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    MOLECULAR COMPOSITES BASED ON HIGH-PERFORMANCE POLYMERS AND AN INTERPENETRATING LIQUID CRYSTAL THERMOSET
    143.
    发明申请
    MOLECULAR COMPOSITES BASED ON HIGH-PERFORMANCE POLYMERS AND AN INTERPENETRATING LIQUID CRYSTAL THERMOSET 有权
    基于高性能聚合物的分子复合材料和液相液晶热敏电阻

    公开(公告)号：US20160068680A1

    公开(公告)日：2016-03-10

    申请号：US14785170

    申请日：2014-04-16

    Applicant: ALLOTROPICA TECHNOLOGIES INC.

    Inventor： Theodorus Jacobus DINGEMANS

    IPC: C08L81/06 ,  C08L79/08 ,  C08L61/16 ,  C09K19/38

    CPC classification number: C08L81/06 ,  C08L61/16 ,  C08L79/08 ,  C08L2201/02 ,  C08L2207/04 ,  C09K19/3087 ,  C09K19/322 ,  C09K19/3809 ,  C09K19/3814 ,  C09K19/3823 ,  C09K2019/0448 ,  C09K2019/546

    Abstract: The invention is directed to a polymeric composition comprising a first polymer (in particular HPP) and a liquid crystal thermoset (LCT) network that interpenetrates said first polymer, which LCT network comprises LCT oligomers that are at least partly polymerized, as well as to a method for preparing such. The polymeric composition of the invention does not separate into two distinct polymer phases (first polymer and LCT) over time and has improved thermo-mechanical properties. In particular, the invention may be used to improve the properties of HPP. The polymeric composition can be used as a high-resistant material, in particular having improved heat resistance.

    Abstract translation: 本发明涉及包含第一聚合物（特别是HPP）和互穿所述第一聚合物的液晶热固性（LCT）网络的聚合物组合物，该LCT网络包含至少部分聚合的LCT低聚物，以及至 制备方法。 本发明的聚合物组合物不随时间分离成两个不同的聚合物相（第一聚合物和LCT）并具有改善的热机械性能。 特别地，本发明可用于改善HPP的性质。 聚合物组合物可以用作耐高温材料，特别是具有改善的耐热性。

    Flame retardant fillers prepared from bridged polysilsesquioxanes
    145.
    发明授权
    Flame retardant fillers prepared from bridged polysilsesquioxanes 有权
    由桥连聚倍半硅氧烷制备的阻燃填料

    公开(公告)号：US09255185B2

    公开(公告)日：2016-02-09

    申请号：US13584017

    申请日：2012-08-13

    Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

    Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

    IPC: C08G77/60 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/24 ,  H05K1/03 ,  H05K3/46

    CPC classification number: C08K5/5403 ,  B32B27/20 ,  B32B27/38 ,  C08G77/045 ,  C08G77/24 ,  C08G77/30 ,  C08G77/48 ,  C08G77/52 ,  C08G77/80 ,  C08K5/5406 ,  C08L63/00 ,  C08L71/12 ,  C08L83/08 ,  C08L101/00 ,  C08L2201/02 ,  C08L2203/20 ,  C09D5/18 ,  C09D7/63 ,  C09D7/65 ,  H05K1/0298 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/11 ,  H05K3/4626 ,  H05K2201/012 ,  Y10T428/1352

    Abstract: A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler.

    Abstract translation: 桥接的聚倍半硅氧烷基阻燃填料对诸如使用热固性塑料或热塑性塑料的印刷电路板（PCB），连接器和其它制品制成的制品赋予阻燃性。 在示例性的合成方法中，桥连的聚倍半硅氧烷型阻燃填料是通过将具有两个或更多个连接到含有阻燃基团的有机桥连基团的三烷氧基甲硅烷基的单体（例如卤素原子， 次膦酸盐，膦酸盐，磷酸酯及其组合）。 通过（（（2,5-二溴-1,4-亚苯基）双（氧基））双（乙烷-2,1-二基）双（三甲氧基硅烷））和（（（2,5-二溴-1,4-亚苯基）双（氧基））双（三甲氧基硅烷）的溶胶 - 凝胶聚合形成的桥接聚倍半硅氧烷颗粒， 随后的溶胶 - 凝胶加工可用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包括桥连聚倍半硅氧烷基阻燃填料的介电材料彼此分离的导电平面。

