公开(公告)号：US20100284112A1

公开(公告)日：2010-11-11

申请号：US12841899

申请日：2010-07-22

Applicant: Takeshi OHWE

Inventor： Takeshi OHWE

IPC: G11B5/48

CPC classification number: H05K1/0221 ,  G11B5/486 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/056 ,  H05K2201/037 ,  H05K2201/09809

Abstract: According to one embodiment, a head suspension unit includes: a head suspension; a thin plate body of a flexure attached to a surface of the head suspension and holding an insulating layer on the surface thereof; a wiring pattern formed on a surface of the insulating layer and forming a hollow conductor defining a hollow space extending along the surface of the insulating layer; and an insulating material filling the hollow space.

Abstract translation: 根据一个实施例，头悬挂单元包括：头悬挂; 挠曲件的薄板体，附接到头部悬挂件的表面并在其表面上保持绝缘层; 形成在所述绝缘层的表面上并形成限定沿所述绝缘层的表面延伸的中空空间的中空导体的布线图案; 以及填充中空空间的绝缘材料。

公开(公告)号：US20080014668A1

公开(公告)日：2008-01-17

申请号：US11862149

申请日：2007-09-26

Applicant: Gary Brist ,  Bryce Horine ,  Stephen Hall

Inventor： Gary Brist ,  Bryce Horine ,  Stephen Hall

IPC: H01L21/00

CPC classification number: H05K1/024 ,  H01P3/121 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981

Abstract: In some embodiments a channel is formed by combining two imprinted subparts each made of printed circuit board material and the imprinted subparts are laminated to form a waveguide. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通过组合由印刷电路板材料制成的两个压印的子部件形成通道，并且压印的子部件被层压以形成波导。 描述和要求保护其他实施例。

公开(公告)号：US20070154157A1

公开(公告)日：2007-07-05

申请号：US11322964

申请日：2005-12-30

Applicant: Bryce D. Horine ,  Gary A. Brist ,  Stephen H. Hall

Inventor： Bryce D. Horine ,  Gary A. Brist ,  Stephen H. Hall

IPC: G02B6/10

CPC classification number: H05K1/024 ,  H01P3/121 ,  H01P11/002 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981 ,  Y10T156/1002

Abstract: In some embodiments a channel is formed in printed circuit board material, the formed channel is plated to form at least two side walls of a quasi-waveguide, and printed circuit board material is laminated to the plated channel using thermoset adhesive. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通道形成在印刷电路板材料中，形成的通道被电镀以形成准波导的至少两个侧壁，并且使用热固性粘合剂将印刷电路板材料层压到电镀通道上。 描述和要求保护其他实施例。

公开(公告)号：US20070154156A1

公开(公告)日：2007-07-05

申请号：US11322488

申请日：2005-12-30

Applicant: Gary Brist ,  Bryce Horine ,  Stephen Hall

Inventor： Gary Brist ,  Bryce Horine ,  Stephen Hall

IPC: G02B6/10

CPC classification number: H05K1/024 ,  H01P3/121 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981

Abstract: In some embodiments a channel is formed by combining two imprinted subparts each made of printed circuit board material and the imprinted subparts are laminated to form a waveguide. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，通过组合由印刷电路板材料制成的两个压印的子部件形成通道，并且将压印的子部件层压以形成波导。 描述和要求保护其他实施例。

公开(公告)号：US20070120618A1

公开(公告)日：2007-05-31

申请号：US11556900

申请日：2006-11-06

Applicant: Nicolas PEULEVEY ,  Jerome Aucourt

Inventor： Nicolas PEULEVEY ,  Jerome Aucourt

IPC: H01P5/107

CPC classification number: H05K1/0237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H05K1/0272 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/043 ,  H05K2201/09981 ,  H05K2203/061 ,  H05K2203/063 ,  H01L2924/00014

Abstract: Circuit board (1) and method of producing thereof, the circuit board having a cavity for microstrip to waveguide transition means (2) defined by a hollow space on the walls of which a protection layer (21) is provided. A microelectronic substrate (33) is placed upon an adhesive film (31) adhered onto a surface of the circuit board (1), the adhesive film being pre-cut in selected areas (32) thereof providing openings therethrough. A metal layer (5) is disposed on the resulting structure, wherein a selected part (51) of the metal layer (5) present on a surface of microelectronics substrate 33, facing the hollow space defined by the cavity for microstrip to waveguide transition means (2) is removed.

