公开(公告)号：WO2012037444A2

公开(公告)日：2012-03-22

申请号：PCT/US2011/051899

申请日：2011-09-16

Applicant: CASCADE MICROTECH, INC. ,  STRID, Eric, W.

Inventor： STRID, Eric, W.

IPC: H04W88/06

CPC classification number: H04B5/0031 ,  H02J5/005 ,  H02J50/05 ,  H02J50/12 ,  H02J50/90 ,  H04B5/0037

Abstract: Systems and methods for non-contact and/or wireless transmission of power and/or data between and/or within electronic devices. These systems and methods may include the use of two or more wireless power modules to transmit a wireless power signal between a first electronic device and a second electronic device and/or the use of two or more wireless data modules to transmit a wireless data signal between the first electronic device and the second electronic device. The wireless power modules and/or the wireless data modules may include one or more near-field coupling devices. The wireless power modules and/or wireless data modules associated with the first electronic device may be arranged in complementary locations to the wireless power modules and/or wireless data modules associated with the second electronic device and the complementary modules may be separated by a distance of less than 10 um.

Abstract translation: 用于电子设备之间和/或电子设备内的电力和/或数据的非接触和/或无线传输的系统和方法。 这些系统和方法可以包括使用两个或更多个无线电力模块来在第一电子设备和第二电子设备之间传输无线电力信号和/或使用两个或更多个无线数据模块来在 第一电子设备和第二电子设备。 无线电力模块和/或无线数据模块可以包括一个或多个近场耦合装置。 与第一电子设备相关联的无线电力模块和/或无线数据模块可以布置在与第二电子设备相关联的无线电力模块和/或无线数据模块的互补位置中，并且互补模块可以分开 小于10微米。

公开(公告)号：WO2011159390A1

公开(公告)日：2011-12-22

申请号：PCT/US2011/031964

申请日：2011-04-11

Applicant: CASCADE MICROTECH, INC. ,  SIMMONS, Michael, E. ,  NEGISHI, Kazuki ,  JENSEN, Roy ,  GARRISON, Ryan ,  WOLF, Philip

Inventor： SIMMONS, Michael, E. ,  NEGISHI, Kazuki ,  JENSEN, Roy ,  GARRISON, Ryan ,  WOLF, Philip

IPC: G01R31/26

CPC classification number: H01L21/6838 ,  G01R31/2601 ,  G01R31/2865 ,  G01R31/2874 ,  Y10T279/11 ,  Y10T279/34

Abstract: A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.

Abstract translation: 用于测试集成电路的卡盘包括具有适于支撑被测器件的下表面和上表面的上导电层。 上绝缘层具有与上导电层的下表面至少部分地面对面接触的上表面和下表面。 中间导电层具有至少与上绝缘层的下表面部分地面对面接触的上表面和下表面。

公开(公告)号：WO2011103461A1

公开(公告)日：2011-08-25

申请号：PCT/US2011/025476

申请日：2011-02-18

Applicant: CASCADE MICROTECH, INC. ,  NEGISHI, Kazuki ,  SIMMONS, Michael ,  STORM, Christofer ,  SWE, Toenaing

Inventor： NEGISHI, Kazuki ,  SIMMONS, Michael ,  STORM, Christofer ,  SWE, Toenaing

IPC: G01R31/20

CPC classification number: G01R31/2889 ,  H01R13/6597 ,  H01R24/562 ,  H01R2201/20

Abstract: An adapter conductively interconects a chuck of a probe station and an instrument. The adapter includes a signal conductor conductively connected to the chuck and selectively connectable to a respective one of a ground potential, a bayonet connector output and a signal connection for the instrument. A guard potential conductor conductively connected to the chuck and selectively connectable to a one of a ground potential and a guard connection for the instrument; and a shield conductor connected to a ground potential.

Abstract translation: 适配器导电地相互连接探针台和仪器的卡盘。 适配器包括导体连接到卡盘并且可选地可连接到地面电位，卡口连接器输出和仪器的信号连接中的相应一个的信号导体。 导电连接到卡盘并且可选择地连接到仪器的接地电位和保护连接中的一个的保护电位导体; 以及连接到地电位的屏蔽导体。

公开(公告)号：WO2010059247A2

公开(公告)日：2010-05-27

申请号：PCT/US2009/006250

申请日：2009-11-20

Applicant: CASCADE MICROTECH, INC. ,  SMITH, Kenneth, R.

Inventor： SMITH, Kenneth, R.

IPC: G01R31/02

CPC classification number: G01R31/2891 ,  B32B38/10 ,  G01R1/06711 ,  G01R1/06772 ,  G01R1/0735 ,  G01R35/00 ,  Y10T29/49126

Abstract: The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.

Abstract translation: 探测装置的触点弹性地支撑在可更换的试样上并与膜或空间变压器上的导体电互连。

公开(公告)号：WO2007145729A3

公开(公告)日：2008-05-02

申请号：PCT/US2007010802

申请日：2007-05-03

Applicant: CASCADE MICROTECH INC ,  STRID ERIC ,  CAMPBELL RICHARD

Inventor： STRID ERIC ,  CAMPBELL RICHARD

IPC: G01R31/02

CPC classification number: G01R31/2884

Abstract: A test structure for characterizing integrated circuits on a wafer includes a differential cell outputting a differential mode signal in response to a differential mode input signal. The probe pads of the test structure are arrayed linearly enabling placement of the test structure in a saw street between dies.

