FREESTANDING POLYMER MEMS STRUCTURES WITH ANTI STICTION
    153.
    发明申请
    FREESTANDING POLYMER MEMS STRUCTURES WITH ANTI STICTION 审中-公开
    自动聚合物MEMS结构与反义词

    公开(公告)号:WO02024466A1

    公开(公告)日:2002-03-28

    申请号:PCT/US2001/030243

    申请日:2001-09-25

    CPC classification number: B81B3/001 B81C2201/112

    Abstract: An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.

    Abstract translation: 一种用于悬臂形成技术的反沉降结构。 在一个实施例中,悬臂(130)包括向下延伸的多个腿部(131和132),其防止基底(100)粘附到悬臂。 在另一个实施方案中,防止聚合物悬臂(215)通过基板上的摊铺粘贴层(205)粘附到基板(200)上,并且在悬臂形成期间,随后将粘合层作为牺牲层被去除。

    미세기계 부품을 제조하기 위한 방법
    154.
    发明公开
    미세기계 부품을 제조하기 위한 방법 有权
    制造微生物部件的方法

    公开(公告)号:KR1020100007751A

    公开(公告)日:2010-01-22

    申请号:KR1020090062085

    申请日:2009-07-08

    Abstract: PURPOSE: A method for manufacturing micromechanical components is provided to manufacture a protective mask using photosensitive resin. CONSTITUTION: A method for manufacturing micromechanical components comprises the following steps. A substrate(53) is prepared. The substrate is made of micro-machining material. A pattern is etched by using photolithography. A clip(91) is assembled on the components. The components are separated from the substrate in order to mount components inside an apparatus. The substrate is mounted on a support(81) press-fitted with a fork(87).

    Abstract translation: 目的:提供用于制造微机械部件的方法来制造使用感光树脂的保护罩。 构成:微机械部件的制造方法包括以下步骤。 制备基板(53)。 基板由微加工材料制成。 通过使用光刻法刻蚀图案。 夹子(91)组装在组件上。 部件与基板分离,以便将部件安装在设备内。 基板安装在压配合叉(87)的支撑(81)上。

    MEMS 장치 제조 방법 및 시스템
    155.
    发明公开
    MEMS 장치 제조 방법 및 시스템 无效
    用于MEMS器件制造的系统和方法

    公开(公告)号:KR1020090086921A

    公开(公告)日:2009-08-14

    申请号:KR1020090011042

    申请日:2009-02-11

    Abstract: An MEMS device manufacturing method and a system thereof are provided to dissolve and remove metal adhering to a residual photoresist and a substrate with leaving interconnection pattern and one or more bump characteristic parts. An MEMS device manufacturing method comprises following steps. A positive photoresist layer is formed on a substrate(32). The first area of the substrate is selectively exposed with a radiation source. The first area of the substrate is selectively exposed with the radiation source. The second area of the substrate defining one or more bump characteristic parts is exposed with the radiation source. The second area of the substrate is developed with the developing solution in order to deposit a metal layer on the top of the substrate. The metal layer is formed on the top of the substrate. The residual photoresist causing the metal evaporated on the photoresist to be removed is removed.

    Abstract translation: 提供了一种MEMS器件制造方法及其系统,用于溶解和除去附着在剩余光致抗蚀剂和基板上的金属,留下互连图案和一个或多个突起特征部分。 MEMS器件制造方法包括以下步骤。 在基板(32)上形成正性光致抗蚀剂层。 用辐射源选择性地暴露衬底的第一区域。 用辐射源选择性地暴露衬底的第一区域。 限定一个或多个突起特征部分的衬底的第二区域被辐射源暴露。 衬底的第二区域用显影溶液显影,以便在衬底的顶部上沉积金属层。 金属层形成在基板的顶部。 去除导致在光致抗蚀剂上蒸发的金属被去除的残余光致抗蚀剂。

    용해 수지를 이용하는 마이크로 전기기계 시스템 장치의재코팅 방법
    157.
    发明公开
    용해 수지를 이용하는 마이크로 전기기계 시스템 장치의재코팅 방법 有权
    涂覆微电子系统(MEMS)的方法

    公开(公告)号:KR1020020000121A

    公开(公告)日:2002-01-04

    申请号:KR1020010034904

    申请日:2001-06-20

    Abstract: PURPOSE: A method for coating micro-electromechanical system(MEMS) is provided to coat the MEMS with dissolved resins without structural damage. CONSTITUTION: A method includes the steps of: a step depositing organic resin coating material, which comprises at least 25% solids in a solvent including a surfactant and whose viscosity is not greater than 120 centistokes, on a MEMS; a step rotating the MEMS to disperse the coating material so as to prevent damage due to capillary phenomenon; and a step curing the coating material and including a step heating the MEMS to remove a majority of the solvent and lowering temperature of the MEMS to remove additional solvent.

