Abstract:
Provided is a micro-mechanical structure and method for manufacturing the same, including a hydrophilic surface on at least a part of a surface of the micro-mechanical structure, so as to prevent generation of an adhesion phenomenon in the process of removing a sacrificial layer to release the micro-mechanical, wherein the sacrificial layer comes into contact with the surface of the micro-mechanical structure.
Abstract:
The present invention provides unique methods of coating and novel coatings for MEMS devices. In general a two step process includes the coating of a first silane onto a substrate surface followed by a second treatment with or without a second silane and elevated temperatures.
Abstract:
An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.
Abstract:
PURPOSE: A method for manufacturing micromechanical components is provided to manufacture a protective mask using photosensitive resin. CONSTITUTION: A method for manufacturing micromechanical components comprises the following steps. A substrate(53) is prepared. The substrate is made of micro-machining material. A pattern is etched by using photolithography. A clip(91) is assembled on the components. The components are separated from the substrate in order to mount components inside an apparatus. The substrate is mounted on a support(81) press-fitted with a fork(87).
Abstract:
An MEMS device manufacturing method and a system thereof are provided to dissolve and remove metal adhering to a residual photoresist and a substrate with leaving interconnection pattern and one or more bump characteristic parts. An MEMS device manufacturing method comprises following steps. A positive photoresist layer is formed on a substrate(32). The first area of the substrate is selectively exposed with a radiation source. The first area of the substrate is selectively exposed with the radiation source. The second area of the substrate defining one or more bump characteristic parts is exposed with the radiation source. The second area of the substrate is developed with the developing solution in order to deposit a metal layer on the top of the substrate. The metal layer is formed on the top of the substrate. The residual photoresist causing the metal evaporated on the photoresist to be removed is removed.
Abstract:
본 발명의 다양한 실시예에서, 재생 보호 코팅은 MEMS 기기(80)의 내부 캐비티의 하나이상의 표면에 형성된다. 특정한 실시예에서, iMoD로도 알려져 있는, 간섭 광 변조 기기의 하나 이상의 미러 표면 상에 재생 보호 코팅(170)이 제공된다. 상기 보호 코팅은, 열 또는 에너지를 상기 보호 코팅에 부가함에 의해 재생될 수 있다. MEMS, 재생 보호 코팅
Abstract:
PURPOSE: A method for coating micro-electromechanical system(MEMS) is provided to coat the MEMS with dissolved resins without structural damage. CONSTITUTION: A method includes the steps of: a step depositing organic resin coating material, which comprises at least 25% solids in a solvent including a surfactant and whose viscosity is not greater than 120 centistokes, on a MEMS; a step rotating the MEMS to disperse the coating material so as to prevent damage due to capillary phenomenon; and a step curing the coating material and including a step heating the MEMS to remove a majority of the solvent and lowering temperature of the MEMS to remove additional solvent.
Abstract:
An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.
Abstract:
Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm..