METHOD FOR WAFER-LEVEL SURFACE MICROMACHINING TO REDUCE STICTION
    1.
    发明申请
    METHOD FOR WAFER-LEVEL SURFACE MICROMACHINING TO REDUCE STICTION 审中-公开
    用于降低表面微波表面的方法

    公开(公告)号:WO2013096089A1

    公开(公告)日:2013-06-27

    申请号:PCT/US2012/069506

    申请日:2012-12-13

    Abstract: An array of microbumps with a layer or coating of non-superhydrophobic material yields a superhydrophobic surface, and may also have a contact angle hysteresis of 15 degrees or less. A surface with such an array may therefore be rendered superhydrophobic even though the surface structure and materials are not, by themselves, superhydrophobic.

    Abstract translation: 具有非超疏水材料层或涂层的微丸阵列产生超疏水表面,并且还可具有15度或更小的接触角滞后。 因此,即使表面结构和材料本身不是超疏水的,具有这种阵列的表面也可能变得超疏水。

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