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    IN SITU GETTER PUMP SYSTEM AND METHOD
    151.
    发明申请
    IN SITU GETTER PUMP SYSTEM AND METHOD 审中-公开
    在现场抽水机系统和方法

    公开(公告)号：WO9848168A3

    公开(公告)日：2000-02-24

    申请号：PCT/US9807459

    申请日：1998-04-15

    Applicant: SAES PURE GAS INC

    Inventor： LORIMER D ARCY H ,  KRUEGER GORDON P

    IPC: B01D53/04 ,  B01J3/00 ,  B01J3/02 ,  C23C14/54 ,  C23C14/56 ,  F04B37/02 ,  H01L21/00 ,  H01L21/203 ,  H01L21/677 ,  C23C16/00 ,  H01J9/39

    CPC classification number: H01L21/67109 ,  B01D53/04 ,  B01D53/0446 ,  B01D2257/108 ,  B01D2257/80 ,  B01D2258/0216 ,  B01D2259/416 ,  B01J3/006 ,  C23C14/564 ,  F04B37/02 ,  H01L21/67017 ,  H01L21/6719

    Abstract: A wafer processing system (12) including a processing chamber (18), a low pressure pump (22) coupled to the processing chamber (18) for pumping noble and non-noble gases, a valve mechanism (52) coupling a source of noble gas (54) to the processing chamber (18), an in situ getter pump (32) disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber (18), and a processing mechanism for processing a wafer (40) disposed within the processing chamber (18). Preferably, the in situ getter pump (32) can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer (36) is used to automatically control the temperature of the getter pump (32) to control the species of gasses that are pumped from the chamber. An alternate embodiment of the invention includes an in situ getter pump (178) additionally provided within the transfer chamber (42) of the semiconductor manufacturing equipment.

    Abstract translation: 一种晶片处理系统（12），包括处理室（18），耦合到用于泵送贵重和非贵重气体的处理室（18）的低压泵（22），耦合高贵源的阀机构（52） 气体（54）到处理室（18），设置在处理室内的原位吸气泵（32），其在惰性气体流入室（18）期间泵送某些非惰性气体，以及处理机构 用于处理设置在处理室（18）内的晶片（40）。 优选地，原位吸气泵（32）可以在多个不同温度下操作，以在这些温度下优先泵送不同种类的气体。 气体分析器（36）用于自动控制吸气泵（32）的温度以控制从室泵送的气体种类。 本发明的替代实施例包括另外设置在半导体制造设备的传送室（42）内的原位吸气泵（178）。

    VACUUM EXTRUSION SYSTEM AND METHOD
    152.
    发明申请
    VACUUM EXTRUSION SYSTEM AND METHOD 审中-公开
    真空挤出系统和方法

    公开(公告)号：WO1998006554A2

    公开(公告)日：1998-02-19

    申请号：PCT/US1997014055

    申请日：1997-08-11

    Applicant: UC INDUSTRIES, INC.

    Inventor： UC INDUSTRIES, INC. ,  LIGHTLE, Rodger, D. ,  SADINSKI, Robert, L. ,  LINCOLN, Robert, M.

    IPC: B29C44/34

    CPC classification number: B29C44/3407 ,  B01J3/006 ,  B01J3/03 ,  B29C44/3403 ,  B29C47/0009 ,  B29C47/34 ,  B29C47/884 ,  B29C47/8895 ,  B29C47/90 ,  B29C47/905 ,  B29C47/92 ,  B29C2947/92104 ,  B29C2947/92428 ,  B29C2947/92476 ,  B29C2947/926 ,  B29C2947/92923 ,  B29C2947/92971

    Abstract: A horizontal vacuum extrusion line includes a fixed bulkhead (23), a die (24) inside the bulkhead, a telescoping vacuum chamber section (27) and a fixed chamber section (28, 29). A dam (33) in the fixed section forms a pond (72) for immersion cooling of the extrudate. A truss (35) extends from the dam to the bulkhead supporting, shaping and calibration equipment and extends through the telescoping section. Fluid pressurizable seals at each end of the telescoping section are operable after the telescoping section is closed against the bulkhead and the telescoping and fixed sections are locked together. The telescoping section provides a more compact line and easier access to the complex equipment downstream of the die. The extrudate from the die passes down into the pond (72) and then through an orifice (74) in a hood (75) projecting from the chamber into a lower level portion of the pond (78) exposed to atmosphere. The hood also includes a tractor drive (88) to push the extrudate through the underwater orifice. The hood and its contents are accessible through the atmospheric pond. A tractor haul-off and the tractor drive in the hood are the only extrudate drives between the calibration equipment and atmosphere. The higher level of the pond (72) within the chamber downstream of the dam is controlled by a valve in turn controlling the output of a pump. The valve control senses the pond level and operates independently of the vacuum controls.

