公开(公告)号：EP1976798A1

公开(公告)日：2008-10-08

申请号：EP07700249.1

申请日：2007-01-04

Applicant: Evonik Degussa GmbH

Inventor： HOFMANN, Ralph ,  STEIN, Günter ,  SCHAFFER, Roland ,  FRIEHMELT, Rainer ,  SCHACHTELY, Uwe

IPC: C01B33/12 ,  C09C1/30 ,  C08K3/36 ,  C09C3/04

CPC classification number: C09C1/3009 ,  C01B33/18 ,  C01P2004/50 ,  C01P2006/11 ,  C08K3/36 ,  C08K2201/002 ,  C09C1/3036 ,  C08L21/00

Abstract: Pyrogenically prepared silicon dioxide is compacted to give crusts, in that it is subject to preliminary de- aeration, and is compacted to give crusts, and the crusts are broken and, if appropriate, classified. The tamped bulk density (to DIN EN ISO 787-11) of the silicon dioxide compacted to give crusts is from 185 to 700 g/1. It can be used as filler in rubber mixtures.

公开(公告)号：EP1088849A2

公开(公告)日：2001-04-04

申请号：EP00120156.5

申请日：2000-09-21

Applicant: TIGERS POLYMER CORPORATION

Inventor： Matsumoto, Wataru, Tigers Polymer Corporation ,  Nakamura, Tetsuya, Tigers Polymer Corporation ,  Sawada, Koji, Tigers Polymer Corporation

IPC: C08K3/04 ,  C08L83/04

CPC classification number: C08K3/04 ,  C08K2201/002 ,  C08K2201/005 ,  C08K2201/006 ,  C08L83/04 ,  Y10T428/31663 ,  C08L2666/54

Abstract: A semi-conductive silicone rubber composition contains carbon black. The carbon black contains thermal black obtained by thermally cracking a natural gas and having a specific surface area - nitrogen absorption method of 8.0 to 10.0 m 2 /g, a dibutyl phthalate absorption number (dibutyl phthalate absorption number) of 30 to 40 cm 3 /100g and an averaged particle size of 200 to 330 nm.

Abstract translation: 半导电硅橡胶组合物含有炭黑。 炭黑含有通过热裂解天然气而获得的热裂炭黑，并且具有8.0-10.0m 2 / g的比表面积 - 氮吸收方法，30-40cm 3 / 100g的邻苯二甲酸二丁酯吸收值（邻苯二甲酸二丁酯吸收值）和 平均粒径为200〜330nm。

公开(公告)号：EP0745558A3

公开(公告)日：1997-06-04

申请号：EP96108371.4

申请日：1996-05-25

Applicant: Degussa Aktiengesellschaft

Inventor： Görl, Udo, Dr. ,  Hunsche, Andrea ,  Kuhlmann, Robert ,  Siray, Mustafa, Dr. ,  Esch, Heinz

IPC: C01B33/193 ,  C08K3/36 ,  C08L21/00 ,  C09C1/30

CPC classification number: C09C1/3081 ,  C01B33/193 ,  C01P2004/50 ,  C01P2004/51 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/16 ,  C01P2006/17 ,  C01P2006/19 ,  C01P2006/21 ,  C01P2006/82 ,  C01P2006/90 ,  C08K3/36 ,  C08K9/06 ,  C08K2201/002 ,  C08K2201/006 ,  C09C1/30 ,  C08L21/00

Abstract: Fällungskieselsäuren, dadurch gekennzeichnet, daß sie eine CTAB-Oberfläche (gemäß ASTM D 3765-92) von 200 bis 400 m 2 /g, eine DBP-Zahl (gemäß ASTM D 2414) zwischen 230 und 380 ml/100g als Pulver und 180 - 250 g/100 g als Granulat, eine Silanolgruppendichte (V 2 -Verbrauch an NaOH) von 20 bis 30 ml und eine für den jeweiligen Oberflächenbereich typische, mittels Hg-Porosimetrie (DIN 66 133) zu ermittelnde Makroporengrößenverteilung für bestimmte Porengrößenintervalle (inkrementelle Auftragungsweise) wie folgt aufweisen:
Oberflächenbereich CTAB: 200-250 m 2 /g Oberflächenbereich CTAB: 250-300 m 2 /g Oberflächenbereich CTAB: 300-400 m 2 /g Porengrößenintervall [nm] Hg-Verbrauch ml/g Kieselsäure 10 - 20 0,27 - 0,49 0,35 - 0,50 0,32 - 0,42 20 - 30 0,22 - 0,32 0,15 - 0,30 0,17 - 0,22 30 - 40 0,15 - 0,21 0,12 - 0,17 0,12 - 0,15 40 - 50 0,11 - 0,16 0,09 - 0,12 0,08 - 0,11 50 - 60 0,08 - 0,12 0,06 - 0,10 0,06 - 0,09

