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公开(公告)号：US4365214A
公开(公告)日：1982-12-21
申请号：US190464
申请日：1980-09-24
Applicant: Robert W. Shillady
Inventor： Robert W. Shillady
Abstract: A semiconductor mounting and matching assembly capable of performing over a frequency range to 20 GHz and higher comprising a coaxial transmission line having a first portion with a first end for receiving radio-frequency signals and providing an input impedance and a second portion with a second signal output end providing a termination characteristic impedance. A semiconductor diode which is hermetically sealed within and removable with the second portion is mounted at the second end and has a load resistance terminating the transmission line. The transmission line has a plurality of sections for providing elements of a network which transforms the input impedance and matches the termination characteristic impedance of the second end of the transmission line to the load resistance of the semiconductor device. The elements of the network are provided by the configurations and discontinuities of the sections of the transmission line and the capacitive and inductive properties provided by the semiconductor device, whereby the network incorporates therein the parasitic reaction elements of the semiconductor device so that said assembly transmits radio-frequency signals from its input end to the semiconductor device at its output end with low reflection and attenuation over a wide-band of frequencies.
Abstract translation: 一种能够在20GHz及更高频率范围内执行的半导体安装和匹配组件，包括具有第一部分的同轴传输线，第一部分具有用于接收射频信号的第一端并提供输入阻抗，第二部分具有第二信号 输出端提供端接特性阻抗。 密封在第二部分内并可移除的半导体二极管安装在第二端，并具有终止传输线的负载电阻。 传输线具有用于提供变换输入阻抗并将传输线的第二端的终端特性阻抗与半导体器件的负载电阻相匹配的网络元件的多个部分。 网络的元件由传输线的部分的配置和不连续性以及由半导体器件提供的电容和电感特性提供，由此网络中包含半导体器件的寄生反应元件，使得所述组件传输无线电 在其输出端从其输入端到半导体器件的频率信号在宽带频带上具有低反射和衰减。
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公开(公告)号：US2950451A
公开(公告)日：1960-08-23
申请号：US41406754
申请日：1954-03-04
Applicant: GEN ELECTRIC
Inventor： GRANT CUSTIN THOMAS
CPC classification number: H01P1/2133 , H01P1/201
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公开(公告)号：US2175710A
公开(公告)日：1939-10-10
申请号：US18356838
申请日：1938-01-06
Applicant: RCA CORP
Inventor： USSELMAN GEORGE L , GOLDSTINE HALLAN E
CPC classification number: H03F3/54 , H01P1/201 , H01P5/04 , H03H7/0161
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Patent Agency Ranking
公开(公告)号：US20190238109A1
公开(公告)日：2019-08-01
申请号：US16373025
申请日：2019-04-02
Applicant: Associated Universities, Inc.
Inventor： Matthew A. Morgan
CPC classification number: H03H7/06 , H01F38/14 , H01F2038/143 , H01P1/201 , H01P1/207 , H03H7/38 , H03H7/42 , H03H7/46
Abstract: Reflectionless low-pass, high-pass, band-pass, band-stop, all-pass, all-stop, and multi-band filters, as well as a method for designing such filters is disclosed, along with a method of enhancing the performance of such filters through the use of unmatched sub-networks to realize an optimal frequency response, such as the Chebyshev equal-ripple response. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The unmatched sub-networks preferably offer additional degrees of freedom by which element values can be assigned to realize improved cutoff sharpness, stop-band rejection, or other measures of performance.
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157.发明授权公开(公告)号：US09935348B2
公开(公告)日：2018-04-03
申请号：US14651978
申请日：2013-10-10
Applicant: ZTE CORPORATION
Inventor： Wanli Yu , Yulong Kang , Xiaowen Dai
CPC classification number: H01P1/2084 , H01P1/2002 , H01P1/201 , H01P7/10 , H01P11/008 , Y10T29/49018
Abstract: A method for implementing a TM dielectric resonator is provided, which includes: a dielectric resonant column component with a metal connecting plate is machined; a metal cavity with an opening at one end is machined; the metal connection plate of the dielectric resonant column component is fastened to the inner wall of the metal cavity by a screw; the opening of the metal cavity is covered with a prefabricated cover plate; and a prefabricated tuning screw is screwed from the cover plate into the metal cavity.
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公开(公告)号：US09906204B2
公开(公告)日：2018-02-27
申请号：US14714122
申请日：2015-05-15
Applicant: Nokia Technologies Oy
Inventor： Toni H. Lähteensuo , Brecht Francois , Niels Bonne Larsen , Lingkai Kong
Abstract: Methods and apparatus, including computer program products, are provided for tunable filters and/or front-ends. In one aspect there is provided an apparatus. The apparatus may a first band filter; a second tunable band filter; and a radio frequency switch coupled to at least the first band filter and the second tunable band filter, wherein the radio frequency switch is configured to switch between at least the first band filter and the second tunable band filter. Related apparatus, systems, methods, and articles are also described.
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公开(公告)号：US20170330824A1
公开(公告)日：2017-11-16
申请号：US15497189
申请日：2017-04-25
Applicant: Panasonic Corporation
Inventor： OSAMU TABATA , SHUICHI NAGAI , SONGBAEK CHOE
IPC: H01L23/495 , H01L23/522 , H01L25/00 , H01P1/201 , H01F38/14 , H04B5/00 , H01P5/02 , H01P7/08 , H01L21/56
CPC classification number: H01L23/49575 , H01F38/14 , H01L21/565 , H01L23/48 , H01L23/49 , H01L23/495 , H01L23/49541 , H01L23/49551 , H01L23/5227 , H01L25/00 , H01L2224/2919 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/49109 , H01L2224/49171 , H01L2224/49175 , H01L2224/49177 , H01L2224/73265 , H01L2924/01079 , H01P1/201 , H01P1/20345 , H01P5/028 , H01P7/08 , H04B5/0025 , H04B5/0093 , H01L2924/0665 , H01L2924/00
Abstract: A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.
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160.发明授权公开(公告)号：US09812752B2
公开(公告)日：2017-11-07
申请号：US15218626
申请日：2016-07-25
Applicant: QUALCOMM Incorporated
Inventor： John Jong-Hoon Lee , Young Kyu Song , Uei-Ming Jow , Sangjo Choi , Xiaonan Zhang
IPC: H01P1/20 , H01P7/06 , H01L21/00 , H01L27/15 , H01L23/66 , H01L49/02 , H03B5/18 , H01P1/201 , H01P1/207 , H01L23/552 , H01L21/48 , H01L23/522 , H01L23/60 , H01L23/00 , H05K1/02
CPC classification number: H01P1/207 , H01L21/4853 , H01L23/5222 , H01L23/5227 , H01L23/552 , H01L23/60 , H01L23/66 , H01L24/16 , H01L28/10 , H01L28/40 , H01L2223/6627 , H01L2223/6666 , H01L2223/6672 , H01L2224/10 , H01L2224/16227 , H01P1/201 , H01P7/06 , H01P7/065 , H03B5/1817 , H05K1/0243
Abstract: A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
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