公开(公告)号：WO2005124869A1

公开(公告)日：2005-12-29

申请号：PCT/KR2004/003360

申请日：2004-12-20

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE ,  YANG, Woo Seok ,  KANG, Sung Weon ,  KIM, Youn Tae

Inventor： YANG, Woo Seok ,  KANG, Sung Weon ,  KIM, Youn Tae

IPC: H01L29/00

CPC classification number: B81C1/00952 ,  B81C2201/112

Abstract: Provided is a micro-mechanical structure and method for manufacturing the same, including a hydrophilic surface on at least a part of a surface of the micro-mechanical structure, so as to prevent generation of an adhesion phenomenon in the process of removing a sacrificial layer to release the micro-mechanical, wherein the sacrificial layer comes into contact with the surface of the micro-mechanical structure.

Abstract translation: 提供了一种微机械结构及其制造方法，其包括在微机械结构的表面的至少一部分上的亲水表面，以防止在去除牺牲层的过程中产生粘附现象 以释放微机械，其中牺牲层与微机械结构的表面接触。

公开(公告)号：WO2005019351A3

公开(公告)日：2005-12-15

申请号：PCT/US2004024084

申请日：2004-07-27

Applicant: MICROSURFACES INC ,  ZHU XIAOYANG

Inventor： ZHU XIAOYANG

IPC: B05D1/18 ,  B05D5/08 ,  B81B3/00 ,  B81C1/00 ,  C09D4/00

CPC classification number: C09D4/00 ,  B05D1/185 ,  B05D5/083 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/112 ,  B82Y30/00 ,  C08G77/04 ,  C08G77/24

Abstract: The present invention provides unique methods of coating and novel coatings for MEMS devices. In general a two step process includes the coating of a first silane onto a substrate surface followed by a second treatment with or without a second silane and elevated temperatures.

Abstract translation: 本发明提供了用于MEMS器件的独特涂层和新型涂层方法。 通常，两步法包括将第一硅烷涂布到基材表面上，接着进行第二次处理，有或者没有第二硅烷并且升高温度。

公开(公告)号：WO02024466A1

公开(公告)日：2002-03-28

申请号：PCT/US2001/030243

申请日：2001-09-25

IPC: B81B3/00 ,  B81C1/00 ,  B44C1/22 ,  A61B19/00 ,  B41J2/04 ,  H01L21/00

CPC classification number: B81B3/001 ,  B81C2201/112

Abstract: An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.

Abstract translation: 一种用于悬臂形成技术的反沉降结构。 在一个实施例中，悬臂（130）包括向下延伸的多个腿部（131和132），其防止基底（100）粘附到悬臂。 在另一个实施方案中，防止聚合物悬臂（215）通过基板上的摊铺粘贴层（205）粘附到基板（200）上，并且在悬臂形成期间，随后将粘合层作为牺牲层被去除。

公开(公告)号：KR1020100007751A

公开(公告)日：2010-01-22

申请号：KR1020090062085

申请日：2009-07-08

Applicant: 더 스와치 그룹 리서치 앤 디벨롭먼트 엘티디

Inventor： 딘게르,루돌프 ,  라벤넬,시에리

IPC: C23F1/00 ,  H01L21/027 ,  G03F7/00

CPC classification number: G04D3/0069 ,  B81B2201/035 ,  B81C3/008 ,  B81C99/008 ,  G04B13/02 ,  Y10T29/49579 ,  Y10T29/49581 ,  B81C2201/112 ,  G03F7/0002 ,  G04B13/026

Abstract: PURPOSE: A method for manufacturing micromechanical components is provided to manufacture a protective mask using photosensitive resin. CONSTITUTION: A method for manufacturing micromechanical components comprises the following steps. A substrate(53) is prepared. The substrate is made of micro-machining material. A pattern is etched by using photolithography. A clip(91) is assembled on the components. The components are separated from the substrate in order to mount components inside an apparatus. The substrate is mounted on a support(81) press-fitted with a fork(87).