公开(公告)号：US12077658B2

公开(公告)日：2024-09-03

申请号：US16953481

申请日：2020-11-20

Applicant: Rogers Corporation

Inventor： William Blasius ,  Stephen O'Connor

IPC: C08L23/06 ,  C08K3/22 ,  C08K3/36 ,  H01Q15/08

CPC classification number: C08L23/06 ,  C08K3/22 ,  C08K3/36 ,  H01Q15/08 ,  C08K2003/2241 ,  C08K2201/002 ,  C08L2207/066 ,  C08L2312/06

Abstract: A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

公开(公告)号：US20240228778A1

公开(公告)日：2024-07-11

申请号：US18557329

申请日：2022-04-08

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Sohaib ELGIMIABI

IPC: C08L79/02 ,  C08K5/00 ,  C08K7/28 ,  C09D7/20 ,  C09D7/61 ,  C09D7/63 ,  C09D7/80 ,  C09D179/02

CPC classification number: C08L79/02 ,  C08K5/0025 ,  C08K7/28 ,  C09D7/20 ,  C09D7/61 ,  C09D7/63 ,  C09D7/80 ,  C09D179/02 ,  C08K2201/002 ,  C08L2312/04

Abstract: In one aspect of the present disclosure, there is provided a low-density curable composition precursor, comprising (a) a first part (A) comprising: (i) at least one polymeric diamine; (b) a second part (B) comprising: (i) at least one epoxy resin; (ii) at least one reactive diluent; (iii) at least one amide selected from polyamide waxes; wherein part (A) and/or part (B) comprise a low density filler material having a density of less than 0.3 g/cc; and wherein the curable composition obtained by combining part (A) and part (B) has a cured density according to DIN 53479A of less than 0.5 g/cc.

公开(公告)号：US20240150552A1

公开(公告)日：2024-05-09

申请号：US18280875

申请日：2022-01-17

Applicant: MITSUI CHEMICALS, INC.

Inventor： Hiroaki YOSHII

IPC: C08K9/06

CPC classification number: C08K9/06 ,  C08K2201/002 ,  C08K2201/009

Abstract: A resin composition including: 100 parts by mass of a thermoplastic resin (A) having a density, a MFR, and durometer A hardness falling within certain ranges; 10 to 100 parts by mass of a heat storage compound (B) having a flash point of 200° C. or higher; and 1.5 to 20 parts by mass of a porous inorganic compound (C) having an oil absorption of 4.0 g/g or more, in which the content of the heat storage compound (B) is less than 700 parts by mass based on the content of the porous inorganic compound (C) of 100 parts by mass.

公开(公告)号：US11939439B2

公开(公告)日：2024-03-26

申请号：US17536604

申请日：2021-11-29

Applicant: LG ELECTRONICS INC.

Inventor： Junseok Lee ,  Dongjoo You ,  Seongmoon Cho ,  Jinkyun Lee ,  Seungsoo Choi

IPC: C08J5/18 ,  C08K3/36 ,  C08K7/26

CPC classification number: C08J5/18 ,  C08K3/36 ,  C08K7/26 ,  C08J2327/18 ,  C08J2379/08 ,  C08K2201/002

Abstract: The present invention is applicable to a field of a substrate for a high-frequency circuit, and relates, for example, to a composite polyimide film, a producing method thereof, and a printed circuit board using the same. More specifically, the composite polyimide film includes a film matrix including polyimide; and a plurality of filler particles dispersed in the film matrix, wherein each of the filler particles includes an inorganic particle, and a fluorine polymer coating formed on the inorganic particle.

