公开(公告)号：US09268096B1

公开(公告)日：2016-02-23

申请号：US14049053

申请日：2013-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  Timothy Creazzo ,  Elton Marchena ,  Kumar Satya Harinadh Potluri ,  Amit Mizrahi

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/26 ,  B23K1/00 ,  G02B6/14 ,  G02B6/122

CPC classification number: G02B6/30 ,  B23K1/0004 ,  G02B6/1228 ,  G02B6/14 ,  G02B6/305

Abstract: An optical system includes a substrate and a first waveguide embedded on the substrate. The first waveguide has a first end. The optical system also includes an optical fiber optically coupled to the first waveguide and bounded to the substrate. The optical fiber has a first end with a flat portion forming a D-shaped cross section. The flat portion of the first end of the optical fiber is disposed adjacent to the first end of the first waveguide, thereby facilitating optical coupling between the first waveguide and the optical fiber.

Abstract translation: 光学系统包括衬底和嵌入在衬底上的第一波导。 第一波导具有第一端。 光学系统还包括光学耦合到第一波导并且限定于衬底的光纤。 光纤具有形成D形横截面的平坦部分的第一端。 光纤的第一端的平坦部分邻近第一波导的第一端设置，从而有助于第一波导和光纤之间的光耦合。

公开(公告)号：US09268088B2

公开(公告)日：2016-02-23

申请号：US14755545

申请日：2015-06-30

Applicant: Skorpios Technologies, Inc.

Inventor： Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  Derek Van Orden ,  Stephen B. Krasulick

IPC: G02B6/26 ,  G02B6/42 ,  G02B6/122 ,  G02B6/28

CPC classification number: G02B6/4206 ,  G02B6/122 ,  G02B6/14 ,  G02B6/26 ,  G02B6/2804 ,  G02B2006/12097 ,  G02B2006/12147 ,  H01S5/026 ,  H01S5/3013

Abstract: A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction.

公开(公告)号：US09209142B1

公开(公告)日：2015-12-08

申请号：US14562169

申请日：2014-12-05

Applicant: Skorpios Technologies, Inc.

Inventor： Damien Lambert ,  John Spann ,  Stephen Krasulick

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/762 ,  H01L21/683 ,  H01L21/20

CPC classification number: H01L21/6835 ,  G02B6/4201 ,  H01L21/0274 ,  H01L21/2007 ,  H01L21/683 ,  H01L21/76254 ,  H01L24/03 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L24/89 ,  H01L24/94 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68318 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/0362 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/80201 ,  H01L2224/83001 ,  H01L2224/83203 ,  H01L2225/06593 ,  H01L2924/01014 ,  H01L2924/1032 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15738

Abstract: A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.

Abstract translation: 使用具有顺应性树脂的转印衬底将一个或多个芯片结合到目标晶片。 植入区域形成在转印衬底中。 转印衬底的一部分被蚀刻以形成提升器。 将合适的材料施加到转印基板上。 芯片被固定到柔性材料上，其中芯片被固定到提升管上方的柔性材料。 当芯片固定到顺应性材料时，芯片被结合到目标晶片。 从芯片上去除转印衬底和柔顺材料。 转印衬底对UV光是不透明的。

公开(公告)号：US20150311672A1

公开(公告)日：2015-10-29

申请号：US14694894

申请日：2015-04-23

Applicant: Skorpios Technologies, Inc.

Inventor： Hacene Chaouch

IPC: H01S5/06 ,  H01S5/12 ,  H01S5/125 ,  H01S5/0687 ,  H01S5/10 ,  H01S5/30

CPC classification number: H01S5/0612 ,  H01S5/021 ,  H01S5/0261 ,  H01S5/06256 ,  H01S5/0687 ,  H01S5/1007 ,  H01S5/3013 ,  H01S2301/163

Abstract: A tunable laser has a first binary super grating (BSG), a second BSG, and a phase adjuster. The first BSG, the second BSG, and the phase adjuster are optically tuned by changing temperatures of respective heating elements. The tunable laser also includes three temperature sensors, a first sensor to measure the temperature of the first BSG; a second sensor to measure the temperature of the second BSG, and a third sensor to measure the temperature of the phase adjuster. A lasing frequency is determined by a set of values of the three temperature sensors. In some embodiments, instead of a third temperature sensor, a pilot tone is applied to the phase adjuster to lock to a maximum of an aligned pair of peaks.

Abstract translation: 可调激光器具有第一二进制超光栅（BSG），第二BSG和相位调节器。 第一BSG，第二BSG和相位调节器通过改变各个加热元件的温度进行光学调谐。 可调激光器还包括三个温度传感器，第一传感器，用于测量第一BSG的温度; 用于测量第二BSG的温度的第二传感器，以及用于测量相位调节器的温度的第三传感器。 激光频率由三个温度传感器的一组值确定。 在一些实施例中，代替第三温度传感器，导频音被施加到相位调节器以锁定到最大对齐的一对峰值。

公开(公告)号：US20150139256A1

公开(公告)日：2015-05-21

申请号：US14488041

申请日：2014-09-16

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick ,  William Kozlovsky

IPC: H01S5/14 ,  H01S5/026 ,  H01S5/10 ,  H01S5/02

CPC classification number: H01S5/141 ,  H01S3/10053 ,  H01S3/1055 ,  H01S3/107 ,  H01S5/0208 ,  H01S5/021 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/0261 ,  H01S5/1003 ,  H01S5/1032 ,  H01S2301/03

Abstract: A cable television transmitter includes a substrate including a silicon material, control electronics disposed in the substrate, and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The cable television transmitter also includes an optical modulator optically coupled to the gain medium and electrically coupled to the control electronics, a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The cable television transmitter further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror.