Abstract translation: 目的：提供用于制造微机械部件的方法来制造使用感光树脂的保护罩。 构成：微机械部件的制造方法包括以下步骤。 制备基板（53）。 基板由微加工材料制成。 通过使用光刻法刻蚀图案。 夹子（91）组装在组件上。 部件与基板分离，以便将部件安装在设备内。 基板安装在压配合叉（87）的支撑（81）上。

公开(公告)号：KR1020090086921A

公开(公告)日：2009-08-14

申请号：KR1020090011042

申请日：2009-02-11

Applicant: 허니웰 인터내셔널 인코포레이티드

Inventor： 리들리제프에이.

IPC: B81C1/00 ,  B81B7/00 ,  G03F7/20

CPC classification number: B81C1/0096 ,  B81B3/001 ,  B81B2203/0361 ,  B81C2201/112 ,  Y10S438/951

Abstract: An MEMS device manufacturing method and a system thereof are provided to dissolve and remove metal adhering to a residual photoresist and a substrate with leaving interconnection pattern and one or more bump characteristic parts. An MEMS device manufacturing method comprises following steps. A positive photoresist layer is formed on a substrate(32). The first area of the substrate is selectively exposed with a radiation source. The first area of the substrate is selectively exposed with the radiation source. The second area of the substrate defining one or more bump characteristic parts is exposed with the radiation source. The second area of the substrate is developed with the developing solution in order to deposit a metal layer on the top of the substrate. The metal layer is formed on the top of the substrate. The residual photoresist causing the metal evaporated on the photoresist to be removed is removed.

Abstract translation: 提供了一种MEMS器件制造方法及其系统，用于溶解和除去附着在剩余光致抗蚀剂和基板上的金属，留下互连图案和一个或多个突起特征部分。 MEMS器件制造方法包括以下步骤。 在基板（32）上形成正性光致抗蚀剂层。 用辐射源选择性地暴露衬底的第一区域。 用辐射源选择性地暴露衬底的第一区域。 限定一个或多个突起特征部分的衬底的第二区域被辐射源暴露。 衬底的第二区域用显影溶液显影，以便在衬底的顶部上沉积金属层。 金属层形成在基板的顶部。 去除导致在光致抗蚀剂上蒸发的金属被去除的残余光致抗蚀剂。

公开(公告)号：KR1020060092890A

公开(公告)日：2006-08-23

申请号：KR1020050087784

申请日：2005-09-21

Applicant: 퀄컴 엠이엠에스 테크놀로지스, 인크.

Inventor： 샘프셀제프리비.

IPC: G02F1/21

CPC classification number: B81C1/00944 ,  B81B2201/047 ,  B81C2201/112 ,  B82Y30/00 ,  G02B26/001

Abstract: 본 발명의 다양한 실시예에서, 재생 보호 코팅은 MEMS 기기(80)의 내부 캐비티의 하나이상의 표면에 형성된다. 특정한 실시예에서, iMoD로도 알려져 있는, 간섭 광 변조 기기의 하나 이상의 미러 표면 상에 재생 보호 코팅(170)이 제공된다. 상기 보호 코팅은, 열 또는 에너지를 상기 보호 코팅에 부가함에 의해 재생될 수 있다.
MEMS, 재생 보호 코팅

公开(公告)号：KR1020020000121A

公开(公告)日：2002-01-04

申请号：KR1020010034904

申请日：2001-06-20

Applicant: 텍사스 인스트루먼츠 인코포레이티드

Inventor： 밀러세쓰 ,  로페스빈센트씨.

IPC: B81B7/02

CPC classification number: G02B26/0841 ,  B81B3/0005 ,  B81B2201/042 ,  B81C1/0096 ,  B81C2201/112

Abstract: PURPOSE: A method for coating micro-electromechanical system(MEMS) is provided to coat the MEMS with dissolved resins without structural damage. CONSTITUTION: A method includes the steps of: a step depositing organic resin coating material, which comprises at least 25% solids in a solvent including a surfactant and whose viscosity is not greater than 120 centistokes, on a MEMS; a step rotating the MEMS to disperse the coating material so as to prevent damage due to capillary phenomenon; and a step curing the coating material and including a step heating the MEMS to remove a majority of the solvent and lowering temperature of the MEMS to remove additional solvent.

