Abstract:
PROBLEM TO BE SOLVED: To provide an in situ getter pump having a heating device to selectively discharge different non-noble gases at different temperatures. SOLUTION: A wafer processing system includes: a processing chamber; a low pressure pump coupled to the processing chamber for pumping noble gas out of the processing chamber; a valve mechanism coupling a source of noble gas to the processing chamber; the in situ getter pump disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber; and a processing mechanism for processing a wafer disposed within the processing chamber. Preferably, the in situ getter pump can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer is used to automatically control the temperature of the getter pump to control the species of gasses that are pumped from the chamber. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
A wafer processing system (12) including a processing chamber (18), a low pressure pump (22) coupled to the processing chamber (18) for pumping noble and non-noble gases, a valve mechanism (52) coupling a source of noble gas (54) to the processing chamber (18), an in situ getter pump (32) disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber (18), and a processing mechanism for processing a wafer (40) disposed within the processing chamber (18). Preferably, the in situ getter pump (32) can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer (36) is used to automatically control the temperature of the getter pump (32) to control the species of gasses that are pumped from the chamber. An alternate embodiment of the invention includes an in situ getter pump (178) additionally provided within the transfer chamber (42) of the semiconductor manufacturing equipment.
Abstract:
A semiconductor manufacturing system (10) includes a getter-based gas purifier (12) with a safety device coupled in flow communication with a gas distribution network (16) for a semiconductor fabrication facility. The gas distribution network (16) supplies purified gas to at least one wafer processing chamber (18a-e) in the semiconductor fabrication facility. The getter-based gas purifier (12) with a safety device includes a getter column (20) having a sacrificial getter bed (40) disposed therein. In one embodiment the getter column (20) includes a gas inlet blocking device (22) disposed therein, with the gas inlet blocking device (22) having a sacrificial getter bed (40) disposed therein. In other embodiments the getter column (20) inlcudes sacrificial getter bed (40) and a porous member (38 or 46) disposed above a primary getter bed (32) disposed within the getter column. The gas inlet blocking device preferably includes a housing (36), a sacrificial getter bed (40), and a porous metallic support (38) that supports the sacrificial getter bed (40) with the housing (36). A high melting point, nonmetallic liner (42) separates the sacrificial getter bed (40) from the housing (36). In an alternative embodiment, the gas inlet blocking device (22) includes a porours ceramic support (46) and a layer of a meltable material (48), e.g. stainless steel shot, is disposed between the sacrificial getter bed (40) and the porous ceramic support (46). A method of protecting a getter column and a method of making an integrated circuit device are also described.
Abstract:
A getter pump module includes a number of getter disks provided with axial holes, and a heating element which extends through the holes to support and heat the getter disks. The getter disks are preferably solid, porous, sintered getter disks that are provided with a titanium hub that engages the heating element. A thermally isolating shield is provided to shield the getter disks from heat sources and heat sinks within the chamber, and to aid in the rapid regeneration of the getter disks. In certain embodiments of the present invention, the heat shields are fixed, and in other embodiments the heat shield is movable. In one embodiment, a focus shield is provided to reflect thermal energy to the getter material from an external heater element and provide high pumping speeds. An embodiment of the present invention also provides for a rotating getter element to enhance getter material utilization.
Abstract:
A wafer processing system including a processing chamber, a low pressure pump coupled to the processing chamber for pumping noble and non-noble gases, a valve mechanism coupling a source of noble gas to the processing chamber, an in situ getter pump disposed within the processing chamber which pumps certain non-noble gases during the flow of the noble gas into the chamber, and a processing mechanism for processing a wafer disposed within the processing chamber. Preferably, the in situ getter pump can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer is used to automatically control the temperature of the getter pump to control the species of gasses that are pumped from the chamber. A method for processing a wafer of the present invention includes the steps of placing a wafer within a processing chamber and sealing the chamber, flowing a noble gas into the chamber while simultaneously pumping the chamber with an external low pressure pump and with an in situ getter pump disposed within the chamber which pumps non-noble gases, and processing the wafer within the chamber while the noble gas continues to flow. The method also preferably includes the steps of monitoring the composition of the gas within the chamber and controlling the temperature of the getter material based upon the analysis of the composition.
Abstract:
A gas purification system includes a gas purification unit and one or more safety devices. The gas purification unit includes an enclosure containing a purification material that exhibits an exothermic reaction when exposed to certain gas contaminants. The gas purification unit also has an inlet coupled to an unpurified gas inlet line and an outlet coupled to a purified gas outlet line. A safety device can be coupled either to the unpurified gas input line or the purified output line, or both, and develops an alarm signal when gas contaminants exceed a given concentration level for a period of time.