    Flame retardant
    147.
    发明授权
    Flame retardant 有权
    不易燃的

    公开(公告)号：US09234137B2

    公开(公告)日：2016-01-12

    申请号：US13516464

    申请日：2010-12-15

    Applicant: Christoph Fleckenstein ,  Hartmut Denecke ,  Ingo Bellin ,  Olaf Kriha ,  Patrick Spies ,  Sabine Fuchs ,  Klemens Massonne ,  Klaus Hahn ,  Peter Deglmann ,  Maximilian Hofmann ,  Alois Kindler

    Inventor： Christoph Fleckenstein ,  Hartmut Denecke ,  Ingo Bellin ,  Olaf Kriha ,  Patrick Spies ,  Sabine Fuchs ,  Klemens Massonne ,  Klaus Hahn ,  Peter Deglmann ,  Maximilian Hofmann ,  Alois Kindler

    IPC: C08J9/16 ,  C08K5/1535 ,  C09K21/12 ,  C08J9/00 ,  C08J9/14 ,  C08J9/20 ,  C08K5/49 ,  C08K5/53 ,  C08K5/523 ,  C08K5/5313 ,  C08K5/5377 ,  C08K5/5398

    CPC classification number: C09K21/12 ,  C08J9/0038 ,  C08J9/14 ,  C08J9/20 ,  C08J2325/04 ,  C08K5/49 ,  C08K5/523 ,  C08K5/53 ,  C08K5/5313 ,  C08K5/5377 ,  C08K5/5398 ,  C08L2201/02 ,  C08L2203/14 ,  C08L25/00 ,  C08L25/06

    Abstract: Use of a phosphorus compound of the formula (I) as flame retardant, where the definitions of the symbols in the formula (I) are as follows: A is one of the following groups: Y is —P(═X2)SR3R4, H, a straight-chain or branched C1-C12-alkyl group, C5-C6-cycloalkyl, C6-C12-aryl, or benzyl, where the four last-mentioned groups are unsubstituted or have substitution by one or more radicals from the group of C1-C4-alkyl or C1-C4-alkenyl; R1, R2, R3, and R4 are identical or different and are hydrogen, OH, C1-C16-alkyl, C1-C16-alkenyl, C1-C16-alkoxy, C1-C16-alkenoxy, C3-C10-cycloalkyl, C3-C10-cycloalkoxy, C6-C10-aryl, C6-C10-aryloxy, C6-C10-aryl-C1-C16-alkyl, C6-C10-aryl-C1-C16-alkoxy, SR9 COR10, COOR11, CONR12R13 or two radicals R1, R2, R3, or R4 form, together with the phosphorus atom to which they are bonded, or the P—O-A-O—P group, a ring system; R5, R6, R7, and R8 are identical or different and are H, C1-C16-alkyl, C1-C16-alkenyl, C1-C16-alkoxy, C1-C16-alkenoxy; R9, R10, R11, R12, R13 are identical or different and are H, C1-C16-alkyl, C1-C16-alkenyl, C6-C10-aryl, C6-C10-aryl-C1-C16-alkyl, C6-C10-aryl-C1-C16-alkoxy; X1 and X2 are identical or different and are S or O; r and s are identical or different and are 0 or 1; X3, X4, X5, and X6 are identical or different and are S or O, and n is a natural number from 1 to 50.

    Abstract translation: 式（I）的磷化合物作为阻燃剂的用途，其中式（I）中的符号的定义如下：A是以下基团之一：Y是-P（= X 2）SR 3 R 4，H 直链或支链C 1 -C 12 - 烷基，C 5 -C 6 - 环烷基，C 6 -C 12 - 芳基或苄基，其中四个最后提到的基团是未取代的或具有一个或多个自由基 C 1 -C 4 - 烷基或C 1 -C 4 - 烯基; R1，R2，R3和R4相同或不同，为氢，OH，C1-C16 - 烷基，C1-C16 - 烯基，C1-C16 - 烷氧基，C1-C16 - 烯氧基，C3-C10-环烷基，C3- C 1 -C 10 - 芳基，C 6 -C 10 - 芳氧基，C 6 -C 10 - 芳基-C 1 -C 16 - 烷基，C 6 -C 10 - 芳基-C 1 -C 16 - 烷氧基，SR 9 COR 10，COOR 11，CONR 12 R 13或两个基团R 1 R 2，R 3或R 4与它们所键合的磷原子一起形成，或与P-OAO-P基团形成环系; R 5，R 6，R 7和R 8相同或不同，为H，C 1 -C 16 - 烷基，C 1 -C 16 - 烯基，C 1 -C 16 - 烷氧基，C 1 -C 16 - 烯氧基; R9，R10，R11，R12，R13相同或不同，为H，C1-C16 - 烷基，C1-C16 - 烯基，C6-C10-芳基，C6-C10-芳基-C1-C16 - 烷基，C6-C10 芳基-C 1 -C 16 - 烷氧基; X1和X2相同或不同，为S或O; r和s相同或不同，为0或1; X3，X4，X5和X6相同或不同，为S或O，n为1〜50的自然数。

    INSULATED WIRE
    148.
    发明申请
    INSULATED WIRE 审中-公开
    绝缘线

    公开(公告)号：US20150371735A1

    公开(公告)日：2015-12-24

    申请号：US14732687

    申请日：2015-06-06

    Applicant: Hitachi Metals, Ltd.

    Inventor： Makoto IWASAKI ,  Hiroshi OKIKAWA ,  Mitsuru HASHIMOTO ,  Kenichiro FUJIMOTO

    IPC: H01B7/29 ,  H01B1/02 ,  H01B7/02 ,  C08L23/08

    CPC classification number: H01B7/29 ,  C08K3/34 ,  C08L23/08 ,  C08L23/0853 ,  C08L23/16 ,  C08L2201/02 ,  C08L2203/202 ,  C08L2205/025 ,  C08L2205/035 ,  H01B1/02 ,  Y10T428/2927 ,  Y10T428/2947

    Abstract: An insulated wire includes a conductor, and an insulating cover layer including an inner layer on an outer periphery of the conductor and an outer layer on an outer periphery of the inner layer. The inner layer includes a halogen-free resin composition including base polymer (A), which includes a first ethylene-α-olefin copolymer (a1) and a second ethylene-α-olefin copolymer (a2) at a ratio of 50:50 to 90:10, the first ethylene-α-olefin copolymer (a1) having a density of not less than 0.864 g/cm3 and not more than 0.890 g/cm3, a melting point of not more than 90° C. and a melt flow rate of not less than 1 g/10 min and not more than 5 g/10 min, and the second ethylene-α-olefin copolymer (a2) having a melting point of not less than 55° C. and not more than 80° C. and a melt flow rate of not less than 30 g/10 min.

    Abstract translation: 绝缘电线包括导体和绝缘覆盖层，绝缘覆盖层包括在导体的外周上的内层和内层的外周上的外层。 内层包括含有基础聚合物（A）的无卤素树脂组合物，其包含第一乙烯-α-烯烃共聚物（a1）和第二乙烯-α-烯烃共聚物（a2），比例为50:50至 90:10，密度为0.864g / cm 3以上且0.890g / cm 3以下，熔点为90℃以下的第一乙烯-α-烯烃共聚物（a1）和熔体流动 速度不小于1g / 10min且不超过5g / 10min，第二乙烯-α-烯烃共聚物（a2）的熔点不低于55℃且不大于80℃ 熔体流动速率不小于30g / 10min。

    A Polyamide Resin and Its Application and Polyamide Composition Thereof
    149.
    发明申请
    A Polyamide Resin and Its Application and Polyamide Composition Thereof 审中-公开
    聚酰胺树脂及其应用及其聚酰胺组成

    公开(公告)号：US20150361217A1

    公开(公告)日：2015-12-17

    申请号：US14760664

    申请日：2014-01-10

    Applicant: (KINGFA SCI. & TECH.CO., LTD.) ,  (ZHUHAI WANGO CHEMICAL CO., LTD.)

