公开(公告)号：DE102009027088A1

公开(公告)日：2010-06-24

申请号：DE102009027088

申请日：2009-06-23

Applicant: ASKEY COMPUTER CORP

Inventor： YANG CHIH-MING ,  HUANG CHIEN-HAO ,  TSAI CHAO-NAN ,  HSIEH CHING-FENG ,  CHANG CHIN-CHING ,  TSAI CHUN-HSIUNG ,  CHANG PI-CHI ,  HUANG CHIH-WEI

IPC: H01P3/00

Abstract: Ein Träger zum Übertragen von Hochfrequenzsignalen und eine entsprechende Träger-Layoutmethode. Der Träger besteht aus einem Substrat, Leitungsdrähten und Bezugsebenen auf dem Substrat. Bei der Träger-Layoutmethode werden die Impedanz und die Dicke des Trägers entsprechend des Hochfrequenzsignals und die Layoutparameter entsprechend der Impedanz und Dicke festgelegt. Zu den Layoutparametern gehört eine Leitungsschicht, die auf die Leitungsdrähte aufgetragen wird, ein koplanarer Wellenleiter zwischen den Bezugsebenen und die Leitungsdrähte, wobei sich auf den Leitungsdrähten raue und abgesetzte Bereiche befinden. Das Substrat hat einen hohen dielektrischen Verlustfaktor. Das Layout wird entsprechend den oben festgelegten Layoutparametern ausgeführt, um die Verluste der Hochfrequenzsignale bei der Übertragung zu erhöhen.

公开(公告)号：GB2464570A

公开(公告)日：2010-04-28

申请号：GB0905845

申请日：2009-04-03

Applicant: ASKEY COMPUTER CORP

Inventor： LEE CHIA-HUNG ,  YU JEN-HUAN ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K13/04 ,  B23P19/02 ,  H05K9/00

Abstract: Apparatus and method for assembling an isolation cover to a main body of a circuit board using a press-fit device having mechanism (13) attached to a drive mechanism (15 — see figs 3, 5). Preferably comprising handle (155). The cover 30 has positioning portions 301 pass through respective holes in the board 50. The press-fit device base has a supporting portion 113 receiving first (fig 6a) the cover 30 and then the board (fig 6b) 50 on top so that the positioning portions 1331 extending past the underside of the board to face the press-fit means (13 figs 3, 5). The driving mechanism presses the press-fit means onto the board and cover so as to bend and fasten ends of the positioning portions 301, preferably via a central portion continuing to move downwards (see figures 6e, 6f) relative to sprung guiding and bending elements 133.

公开(公告)号：DE102009001744A1

公开(公告)日：2010-04-15

申请号：DE102009001744

申请日：2009-03-23

Applicant: ASKEY COMPUTER CORP

Inventor： HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K9/00

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

公开(公告)号：DE102009001741A1

公开(公告)日：2010-04-15

申请号：DE102009001741

申请日：2009-03-23

Applicant: ASKEY COMPUTER CORP

Inventor： CHEN KUO-CHING ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN

IPC: H05K9/00 ,  H05K1/18

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

公开(公告)号：GB0921070D0

公开(公告)日：2010-01-13

申请号：GB0921070

申请日：2009-12-02

Applicant: ASKEY COMPUTER CORP

Abstract: The hand-held electronic device includes a central processing unit, a memory unit, a state-detecting unit, a state-determining unit, a main power supply unit, a standby power supply unit, and a power supply switching unit. After determining the presence of a fall state, the state-determining unit will output a fall instruction and which causes the central processing unit to enter a low current mode; meanwhile, the power supply switching unit monitors power output and continues to supply low-potential power. In case of a fall of the hand-held electronic device, the device and method protect operation data and reduce the otherwise power-consuming current. The less power-consuming current is conducive to the reduction of capacitance required for a backup battery. The low current mode is effective in reducing the time taken to recover the operation mode of the electronic device.

公开(公告)号：GB0918374D0

公开(公告)日：2009-12-02

申请号：GB0918374

申请日：2009-10-21

Applicant: ASKEY COMPUTER CORP

Abstract: A modular keyboard includes an upper casing, a lower casing corresponding to the upper casing, an electric conduction element and a circuit board. The upper casing includes a first side and a second side opposite to each other, and a plurality of press keys disposed on the first side. The lower casing is set for sealing the second side, and an enclosure space is formed between the upper casing and the lower casing. The electric conduction element is installed on the second side in the enclosure space, and the circuit board is installed between the electric conduction element and the lower casing. With a supersonic welding technique, the upper casing and the lower casing are engaged with each other to seal the enclosure space and isolate the electric conduction element in the enclosure space and the circuit board from the exterior.

公开(公告)号：GB0915803D0

公开(公告)日：2009-10-07

申请号：GB0915803

申请日：2009-09-10

Applicant: ASKEY COMPUTER CORP

公开(公告)号：GB0905845D0

公开(公告)日：2009-05-20

申请号：GB0905845

申请日：2009-04-03

Applicant: ASKEY COMPUTER CORP

Abstract: An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.

公开(公告)号：GB2428335A

公开(公告)日：2007-01-24

申请号：GB0514266

申请日：2005-07-12

Applicant: ASKEY COMPUTER CORP

Inventor： TSENG YI-WEN

IPC: H01R35/04 ,  G06F1/16

Abstract: An electronic device has a connecting unit 10 and a unit body 20. The connecting unit has a connector 13, such as a USB connector, at one end. The housing contains an electronic circuit assembly 22. The connecting unit has a pivoting portion 164 having a substantially spherical contour, so that the connecting unit and the unit body are joined by a ball joint. The circuit may be a wireless transceiver or a data storage device.

公开(公告)号：DE102011086065A1

公开(公告)日：2012-11-22

申请号：DE102011086065

申请日：2011-11-10

Applicant: ASKEY COMPUTER CORP ,  ASKEY TECHNOLOGY JIANGSU LTD

Inventor： WEN HSAING-SHENG ,  HSIEH CHING-FENG

IPC: H04M11/06

Abstract: Eine Hybridschaltung für eine sehr schnelle digitale Teilnehmerleitung (VDSL) blockiert Rauschen und weist eine Transceiver-Einheit, ein Spannungstransformationsmodul, einen Gleichstrom-(DC)-Sperrkondensator, eine Empfangseinheit und eine Übertragungseinheit auf. Das Spannungstransformationsmodul blockiert das Rauschen, welches als Ergebnis der Übertragung eines Upstream-Signals und eines Downstream-Signals an der Transceiver-Einheit erzeugt wurde, und weist eine erste Spannungstransformationseinheit und eine zweite Spannungstransformationseinheit auf. Der DC-Sperrkondensator ist zwischen Primformationseinheit in Reihe geschaltet, um zu verhindern, dass der Direktstrom in der VDSL die Übertragung des Upstream-Signals und des Downstream-Signals beeinflusst. Dementsprechend vereinfacht die Hybridschaltung den Schaltungsentwurf der VDSL, senkt Kosten, die auf die elektronischen Komponenten zurückzuführen sind, und verringert die für das Schaltungslayout erforderliche Fläche.