Abstract translation: 用于表征晶片上的集成电路的测试结构包括响应于差分模式输入信号而输出差分模式信号的差分单元。 测试结构的探针焊盘线性排列，可以将测试结构放置在管芯之间的锯道中。

公开(公告)号：WO2008011035A2

公开(公告)日：2008-01-24

申请号：PCT/US2007016220

申请日：2007-07-17

Applicant: CASCADE MICROTECH INC ,  HAYDEN LEONARD

Inventor： HAYDEN LEONARD

IPC: G01R35/00

CPC classification number: G01R27/32 ,  G01R35/005

Abstract: A method of compensating a calibration for a vector network analyzer includes performing calibrations on at least a pair of ports to determine error terms associated with each port wherein at least one of the error terms is based upon selecting the reactance of the load standard from a set of potential values in a manner such that the reference reactance errors are reduced.

Abstract translation: 补偿矢量网络分析仪的校准的方法包括在至少一对端口上执行校准以确定与每个端口相关联的误差项，其中至少一个误差项基于从一组中选择负载标准的电抗 的电位值，使得参考电抗误差减小。

公开(公告)号：WO2004102598A2

公开(公告)日：2004-11-25

申请号：PCT/US2004012338

申请日：2004-04-21

Applicant: CASCADE MICROTECH INC ,  DUNKLEE JOHN

Inventor： DUNKLEE JOHN

IPC: G01R31/02 ,  G01R31/26 ,  G01R31/28 ,  H01G20060101 ,  H01G

CPC classification number: G01R31/2886

Abstract: A probe assembly having a switch that selectively electrically connects, for example, either a Kelvin connection or a suspended guard element with the probe assembly.

Abstract translation: 探针组件，其具有选择性地电连接例如开尔文连接或悬挂的保护元件与探针组件的开关。

公开(公告)号：WO2004044949A3

公开(公告)日：2004-10-14

申请号：PCT/US0333842

申请日：2003-10-24

Applicant: CASCADE MICROTECH INC ,  LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E ,  SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L

Inventor： LESHER TIMOTHY ,  MILLER BRAD ,  COWAN CLARENCE E ,  SIMMONS MICHAEL ,  GRAY FRANK ,  MCDONALD CYNTHIA L

IPC: G01R1/18 ,  G01R31/28 ,  H01B7/18

CPC classification number: G01R1/18 ,  G01R19/0053 ,  G01R31/2886 ,  G01R31/2889 ,  H01B11/206

Abstract: A cable (30) includes an inner conductor (50), an inner dielectric (52), and a guard conductor (56), where the inner dielectric (52) is between the inner conductor (50) and the guard conductor (56). The cable also includes an outer dielectric (58), and a shield conductor (62), where the outer dielectric (58) is between the guard conductor (56) and the shield conductor (62). The cable further includes an additional layer of material between the outer dielectric and the shield conductor (30) of suitable composition for reducing triboelectric current generation between the outer dielectric (58) and the shield conductor (62) to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.

Abstract translation: 电缆（30）包括内部导体（50），内部电介质（52）和保护导体（56），其中内部电介质（52）在内部导体（50）和保护导体（56）之间， 。 电缆还包括外部电介质（58）和屏蔽导体（62），其中外部电介质（58）在保护导体（56）和屏蔽导体（62）之间。 电缆还包括在外部电介质和屏蔽导体（30）之间的适当组合物的附加材料层，用于减少外部电介质（58）和屏蔽导体（62）之间产生的摩擦电流，小于将发生的摩擦电流 外部电介质和屏蔽导体彼此直接相连。

公开(公告)号：WO2004055530A1

公开(公告)日：2004-07-01

申请号：PCT/US2003/034122

申请日：2003-10-27

Applicant: CASCADE MICROTECH, INC. ,  DUNKLEE, John ,  NORGDEN, Greg ,  COWAN, Clarence, E.

Inventor： DUNKLEE, John ,  NORGDEN, Greg ,  COWAN, Clarence, E.

IPC: G01R31/02

CPC classification number: G01R31/2862 ,  G01R1/18 ,  G01R31/2865 ,  G01R31/2886

Abstract: A probe station (110) with an improved guarding structure (130).

Abstract translation: 具有改进的防护结构（130）的探测台（110）。

公开(公告)号：US10180486B2

公开(公告)日：2019-01-15

申请号：US15072204

申请日：2016-03-16

Applicant: Cascade Microtech, Inc.

Inventor： Daniel M. Bock ,  Samantha Nhim ,  Lynh Thuy Bui

IPC: G01R35/00 ,  G01R1/067 ,  G01R31/28 ,  G01R31/319 ,  H01L21/66

Abstract: Test standards and methods for impedance calibration of a probe system and probe systems that include the test standards and/or utilize the methods are disclosed herein. The test standards include at least one test structure. In some embodiments, the test standard further includes an alignment structure that is associated with the test structure. In some embodiments, the test standards include a plurality of test structures. In some embodiments, the plurality of test structures includes a thin film thru test structure and a thin film offset test structure. In some embodiments, the plurality of test structures is positioned to simultaneously contact a plurality of probe regions of a probe head. The methods include methods of calibrating a probe system.