    Abstract translation: 目的:提供一种涂覆微机电系统(MEMS)的方法,用溶解的树脂涂覆MEMS,而不会造成结构损坏。 方法:一种方法包括以下步骤:在MEMS上沉积有机树脂涂料的步骤,该有机树脂涂料在包括表面活性剂和粘度不大于120厘沲的溶剂中包含至少25%的固体; 旋转MEMS以分散涂层材料以防止毛细管现象造成的损伤的步骤; 以及固化涂层材料的步骤,并且包括步骤加热MEMS以去除大部分溶剂并降低MEMS的温度以除去附加的溶剂。

    마이크로미케니컬 부품의 제조 방법
    158.
    发明公开
    마이크로미케니컬 부품의 제조 방법 有权
    制造微机械零件的方法

    公开(公告)号:KR1020010012439A

    公开(公告)日:2001-02-15

    申请号:KR1019997010392

    申请日:1998-04-17

    Abstract: 본발명은마이크로미케니컬부품과이 부품을제조하기위한방법에관한것이다. 본발명에따라서, 이동부재(4)는희생층(2)상에형성된다. 그후이동부재(4) 하부의희생층(2)은제거되어, 상기이동부재(4)가움직일수 있다. 희생층(2)이제거된후에, 이동부재(4)의표면상에는보호층(7)이증착된다. 보호층(7)으로서는산화실리콘또는질화실리콘이이용될수 있다.

    Abstract translation: 本发明涉及一种用于制造微机械零件和部件的方法。 根据本发明,移位构件4形成在牺牲层2上。 之后,可移动部件4下方的牺牲层2被移除,使得可移动部件4能够移动。 在牺牲层2放置后,保护层7沉积在可动构件4的表面上。 作为保护层7,可以使用氧化硅或氮化硅。

    METHOD FOR WAFER-LEVEL SURFACE MICROMACHINING TO REDUCE STICTION
    159.
    发明申请
    METHOD FOR WAFER-LEVEL SURFACE MICROMACHINING TO REDUCE STICTION 审中-公开
    用于降低表面微波表面的方法

    公开(公告)号:WO2013096089A1

    公开(公告)日:2013-06-27

    申请号:PCT/US2012/069506

    申请日:2012-12-13

    Abstract: An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

    Abstract translation: 具有非超疏水材料层或涂层的微丸阵列产生超疏水表面,并且还可具有15度或更小的接触角滞后。 因此,即使表面结构和材料本身不是超疏水的,具有这种阵列的表面也可能变得超疏水。

    SELECTIVE UV-OZONE DRY ETCHING OF ANTI-STICTION COATINGS FOR MEMS DEVICE FABRICATION
    160.
    发明申请
    SELECTIVE UV-OZONE DRY ETCHING OF ANTI-STICTION COATINGS FOR MEMS DEVICE FABRICATION 审中-公开
    用于MEMS器件制造的抗反射涂层的选择性UV-臭氧干蚀刻

    公开(公告)号:WO2010147796A3

    公开(公告)日:2011-04-14

    申请号:PCT/US2010037735

    申请日:2010-06-08

    Inventor: HANCER MEHMET

    Abstract: Organic anti-stiction coatings such as, for example, hydrocarbon and fluorocarbon based self-assembled organosilanes and siloxanes applied either in solvent or via chemical vapor deposition, are selectively etched using a UV-Ozone (UVO) dry etching technique in which the portions of the organic anti-stiction coating to be etched are exposed simultaneously to multiple wavelengths of ultraviolet light that excite and dissociate organic molecules from the anti-stiction coating and generate atomic oxygen from molecular oxygen and ozone so that the organic molecules react with atomic oxygen to form volatile products that are dissipated, resulting in removal of the exposed portions of the anti-stiction coating. A hybrid etching process using heat followed by UVO exposure may be used. A shadow mask (e.g., of glass or quartz), a protective material layer, or other mechanism may be used to selective expose the portions of the anti-stiction coating to be UVO etched. Such selective UVO etching may be used, for example, to expose wafer bond lines prior to wafer-to-wafer bonding in order to increase bond shear and adhesion strength, to expose bond pads in preparation for electrical or other connections, or for general removal of anti-stiction coating materials from metal or other material surfaces. One specific embodiment uses two wavelengths of ultraviolet light, one at around 184.9 nm and the other at around 253.7 nm..

    Abstract translation: 使用UV-臭氧(UVO)干蚀刻技术选择性地蚀刻有机抗静电涂层,例如在溶剂中或通过化学气相沉积施加的烃和氟碳基自组装有机硅烷和硅氧烷,其中部分 待蚀刻的有机抗静电涂层同时暴露于多个波长的紫外线,其激发和解离有机分子与抗静电涂层,并从分子氧和臭氧产生原子氧,使得有机分子与原子氧反应形成 挥发的产物被消散,导致去除抗静电涂层的暴露部分。 可以使用使用热量然后UVO曝光的混合蚀刻工艺。 可以使用荫罩(例如,玻璃或石英),保护材料层或其他机构来选择性地将抗静电涂层的部分暴露于UVO蚀刻。 可以使用这种选择性UVO蚀刻,例如在晶片到晶片接合之前暴露晶片接合线,以增加键合剪切和粘附强度,以暴露接合焊盘以准备电气或其它连接,或用于一般去除 的抗静电涂层材料从金属或其他材料表面。 一个具体实施方案使用两个波长的紫外光,一个在约184.9nm,另一个在约253.7nm。

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