Abstract translation: 电路板（1）及其制造方法，所述电路板具有用于微波至腔室的波导过渡装置（2），所述空腔由设置有保护层（21）的壁上的中空空间限定。 将微电子基板（33）放置在附着在电路板（1）的表面上的粘合膜（31）上，在其选定的区域（32）中预先切割粘合膜，从而提供穿过其中的开口。 金属层（5）设置在所得结构上，其中存在于微电子基板33的表面上的金属层（5）的选定部分（51）面向由用于微带的空腔限定的中空空间至波导过渡装置 （2）被移除。

公开(公告)号：US06876279B2

公开(公告)日：2005-04-05

申请号：US10068512

申请日：2002-02-06

Applicant: Louise Sengupta ,  Steven C. Stowell ,  Yongfei Zhu ,  Somnath Sengupta ,  Luna H. Chiu ,  Xubai Zhang

Inventor： Louise Sengupta ,  Steven C. Stowell ,  Yongfei Zhu ,  Somnath Sengupta ,  Luna H. Chiu ,  Xubai Zhang

IPC: B32B7/02 ,  H01P1/18 ,  H01P3/00 ,  H01P3/02 ,  H01P3/06 ,  H01P3/08 ,  H01P3/12 ,  H01P3/16 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置。

公开(公告)号：US06798320B2

公开(公告)日：2004-09-28

申请号：US10059623

申请日：2002-01-29

Applicant: Yutaka Ida ,  Yoshikazu Yagi ,  Tsutomu Ieki ,  Hiroaki Tanaka ,  Osamu Chikagawa

Inventor： Yutaka Ida ,  Yoshikazu Yagi ,  Tsutomu Ieki ,  Hiroaki Tanaka ,  Osamu Chikagawa

IPC: H01P308

CPC classification number: H01P3/081 ,  H01P1/20363 ,  H01P1/20381 ,  H01P3/088 ,  H01P7/082 ,  H01P11/003 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/162 ,  H05K3/107 ,  H05K3/4092 ,  H05K2201/037 ,  H05K2201/09036 ,  H05K2201/098 ,  H05K2201/09981

Abstract: A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.

Abstract translation: 微带线包括带状导体，线电极和设置在线电极两侧边缘的边缘电极。 微带线的结构大大降低了线电极的边缘效应，并降低了线电极的导体损耗。

公开(公告)号：US06724283B2

公开(公告)日：2004-04-20

申请号：US09984438

申请日：2001-10-30

Applicant: Leif Bergstedt ,  Spartak Gevorgian

Inventor： Leif Bergstedt ,  Spartak Gevorgian

IPC: H01P308

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/0237 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2201/09809

Abstract: The invention relates to a microwaveguide that is integrated in the dielectric layer of a conductor carrier, e.g. a printed circuit board. The waveguide enables different types of active and/or passive functions intended to influence the signals sent through the waveguide to be integrated at appropriate positions in the waveguide.

Abstract translation: 本发明涉及一种集成在导体载体的介电层中的微波导体，例如， 印刷电路板。 波导使不同类型的有源和/或无源功能旨在影响通过波导发送的信号，以集成在波导中的适当位置。

公开(公告)号：US06683516B2

公开(公告)日：2004-01-27

申请号：US10068707

申请日：2002-02-06

Applicant: Luna H. Chiu ,  Yongfei Zhu ,  Xubai Zhang ,  Steven C. Stowell ,  Andrey Kozyrev ,  Somnath Sengupta ,  Louise Sengupta

Inventor： Luna H. Chiu ,  Yongfei Zhu ,  Xubai Zhang ,  Steven C. Stowell ,  Andrey Kozyrev ,  Somnath Sengupta ,  Louise Sengupta

IPC: H01P706

CPC classification number: H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

Abstract: A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including coaxial cables, cavity antennas, microstrip lines, coplanar lines, and waveguides.

Abstract translation: 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导在内的各种装置。

公开(公告)号：US20030059151A1

公开(公告)日：2003-03-27

申请号：US09963637

申请日：2001-09-27

Inventor： Gary A. Brist ,  Carlos Mejia ,  William O. Alger ,  Gary B. Long

IPC: G02B006/12 ,  C03C017/06

CPC classification number: H05K1/0237 ,  H01P11/002 ,  H05K3/0017 ,  H05K2201/037 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09981

Abstract: A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.

Abstract translation: 提供了一种用于在印刷电路板中形成波导的方法。 这可以包括在印刷电路板基板中形成沟槽并沿着沟槽形成至少一个金属化表面。 可以在沟槽上方设置金属化封盖表面，以便形成波导结构。