    Inventor： Chuanhui ZHANG ,  Tongmin CAI ,  Xiangbin ZENG ,  Min CAO ,  Shiyong XIA ,  Nanbiao YE ,  Dahua CHEN ,  Shaoyan YUAN

    IPC: C08G69/36 ,  C08L77/06 ,  C08G69/26

    CPC classification number: C08G69/36 ,  C08G69/265 ,  C08L77/06 ,  C08L2201/02 ,  C08L2201/08

    Abstract: The present invention discloses a polyamide resin and its application and polyamide composition thereof. The repeating units of the described polyamide resin comprises the following components: dicarboxylic acid units composed 80-100 mol % of polyamide resin; aliphatic diamines units having 2-14 carbon atoms composed 80-100 mol % of polyamide resin; lactam or amino acid units having 6-14 carbon atoms composed 0-20 mol % of polyamide resin; in the described polyamide resin, the bio-based carbon concentration is more than 45%; the described bio-based carbon mole concentration is calculated according to the formula below: bio-based carbon concentration=(bio-based carbon mole content/total organic carbon mole content)*100%. The described polyamide resin in the present invention has low gas volatile, hence the polyamide composition produced thereof has low gas volatile too, and can be applied to food-contact field. In addition, the surface condition after reflow soldering of the polyamide composition produced is good.

    Abstract translation: 本发明公开了一种聚酰胺树脂及其应用及其聚酰胺组合物。 所述聚酰胺树脂的重复单元包括以下组分：由聚酰胺树脂组成的80-100摩尔％的二羧酸单元; 具有2〜14个碳原子的脂肪族二胺单元构成聚酰胺树脂80-100摩尔％ 具有6-14个碳原子的内酰胺或氨基酸单元，占聚酰胺树脂的0-20摩尔％; 在所述聚酰胺树脂中，生物基碳浓度大于45％; 所述生物基碳摩尔浓度根据以下公式计算：生物基碳浓度=（生物基碳摩尔含量/总有机碳摩尔含量）* 100％。 本发明所述的聚酰胺树脂挥发性低，因此其制造的聚酰胺组合物的挥发性也低，可应用于食品接触场。 此外，制造的聚酰胺组合物的回流焊接后的表面状态良好。

    THERMOPLASTIC COMPOSITION
    150.
    发明申请
    THERMOPLASTIC COMPOSITION 审中-公开
    热塑性组合物

    公开(公告)号：US20150337132A1

    公开(公告)日：2015-11-26

    申请号：US14652381

    申请日：2013-12-19

    Applicant: DSM IP ASSETS B.V.

    Inventor： Frank Peter Theodorus Johannes VAN DER BURGT

    IPC: C08L77/06 ,  C08L77/02

    CPC classification number: C08L77/06 ,  C08K3/22 ,  C08L77/02 ,  C08L2201/02 ,  C08L2205/025 ,  C08L2205/06

    Abstract: The invention relates to a thermoplastic composition capable of being plated after being activated using a laser, with improved mechanical properties the composition comprising: a) from 30 to 60 wt. % of a thermoplastic base resin; b) from 1.0 to 8.0 wt. % of a laser direct structuring additive; c) from 5 to 40 wt. % of aluminum oxide, boron nitride, or a combination thereof, d) from 5 to 25 w % of a flame retardant and e) from 5 to 30 wt. % of glass fibers.

    Abstract translation: 本发明涉及一种热塑性组合物，其能够在使用激光活化后进行镀覆，具有改进的机械性能，该组合物包含：a）30至60wt。 ％的热塑性基础树脂; b）1.0〜8.0重量％ ％的激光直接结构化添加剂; c）5至40wt。 ％的氧化铝，氮化硼或其组合，d）5〜25重量％的阻燃剂，e）5〜30重量％。 ％的玻璃纤维。

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