methods for sealing a glass microstructure assembly comprise providing one or more side retainer members on a base plate adjacent the glass microstructure assembly, the side retainer members having a height less than an uncompressed height defined by the glass microstructure assembly. The methods also comprise compressing the glass microstructure assembly via a load bearing top plate in intimate contact with the top glass layer while heating the glass microstructure assembly and the top plate to a glass sealing temperature, the glass sealing temperature being a temperature sufficient to make glass viscous, wherein the glass microstructure assembly is compressed until the load bearing top plate contacts the side retainer members, and wherein the lower surface of the top plate maintains adhesion to the upper surface of the top glass layer at the glass sealing temperature while the load bearing plate is supported by the side retainer members.

Abstract translation: 用于密封玻璃微结构组件的方法的实施例包括在邻近玻璃微结构组件的基板上提供一个或多个侧面保持器构件，侧面保持构件的高度小于由玻璃微结构组件限定的未压缩高度。 所述方法还包括通过与顶部玻璃层紧密接触的承载顶板压缩玻璃微结构组件，同时将玻璃微结构组件和顶板加热至玻璃密封温度，玻璃密封温度为足以制备玻璃的温度 粘性，其中玻璃微结构组件被压缩直到承载顶板接触侧保持器构件，并且其中顶板的下表面在玻璃密封温度下保持与顶部玻璃层的上表面的粘附，而承载 板由侧保持构件支撑。

公开(公告)号：US20160297098A1

公开(公告)日：2016-10-13

申请号：US15189792

申请日：2016-06-22

Applicant: THE AEROSPACE CORPORATION

Inventor： Henry Helvajian

IPC: B28B1/00 ,  G03F7/20 ,  B33Y80/00 ,  F16L55/00 ,  B33Y10/00

CPC classification number: B81C1/00341 ,  B01J19/0093 ,  B01J2219/00788 ,  B01J2219/00835 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0654 ,  B01L2300/0874 ,  B01L2300/12 ,  B01L2400/0439 ,  B01L2400/0478 ,  B01L2400/0633 ,  B28B1/001 ,  B33Y10/00 ,  B33Y80/00 ,  B81B2201/051 ,  B81B2203/0338 ,  B81C1/00634 ,  C06B21/00 ,  F16L55/00 ,  G03F7/70216 ,  Y10T29/49117

Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

公开(公告)号：US20160089672A1

公开(公告)日：2016-03-31

申请号：US14867402

申请日：2015-09-28

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： DEXTER A. CHISHOLM

IPC: B01L3/00 ,  G03F7/32 ,  G03F7/032 ,  G03F7/20

CPC classification number: B01L3/502707 ,  B01L2200/10 ,  B01L2200/16 ,  B01L2300/0864 ,  B01L2300/0887 ,  B01L2300/168 ,  B01L2400/049 ,  B01L2400/0493 ,  B81B2201/051 ,  B81C1/00119 ,  G03F7/0015 ,  G03F7/032 ,  G03F7/033 ,  G03F7/11 ,  G03F7/20 ,  G03F7/2022 ,  G03F7/2053 ,  G03F7/32

Abstract: A microfluidic device is formed from a cover member and a microfluidic precursor that is prepared from a photosensitive element. The photosensitive element is a solid layer of a photopolymerizable composition that includes at least a binder, a monomer, and a photoinitiator. A method for forming the microfluidic device from the photosensitive element includes imagewise exposing the photopolymerizable layer to actinic radiation through a mask and treating to form a relief surface having microstructures or features, such as one or more channels and one or more chambers, that are suitable for use in the microfluidic device. The method provides microstructures that can be formed to have different dimensions that provide particular advantages for a microfluidic device that is operated by degas-driven flow to transport a fluid through the microstructures.

Abstract translation: 微流体装置由覆盖构件和由感光元件制备的微流体前体形成。 感光元件是至少包括粘合剂，单体和光引发剂的可光聚合组合物的固体层。 用于从感光元件形成微流体装置的方法包括将可光聚合层成像曝光通过掩模的光化辐射，并进行处理以形成具有微结构或特征的浮雕表面，例如一个或多个通道和一个或多个室， 用于微流体装置。 该方法提供了可以形成为具有不同尺寸的微结构，其为通过脱气驱动的流动来操作以将流体输送通过微结构的微流体装置提供特别的优点。