Abstract translation: 一种有线电视发射器包括：衬底，包括硅材料，设置在衬底中的控制电子器件和耦合到衬底的增益介质。 增益介质包括化合物半导体材料。 有线电视发射机还包括光学耦合到增益介质并电耦合到控制电子器件的光学调制器，设置在衬底中并光学耦合到增益介质的波导，第一波长选择元件，其特征在于第一反射光谱并且被布置 以及第二波长选择元件，其特征在于第二反射光谱并设置在基板中。 有线电视发射机还包括设置在基板中并连接第一波长选择元件，第二波长选择元件和波导的光耦合器和输出镜。

公开(公告)号：US20150099318A1

公开(公告)日：2015-04-09

申请号：US14509975

申请日：2014-10-08

Applicant: Skorpios Technologies, Inc.

Inventor： Stephen B. Krasulick ,  John Dallesasse ,  Amit Mizrahi ,  Timothy Creazzo ,  Elton Marchena ,  John Y. Spann

IPC: H01S5/022 ,  H01S5/02 ,  H01S5/30 ,  H01S5/026

CPC classification number: H01L31/02327 ,  G02B6/423 ,  H01S5/0207 ,  H01S5/021 ,  H01S5/0217 ,  H01S5/0218 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/02469 ,  H01S5/026 ,  H01S5/3013 ,  H01S2301/176

Abstract: A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon.

Abstract translation: 一种用于制造用于跨材料分离功能的光子复合装置的方法包括提供具有平台和结合在平台中的芯片的复合装置。 芯片被处理包括图案化，蚀刻，沉积和/或其他处理步骤，同时芯片被结合到平台。 芯片用作增益介质，平台至少部分由硅制成。

公开(公告)号：US20140043050A1

公开(公告)日：2014-02-13

申请号：US13959166

申请日：2013-08-05

Applicant: Skorpios Technologies, Inc.

Inventor： Robert J. Stone ,  Stephen B. Krasulick

IPC: H04B17/00

CPC classification number: G01J1/08 ,  G01J1/42 ,  G01J2001/083 ,  G01J2001/4247 ,  G01R31/3187 ,  H04B10/035 ,  H04B10/0731 ,  H04B10/0779 ,  H04B17/0082

Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.

Abstract translation: 光子系统包括发射光子模块和接收光子模块。 光子系统还包括耦合到发射光子模块的发射波导，与发射波导集成的第一光开关，以及光耦合到第一光开关的诊断波导。 光子系统还包括耦合到接收光子模块的接收波导和与接收波导集成并与光学耦合到诊断波导的第二光开关。

公开(公告)号：US20130302920A1

公开(公告)日：2013-11-14

申请号：US13869408

申请日：2013-04-24

Applicant: Skorpios Technologies, Inc.

Inventor： John Dallesasse ,  Stephen B. Krasulick

IPC: H01L33/48

CPC classification number: H01L25/167 ,  H01L21/78 ,  H01L21/822 ,  H01L23/50 ,  H01L24/97 ,  H01L31/1876 ,  H01L33/005 ,  H01L33/48 ,  H01L33/52 ,  H01L2924/1204 ,  H01L2924/12042 ,  H01L2924/14 ,  H01S5/0217 ,  H01S5/026 ,  H01L2924/00

Abstract: A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure.

Abstract translation: 制造复合半导体结构的方法包括提供包括多个器件的衬底并提供包括多个光子器件的化合物半导体衬底。 该方法还包括切割化合物半导体衬底以提供多个光子管芯。 每个管芯包括多个光子器件中的一个或多个。 该方法还包括提供组装衬底，将多个光子模具安装在组装衬底的预定部分上，对准衬底和组装衬底，将衬底和组件衬底接合以形成复合衬底结构，并且移除至少一个 从组合衬底结构的组装衬底的一部分。

公开(公告)号：US20130251299A1

公开(公告)日：2013-09-26

申请号：US13838596

申请日：2013-03-15

Applicant: SKORPIOS TECHNOLOGIES, INC.

Inventor： Lina He ,  Amit Mizrahi

IPC: G02F1/095

CPC classification number: G02F1/2257 ,  G02B6/2746 ,  G02B27/4244 ,  G02F1/0955 ,  G02F1/3136 ,  G02F2001/212

Abstract: An optical circulator includes a first optical isolator including a first port and a second port and a plurality of optical isolators coupled to the second port of the first optical isolator. Each of the plurality of optical isolators comprise a first port and a second port.

公开(公告)号：US20130188969A1

公开(公告)日：2013-07-25

申请号：US13733331

申请日：2013-01-03

Applicant: Skorpios Technologies, Inc

Inventor： Amit Mizrahi

IPC: G01B9/02

CPC classification number: G01B9/02049 ,  G02B6/29335 ,  G02B6/29338 ,  G02B2006/12142 ,  G02F1/21 ,  G02F1/225 ,  G02F2001/0151 ,  G02F2001/212 ,  G02F2203/15

Abstract: A multiple resonance interferometer structure includes an input port and a first arm coupled to the input port and including a first resonant structure. The multiple resonance interferometer also includes a second arm coupled to the input port and including a second resonant structure and an output port coupled to the first arm and the second arm

Abstract translation: 多谐振干涉仪结构包括输入端口和耦合到输入端口并包括第一共振结构的第一臂。 所述多重共振干涉仪还包括耦合到所述输入端口的第二臂，并且包括第二谐振结构以及耦合到所述第一臂和所述第二臂的输出端口