Semiconductor mounting and matching assembly
    151.
    发明授权
    Semiconductor mounting and matching assembly 失效
    半导体安装和匹配组件

    公开(公告)号:US4365214A

    公开(公告)日:1982-12-21

    申请号:US190464

    申请日:1980-09-24

    CPC classification number: H01P1/201 H01P5/02

    Abstract: A semiconductor mounting and matching assembly capable of performing over a frequency range to 20 GHz and higher comprising a coaxial transmission line having a first portion with a first end for receiving radio-frequency signals and providing an input impedance and a second portion with a second signal output end providing a termination characteristic impedance. A semiconductor diode which is hermetically sealed within and removable with the second portion is mounted at the second end and has a load resistance terminating the transmission line. The transmission line has a plurality of sections for providing elements of a network which transforms the input impedance and matches the termination characteristic impedance of the second end of the transmission line to the load resistance of the semiconductor device. The elements of the network are provided by the configurations and discontinuities of the sections of the transmission line and the capacitive and inductive properties provided by the semiconductor device, whereby the network incorporates therein the parasitic reaction elements of the semiconductor device so that said assembly transmits radio-frequency signals from its input end to the semiconductor device at its output end with low reflection and attenuation over a wide-band of frequencies.

    Abstract translation: 一种能够在20GHz及更高​​频率范围内执行的半导体安装和匹配组件,包括具有第一部分的同轴传输线,第一部分具有用于接收射频信号的第一端并提供输入阻抗,第二部分具有第二信号 输出端提供端接特性阻抗。 密封在第二部分内并可移除的半导体二极管安装在第二端,并具有终止传输线的负载电阻。 传输线具有用于提供变换输入阻抗并将传输线的第二端的终端特性阻抗与半导体器件的负载电阻相匹配的网络元件的多个部分。 网络的元件由传输线的部分的配置和不连续性以及由半导体器件提供的电容和电感特性提供,由此网络中包含半导体器件的寄生反应元件,使得所述组件传输无线电 在其输出端从其输入端到半导体器件的频率信号在宽带频带上具有低反射和衰减。

Patent Agency Ranking