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    Method for Electrochemical Fabrication
    141.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号：US20120234688A1

    公开(公告)日：2012-09-20

    申请号：US13441136

    申请日：2012-04-06

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02 ,  C25D5/48

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Methods for fabrication of three-dimensional structures
    147.
    发明授权
    Methods for fabrication of three-dimensional structures 有权
    制造三维结构的方法

    公开(公告)号：US07696102B2

    公开(公告)日：2010-04-13

    申请号：US11278137

    申请日：2006-03-30

    Applicant: Gang Zhang

    Inventor： Gang Zhang

    IPC: H01L21/461

    CPC classification number: B32B38/10 ,  B81C1/00119 ,  B81C2201/0109 ,  B81C2201/0197 ,  C23C28/322 ,  C23C28/325 ,  C23C28/345 ,  C25D1/003 ,  C25D5/022

    Abstract: A multi-layer fabrication method for making three-dimensional structures is provided. In one embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) fabricating a plurality of layers with each layer comprising at least two materials; 2) aligning the layers; 3) attaching the layers together to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure. Fabrication methods for making the required layers are also disclosed. In another embodiment, the formation of a multi-layer three-dimensional structure comprises: 1) attaching a layer of a material to a substrate or a previously formed layer; 2) machining the attached layer to form a layer that comprises at least two materials; and 3) repeating the operations of 1) and 2) a plurality of times to form a multi-layer structure; and 4) removing at least a portion of at least one of the materials from the multi-layer structure to form a desired three-dimensional structure.

    Abstract translation: 提供了一种用于制造三维结构的多层制造方法。 在一个实施例中，多层三维结构的形成包括：1）制造多层，每层包含至少两种材料; 2）对齐层; 3）将层连接在一起以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分。 还公开了制备所需层的制造方法。 在另一个实施方案中，多层三维结构的形成包括：1）将材料层附着到基底或预先形成的层上; 2）加工附着层以形成包含至少两种材料的层; 和3）重复操作1）和2）多次以形成多层结构; 以及4）从多层结构中去除至少一种材料的至少一部分以形成所需的三维结构。

    Mesoscale and microscale device fabrication methods using split structures and alignment elements
    148.
    发明授权
    Mesoscale and microscale device fabrication methods using split structures and alignment elements 失效
    使用分裂结构和对准元件的中尺度和微米器件制造方法

    公开(公告)号：US07611616B2

    公开(公告)日：2009-11-03

    申请号：US11506586

    申请日：2006-08-18

    Applicant: Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: C25D5/02

    CPC classification number: C25D1/003 ,  B33Y10/00 ,  B81B2201/042 ,  B81C1/00293 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/10 ,  C25D5/022 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647 ,  Y10T156/10

    Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

    Abstract translation: 本发明的各种实施例涉及使用电化学制造技术形成中尺度或微尺寸器件，其中结构由多个层形成为打开的结构，其可折叠或以其他方式组合以形成所需构造的结构。 每个层由至少一种结构材料和至少一种牺牲材料形成。 开放结构的初始形成可以促进牺牲材料的释放，形成较少层以完成结构的能力，将附加材料定位到结构中的能力，对结构打开时暴露的区域执行附加处理操作的能力和/ 或形成完全封装和可能中空结构的能力。

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