    Abstract translation: 卧式真空挤压生产线包括固定隔板（23），隔板内部的模具（24），伸缩式真空室部分（27）和固定室部分（28,29）。 固定部分中的坝（33）形成用于浸渍冷却挤出物的池（72）。 桁架（35）从大坝延伸到隔板支撑，成型和校准设备并延伸穿过伸缩部分。 伸缩部分的每端处的流体可加压密封件在伸缩部分相对于舱壁关闭并且伸缩和固定部分被锁定在一起之后是可操作的。 伸缩部分提供更紧凑的生产线，更容易进入模具下游的复杂设备。 来自模具的挤出物向下流入池塘（72），然后穿过从室中突出到敞开大气的池塘（78）的下部分的罩（75）中的孔口（74）。 发动机罩还包括一个拖拉机驱动装置（88），用于推动挤出物通过水下孔口。 罩及其内容物可通过大气池进入。 拖拉机牵引车和牵引车的驱动器是校准设备和大气之间唯一的挤出机。 在坝下游的室内的池塘（72）的较高水平由阀门控制，从而控制泵的输出。 阀门控制检测池水位，独立于真空控制器运行。

    PRESSURE-TIGHT VACUUM CHAMBER IN AN ELECTRON BEAM ENGRAVING MACHINE FOR PRODUCING PRINTING ROLLS FOR THE PRINTING INDUSTRY
    153.
    发明申请
    PRESSURE-TIGHT VACUUM CHAMBER IN AN ELECTRON BEAM ENGRAVING MACHINE FOR PRODUCING PRINTING ROLLS FOR THE PRINTING INDUSTRY 审中-公开
    用于生产印刷行业印刷辊的电子束雕刻机中的压力真空室

    公开(公告)号：WO1986004282A1

    公开(公告)日：1986-07-31

    申请号：PCT/DE1986000001

    申请日：1986-01-07

    Applicant: DR.-ING. RUDOLF HELL GMBH ,  ANGELBECK, Rolf ,  GESELL, Reinhard ,  PENZA, Hans

    Inventor： DR.-ING. RUDOLF HELL GMBH

    IPC: B23K15/00

    CPC classification number: B01J3/006 ,  B23K15/06 ,  B41C1/05

    Abstract: A pressure-tight vacuum chamber in an electron beam engraving machine for receiving the printing rolls which are to be engraved, comprising a machine bed lower portion, a pressure-tight vacuum hood placed over the lower part, which is shaped in the form of a barrel-like arch and is placed on a sealing lip which surrounds the lower part on its upper rim, a loading aperture for the printing roll arranged in the upper central region of the hood, extending in the longitudinal direction of the hood, a cover which can be lowered into the loading aperture and forming a seal with the latter, and lifting and transport equipment arranged at the front ends and loading aperture, with which the cover can be lifted from its closed position and can be moved on the outer periphery of the hood in the direction of the periphery, clearing the opening, and can be moved back from the open position across the aperture and lowered into the closed position.

    Abstract translation: 用于接收要雕刻的印刷辊的电子束雕刻机中的压力真空室，包括机床下部，放置在下部的压力真空罩，其形状为 桶状拱形物，并且被放置在围绕其上边缘上的下部的密封唇上，布置在罩的上中部区域中的印刷辊的装载孔沿着罩的纵向方向延伸，盖 可以下降到装载孔中并与其形成密封，以及布置在前端处的提升和输送设备以及装载孔，盖可以从其关闭位置提升并且可以在其外周上移动 罩在周边方向上，清除开口，并且可以从打开位置向后移动穿过孔并降低到关闭位置。

    Process chamber with inner support
    160.
    发明专利
    Process chamber with inner support 有权
    具有内部支持的过程室

    公开(公告)号：JP2007314884A

    公开(公告)日：2007-12-06

    申请号：JP2007164121

    申请日：2007-06-21

    Applicant: Asm America Inc ,  エーエスエム アメリカ インコーポレイテッド

    Inventor： WENGERT JOHN F ,  JACOBS LOREN R ,  HALPIN MICHAEL W ,  FOSTER DERRICK W ,  VAN DER JEUGD CORNELIS A ,  VYNE ROBERT M ,  HAWKINS MARK R

    IPC: C23C16/46 ,  B01J3/00 ,  C23C16/44 ,  C23C16/455 ,  C23C16/48 ,  H01L21/00 ,  H01L21/205 ,  H01L21/687

    CPC classification number: C23C16/45502 ,  B01J3/006 ,  C23C16/44 ,  C23C16/455 ,  C23C16/46 ,  C23C16/481 ,  H01L21/67115 ,  H01L21/68785

    Abstract: PROBLEM TO BE SOLVED: To provide a process chamber capable of withstanding high temperature, low pressure processes, and having improved wafer temperature uniformity and gas flow characteristics. SOLUTION: The chamber has a vertical-lateral lenticular cross-section with a wide horizontal dimension and a shorter vertical dimension between biconvex upper and lower walls 12, 14. A central horizontal support plate 40 is provided between two lateral side rails 16, 18 of the chamber. The support plate segregates the process chamber into an upper region and a lower region 66, 68, with purge gas being introduced through the lower tube into the lower region to prevent unwanted deposition therein. A temperature compensation ring surrounds the susceptor and is constructed of a material absorbing heat at an efficiency higher than the case of the chamber walls. A gas injector includes a plurality of independently controlled channels disposed laterally across the chamber, the channels merging at an outlet of the injector to allow mixing of the adjacent longitudinal edges of the separate flows well before reaching the wafer. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供能够耐受高温，低压工艺并具有改进的晶片温度均匀性和气体流动特性的处理室。 解决方案：腔室具有在双凸面上下壁12,14之间具有宽水平尺寸和较短垂直尺寸的垂直横向双凸透镜横截面。中央水平支撑板40设置在两个侧向侧轨道16之间 ，18室。 支撑板将处理室分离成上部区域和下部区域66,68，其中吹扫气体通过下部管道被引入下部区域中，以防止其中不希望的沉积。 温度补偿环围绕基座并且由以比室壁的情况高的效率吸收热量的材料构成。 气体喷射器包括多个独立控制的通道，横向设置在腔室上，通道在喷射器的出口处汇合，以允许在到达晶片之前将单独流动的相邻纵向边缘混合。 版权所有（C）2008，JPO＆INPIT

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