公开(公告)号：US11919273B2

公开(公告)日：2024-03-05

申请号：US17861309

申请日：2022-07-11

Applicant: Ticona LLC

Inventor： Junchen Ding ,  Yanjun Li ,  Rong Luo

IPC: B32B15/08 ,  B29C45/14 ,  B32B7/04 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  C08G59/06 ,  C08K7/14 ,  C08L33/06 ,  C08L81/04 ,  B29D99/00 ,  B29K81/00 ,  B29K705/02

CPC classification number: B32B15/08 ,  B29C45/14008 ,  B29C45/1418 ,  B32B7/04 ,  B32B15/082 ,  B32B15/085 ,  B32B15/088 ,  B32B15/09 ,  B32B15/092 ,  B32B15/095 ,  B32B15/18 ,  B32B15/20 ,  B32B27/06 ,  B32B27/18 ,  B32B27/20 ,  B32B27/24 ,  B32B27/281 ,  B32B27/285 ,  B32B27/286 ,  B32B27/288 ,  B32B27/302 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  C08G59/063 ,  C08K7/14 ,  C08L33/068 ,  C08L81/04 ,  B29D99/006 ,  B29K2081/04 ,  B29K2705/02 ,  B32B2250/02 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2262/108 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/3065 ,  B32B2307/4026 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2307/546 ,  B32B2307/558 ,  B32B2307/7145 ,  B32B2457/00 ,  B32B2457/16 ,  B32B2597/00 ,  C08G2120/00 ,  C08K2201/002 ,  C08L2203/20

Abstract: A composite structure comprising a resinous component that is adhered to a surface of a metal component is provided. The resinous component is formed from a polymer composition that comprises a polyarylene sulfide, inorganic fibers, and an impact modifier. The inorganic fibers have an aspect ratio of from about 1.5 to about 10.

公开(公告)号：US20230407053A1

公开(公告)日：2023-12-21

申请号：US18334315

申请日：2023-06-13

Applicant: Edward Showalter

Inventor： Edward Showalter

IPC: C08K11/00 ,  B29B7/00 ,  B29B7/82 ,  B29B7/88 ,  B29B9/12 ,  C08L23/06

CPC classification number: C08K11/005 ,  B29B7/005 ,  B29B7/82 ,  B29B7/885 ,  B29B9/12 ,  C08L23/06 ,  C08K2201/018 ,  C08K2201/002

Abstract: An earth plant-based compostable biodegradable composition for the formation of a bioplastic and method of producing said resin, the composition comprising: about 17.5 to 45% ethanol-based green polyethylene by weight, about 20 to 25% calcium carbonate by weight, about 2 to 12% hemp hurd or soy protein by weight, about 32 to 45% starch by weight, and about 0.5 to 1% biodegradation additive by weight to enable biodegradation and composting of the bioplastic; wherein the composition is produced by first mill grinding the ethanol-based green polyethylene, calcium carbonate, hemp hurd or soy protein, starch and the biodegradation additive into fine powders, then mechanically mixing the fine powders one by one into a final mixture for about 5-25 minutes at a time, dry and without heat, and then heating the final mixture to about 220 to 430 degrees Fahrenheit.

公开(公告)号：US20230399553A1

公开(公告)日：2023-12-14

申请号：US18238844

申请日：2023-08-28

Applicant: Henkel AG & Co. KGaA

Inventor： Andreas Niegemeier ,  Elke Robijns ,  Rime Ganfoud

IPC: C09J163/00 ,  C09J11/06 ,  C09J11/04 ,  C08G65/18 ,  C08G65/22 ,  C08K3/36 ,  C08G65/10

CPC classification number: C09J163/00 ,  C09J11/06 ,  C09J11/04 ,  C08G65/18 ,  C08G65/22 ,  C08K3/36 ,  C08G65/105 ,  C08K2201/002

Abstract: The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition:



from 1 to 10 wt. %, of a) at least one oxetane compound according to Formula (I) below:










wherein: R1, R2, R3, R5 and R6 are independently selected from H and C1-C6 alkyl;

R4 is —(CH2)mX;
m is 0 or 1;
X is C1-C6 alkyl, C1-C6 alkoxy, C1-C6 hydroxyalkyl, C6-C18 aryl, C6-C18 aryloxy, C7-C18 aralkyl, C7-C18 aralkoxy or is represented by the formula:














each R7 is independently a C1-C12 alkylene group, C2-C12 alkenylene group, C6-C18 arylene, C7-C18 alkarylene, C7-C18 aralkylene or a poly(C1-C6alkyleneoxy) group;
R8 is H, C1-C6 alkyl, C1-C6 hydroxyalkyl, C6-C18 aryl or C7-C18 aralkyl; and,
n is an integer of from 1 to 3;


from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide;
from 0.1 to 5 wt. % of c) at least one ionic photoacid generator;
from 0.1 to 5 wt. % of d) at least one free radical photoinitiator; and,
from 50 to 90 wt. % of e) particulate filler.