Abstract:
PROBLEM TO BE SOLVED: To provide a method/device which can reduce the converging time of a digital filter while maintaining its accuracy. SOLUTION: When a digital filter is initially run, the coefficients of the filter are adjusted to decrease the output errors of the filter. If the adjusted filter coefficients satisfy the selected error levels, these coefficients are stored in a memory and also the digital filter filters data. When the digital filter is run, the stored coefficients are loaded into the filter and also many repetitive operations are made to run to adjust the coefficients. Then it's decided whether the adjusted coefficients satisfy the threshold that can decide that an error level is equal to the selected one. If the coefficients satisfy the threshold, these coefficients are stored in the memory and also the digital filter is used to filter the data. COPYRIGHT: (C)2000,JPO
Abstract:
A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.
Abstract:
PROBLEM TO BE SOLVED: To provide an improved apparatus and method for performing measurement of a wafer.SOLUTION: The apparatus may include a substrate with a plurality of microprobes. A plurality of light sources may direct light onto each of the microprobes. Light reflected from the microprobes may be detected by a plurality of photodetectors, thereby detection signals each of which is associated with one of the microprobes are generated. A controller may send a driving signal to each of the plurality of microprobes, and may determine a height distribution and a surface charge distribution of the wafer on the basis of the detection signals.
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic apparatus capable of improving interface properties between a shallow trench isolation (STI) region and a corresponding semiconductor device, and a method for manufacturing the same.SOLUTION: An electronic apparatus can comprise a substrate, a buried type oxide (BOX) layer on the substrate, at least one of semiconductor device on the BOX layer, and at least one of STI region adjacent to at least one of semiconductor device and in the substrate. At least one of STI region can comprise a nitride layer defining a sidewall surface of the substrate and lining a bottom part of the sidewall surface, an oxide layer lining an upper part of the sidewall surface above the bottom part, and an insulating material in the nitride layer and the oxide layer.
Abstract:
A computer system having a memory system where at least some of the memory is designated as shared memory. A transaction-based bus mechanism couples to the memory system and includes a cache coherency transaction defined within its transaction set. A processor having a cache memory is coupled to the memory system through the transaction based bus mechanism. A system component coupled to the bus mechanism includes logic for specifying cache coherency policy. Logic within the system component initiates a cache transaction according to the specified cache policy on the bus mechanism. Logic within the processor responds to the initiated cache transaction by executing a cache operation specified by the cache transaction.