Abstract:
The invention relates to a method for producing micromechanical components or a micromechanical component. According to the invention, a moveable element (4) is produced on a sacrificial layer (2). The sacrificial layer (2) under the moveable element (4) is then removed, so that said moveable element (4) is able to move. After the sacrificial layer (2) has been removed, a protective layer (7) is deposited on a surface of the moveable element (4). Silicon oxide and/or silicon nitride are used for the protective layer (7).
Abstract:
Verfahren zum Herstellen eines mikromechanischen Bauelements (100), aufweisend die Schritte: - Ausbilden einer Zugangsöffnung (7) in einem MEMS-Element (5) oder in einem Kappenelement (6) des Bauelements (100); - Verbinden des MEMS-Elements (5) mit dem Kappenelement (6), wobei zwischen dem MEMS-Element (5) und dem Kappenelement (6) wenigstens eine Kaverne (8a, 8b) ausgebildet wird; und - Verschließen der Zugangsöffnung (7) zur wenigstens einen Kaverne (8a, 8b) unter einer definierten Atmosphäre mittels eines Lasers (9).
Abstract:
The present invention describes a deposition method suitable for depositing a coating on a device. The method is particularly suited for depositing a self assembled monolayer (SAM) coating on a micro electro-mechanical structures (MEMS). The method employs carrier gases in order to form a deposition vapour in a process chamber within which the device is located wherein the deposition vapour comprises controlled amounts of a vapour precursor material and a vapour reactant material. Employing the described technique avoids the problematic effects of particulate contamination of the device even when the volumetric ratio of the reactant material to the precursor material is significantly higher than those ratios previously employed in the art. The vapour precursor material can be of a type that provides the MEMS with an anti-stiction coating with the associated vapour reactant material comprising water.
Abstract:
Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact- sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process.
Abstract:
Method for coating micromechanical components of a micromechanical system, in particular a watch movement, comprising: - providing a substrate component to be coated; - providing said component with a diamond coating; wherein said diamond coating conductivity is increased in order to reduce dust attraction by the coated component when used in said micromechanical system. Corresponding microchemical components and systems are also provided.
Abstract:
Dispositif micromécanique et/ou nanomécanique (100) comportant un premier élément (108) à base de semi-conducteur, mobile par rapport à un second élément (106) du dispositif à base de semi-conducteur, le premier élément mobile étant susceptible de se déplacer en regard d'une cavité formée dans le dispositif, des parois du premier élément mobile disposées en regard d'une paroi du second élément et d'une paroi de la cavité à base de matériau semi-conducteur étant susceptibles d'entrer en contact avec lesdites parois du second élément et de la cavité, et lesdites parois du premier élément mobile, du second élément et de la cavité étant recouvertes au moins partiellement par un matériau anti-collage conducteur (118) de telle sorte que le matériau anti-collage conducteur recouvrant lesdites parois du second élément et de la cavité soit disposé au moins partiellement en regard du matériau anti-collage conducteur recouvrant lesdites parois du premier élément mobile.
Abstract:
A micromechanical device assembly includes a micromechanical device enclosed within a processing region and a lubricant channel formed through an interior wall of the processing region and in fluid communication with the processing region. Lubricant is injected into the lubricant channel via capillary forces and held therein via surface tension of the lubricant against the internal surfaces of the lubrication channel. The lubricant channel containing the lubricant provides a ready supply of fresh lubricant to prevent stiction from occurring between interacting components of the micromechanical device disposed within the processing region.
Abstract:
Embodiments of the present invention generally relate to a device that has an improved usable lifetime due to the presence of a lubricant that reduces the likelihood of stiction occurring between the various moving parts in an electromechanical device. Embodiments of the present invention also generally include a device, and a method of forming a device, that has one or more surfaces or regions that have a volume of lubricant disposed thereon that acts as a ready supply of "fresh" lubricant to prevent stiction occurring between interacting components found within the device. In one aspect, components within the volume of lubricant form a gas or vapor phase that reduces the chances of stiction-related failure in the formed device. In one example, aspects of this invention may be especially useful for fabricating and using micromechanical devices, such as MEMS devices, NEMS devices, or other similar thermal or fluidic devices.
Abstract:
Lubricants for lubricating surfaces of microelectromechanical devices (100) are disclosed. Specifically, the lubricants can be applied to the contacting surfaces of the microelectrochemical devices so as to remove stiction of the contacting surfaces.
Abstract:
Es wird ein Verfahren zur Abscheidung einer Anti-Haftungsschicht auf eine Oberfläche mikromechanischer Strukturen (5a; 7a) auf einem Substrat (Sub) vorgeschlagen, wobei das abzuscheidende Material oder Precursormaterial in einem Lösungs- und Transportmedium den Strukturen (5a; 7a) zugeführt wird. Als Lösungs- und Transportmedium ist das superkritische CO 2 -Fluid vorgesehen. Die Abscheidung des Materials oder Precursormaterials wird durch eine physikalische Zustandsänderung des CO 2 -Fluids oder durch eine Oberflächenreaktion zwischen der Oberfläche und dem Precursormaterial hervorgerufen. Das Verfahren ermöglicht eine nachträgliche Beschichtung der mikromechanischen Strukturen (5a; 7a) in einer Kaverne (14) oder in einem Hohlraum nach deren Verkappung, wobei das abzuscheidende Material über Zugangskanäle (15) oder Perforationslöcher zugeführt wird.