Abstract translation: 目的：提供一种涂覆微机电系统（MEMS）的方法，用溶解的树脂涂覆MEMS，而不会造成结构损坏。 方法：一种方法包括以下步骤：在MEMS上沉积有机树脂涂料的步骤，该有机树脂涂料在包括表面活性剂和粘度不大于120厘沲的溶剂中包含至少25％的固体; 旋转MEMS以分散涂层材料以防止毛细管现象造成的损伤的步骤; 以及固化涂层材料的步骤，并且包括步骤加热MEMS以去除大部分溶剂并降低MEMS的温度以除去附加的溶剂。

公开(公告)号：KR1020010012439A

公开(公告)日：2001-02-15

申请号：KR1019997010392

申请日：1998-04-17

Applicant: 로베르트 보쉬 게엠베하

Inventor： 쉐프트할러마틴 ,  헤인페터 ,  스카파헬무트 ,  문젤호르스트

IPC: G01P15/08

CPC classification number: G01P15/0802 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  G01P1/023

Abstract: 본발명은마이크로미케니컬부품과이 부품을제조하기위한방법에관한것이다. 본발명에따라서, 이동부재(4)는희생층(2)상에형성된다. 그후이동부재(4) 하부의희생층(2)은제거되어, 상기이동부재(4)가움직일수 있다. 희생층(2)이제거된후에, 이동부재(4)의표면상에는보호층(7)이증착된다. 보호층(7)으로서는산화실리콘또는질화실리콘이이용될수 있다.

Abstract translation: 本发明涉及一种用于制造微机械零件和部件的方法。 根据本发明，移位构件4形成在牺牲层2上。 之后，可移动部件4下方的牺牲层2被移除，使得可移动部件4能够移动。 在牺牲层2放置后，保护层7沉积在可动构件4的表面上。 作为保护层7，可以使用氧化硅或氮化硅。

公开(公告)号：WO2013096089A1

公开(公告)日：2013-06-27

申请号：PCT/US2012/069506

申请日：2012-12-13

Applicant: ANALOG DEVICES, INC.

Inventor： LIU, Fang ,  YANG, Kuang, L.

IPC: B81B3/00

CPC classification number: B81B3/001 ,  B81B3/0005 ,  B81B3/0018 ,  B81C2201/112 ,  Y10T428/24355 ,  Y10T428/24521

Abstract: An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

Abstract translation: 具有非超疏水材料层或涂层的微丸阵列产生超疏水表面，并且还可具有15度或更小的接触角滞后。 因此，即使表面结构和材料本身不是超疏水的，具有这种阵列的表面也可能变得超疏水。

公开(公告)号：WO2010147796A3

公开(公告)日：2011-04-14

申请号：PCT/US2010037735

申请日：2010-06-08

Applicant: ANALOG DEVICES INC ,  HANCER MEHMET

Inventor： HANCER MEHMET

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81C2201/0181 ,  B81C2201/112 ,  B81C2203/0118

Abstract: Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm..

Abstract translation: 使用UV-臭氧（UVO）干蚀刻技术选择性地蚀刻有机抗静电涂层，例如在溶剂中或通过化学气相沉积施加的烃和氟碳基自组装有机硅烷和硅氧烷，其中部分 待蚀刻的有机抗静电涂层同时暴露于多个波长的紫外线，其激发和解离有机分子与抗静电涂层，并从分子氧和臭氧产生原子氧，使得有机分子与原子氧反应形成 挥发的产物被消散，导致去除抗静电涂层的暴露部分。 可以使用使用热量然后UVO曝光的混合蚀刻工艺。 可以使用荫罩（例如，玻璃或石英），保护材料层或其他机构来选择性地将抗静电涂层的部分暴露于UVO蚀刻。 可以使用这种选择性UVO蚀刻，例如在晶片到晶片接合之前暴露晶片接合线，以增加键合剪切和粘附强度，以暴露接合焊盘以准备电气或其它连接，或用于一般去除 的抗静电涂层材料从金属或其他材料表面。 一个具体实施方案使用两个波长的紫外光，一个在约184.9nm，另一个在约253.7nm。