Abstract:
A combination cryopump/getter pump (50) including a cryopump section (52) having a cryopump inlet (76), a getter pump section (54) having a getter pump inlet (86), and a mechanism (60) for coupling the cryopump section (52) and the getter pump section (54) to a single port (58) of a process chamber to be evacuated. Preferably, a cylindrical getter pump section (54) surrounds a cylindrical cryopump section (52). Preferably, the cryopump section (52) and the getter pump section (54) are coupled to the common port (58) of the process chamber by a gate valve mechanism (60). In one embodiment, the gate valve mechanism (60) isolates the cryopump inlet (76) and the getter pump inlet (86) when in a closed position. In another embodiment, the gate valve mechanism (60) does not isolate the cryopump inlet (76) and the getter pump inlet (86) when in a closed position. Preferably, thermal insulation (78) is provided between the getter pump section (54) and the cryopump section (52) to thermally isolate the two sections. The cryopump section preferably includes both a 15 ~K array (72) and an 80 ~K array (70a-d).
Abstract:
A wafer processing system including a processing chamber, a low pressure pum p coupled to the processing chamber for pumping noble and non-noble gases, a valve mechanism coupling a source of noble gas to the processing chamber, an in situ getter pump disposed within the processing chamber which pumps certa in non-noble gases during the flow of the noble gas into the chamber, and a processing mechanism for processing a wafer disposed within the processing chamber. Preferably, the in situ getter pump can be operated at a number of different temperatures to preferentially pump different species of gas at those temperatures. A gas analyzer is used to automatically control the temperature of the getter pump to control the species of gases that are pump ed from the chamber. A method for processing a wafer of the present invention includes the steps of placing a wafer within a processing chamber and sealin g the chamber, flowing a noble gas into the chamber while simultaneously pumpi ng the chamber with an external low pressure pump and with an in situ getter pu mp disposed within the chamber which pumps non-noble gases, and processing the wafer within the chamber while the noble gas continues to flow. The method also preferably includes the steps of monitoring the composition of the gas within the chamber and controlling the temperature of the getter material based upon the analysis of the composition.
Abstract:
A SEMICONDUCTOR MANUFACTURING SYSTEM (1) INCLUDES A GETTER-BASED GAS PURIFIER (2) COUPLED IN FLOW COMMUNICATION WITH A GAS DISTRIBUTION NETWORK (4) FOR A SEMICONDUCTOR FABRICATION FACILITY (3). THE GAS DISTRIBUTION NETWORK (4) SUPPLIES PURIFIED GAS TO AT LEAST ONE WAFER PROCESSING CHAMBER (5A,5B,5C,5D,5E) IN THE SEMICONDUCTOR FABRICATION FACILITY (3). THE GAS PURIFIER (2) INCLUDES A GETTER COLUMN (10) HAVING A METALLIC VESSEL (12) WITH AN INLET (14, AN OUTLET (16), AND A CONTAINMENT WALL (18) EXTENDING BETWEEN THE INLET AND THE OUTLET. GETTER MATERIAL (30) WHICH PURIFIES GAS FLOWING THERETHROUGH BY SORBING IMPURITIES THEREFROM IS DISPOSED IN THE VESSEL (12). A FIRST TEMPERATURE SENSOR (34) IS DISPOSED IN A TOP PORTION OF THE GETTER MATERIAL(30). THE FIRST TEMPERATURE SENSOR IS LOCATED IN A MELT ZONE TO DETECT RAPIDLY THE ONSET OF AN EXOTHERMIC REACTION WHICH INDICATES THE PRESENCE OF EXCESS IMPURITIES IN THE INCOMING GAS TO BE PURIFIED. A SECOND TEMPERATURE SENSOR (36) IS DISPOSED IN A BOTTOM PORTION OF THE GETTER MATERIAL (30). THE SECOND TEMPERATURE SENSOR IS LOCATED IN A MELT ZONE TO DETECT RAPIDLY THE ONSET OF AN EXOTHERMIC REACTION WHICH INDICATES THAT EXCESS IMPURITIES ARE BEING BACKFED INTO THE GETTER COLUMN (10). FIRST AND SECOND HIGH MELTING POINT, NONMETALLIC LINERS ARE DISPOSED IN THE VESSEL (12) SUCH THAT AT LEAST SOME OF THE TOP AND BOTTOM PORTIONS, RESPECTIVELY, OF THE GETTER MATERIAL (30) IS SEPARATED FROM THE CONTAINMENT WALL (18) OF THE VESSEL. A GETTER-BASED GAS PURIFIER (2), A METHOD OF MAKING AN INTEGRATED CIRCUIT DEVICE, AND A METHOD OF PROTECTING A GETTERCOLUMN (10) ARE ALSO DESCRIBED. (FIGURE 2)
Abstract:
Purificador de gas (2) basado en getter, que comprende: - una columna getter (10) que tiene un recipiente metálico (12) con una entrada (14), una salida (16) y un tabique de retención (18) que se extiende entre dicha entrada (14) y dicha salida (16), poseyendo dicho recipiente (12) material getter (30) dispuesto en su interior; - una primera válvula de aislamiento (42) en comunicación de fluido con dicha entrada (14) de dicho recipiente (12); - una válvula de ventilación (48) en comunicación de flujo con dicha entrada (14) del recipiente (12); - una segunda válvula de aislamiento (44) en comunicación de fluido con dicha salida (16) del recipiente (12); - un primer sensor de temperatura (34) dispuesto en la parte superior de dicho material getter (30).