公开(公告)号：JP2010093219A

公开(公告)日：2010-04-22

申请号：JP2009032673

申请日：2009-02-16

Applicant: Askey Computer Corp ,  亞旭電腦股▲ふん▼有限公司

Inventor： CHEN KUO-CHING ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN

IPC: H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0028 ,  H05K1/0256 ,  H05K3/301 ,  H05K3/341 ,  Y10T29/49124

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board of a communication product capable of simplifying manufacturing process and maintenance procedures, and a method of manufacturing the circuit board of the communication product. SOLUTION: The method of manufacturing the circuit board of the communication product comprises the steps of: providing a circuit board body 11; installing a power transistor 110, an insulating layer 115, plural first openings located around the power transistor 110 on the insulating layer 115 at certain intervals on a front surface of the circuit board body 11 and plural soldering parts 113 exposed to the first openings; providing an isolation cover 13 which is equipped with a cover body 131 and plural second openings 133 opened at equivalent distances on a side surface of the cover body 131; covering the front surface of the circuit board body 11 with the isolation cover 13; adopting a local soldering system; and soldering the isolation cover 13 to each of the soldering parts 113. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供能够简化制造过程和维护程序的通信产品的电路板，以及制造通信产品的电路板的方法。 解决方案：通信产品的电路板的制造方法包括以下步骤：提供电路板主体11; 在电路板主体11的前表面上以一定间隔安装功率晶体管110，绝缘层115，绝缘层115周围的功率晶体管110周围的多个第一开口和暴露于第一开口的多个焊接部113; 提供隔离盖13，该隔离盖13配备有盖体131和在盖体131的侧表面上等距离地开放的多个第二开口133; 用隔离盖13覆盖电路板主体11的前表面; 采用本地焊接系统; 并将隔离盖13焊接到每个焊接部113。版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010098287A

公开(公告)日：2010-04-30

申请号：JP2009105109

申请日：2009-04-23

Applicant: Askey Computer Corp ,  亞旭電腦股▲ふん▼有限公司

Inventor： LEE CHIA-HUNG ,  YU JEN-HUAN ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K9/00

CPC classification number: H05K9/0022 ,  H05K13/0447 ,  H05K13/0473 ,  Y10T29/49126 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53252 ,  Y10T29/5327

Abstract: PROBLEM TO BE SOLVED: To provide an assembling jig capable of reducing manufacturing cost of a circuit board, improving a manufacturing yield, and stabilizing positioning. SOLUTION: The assembling jig 1 includes: a base 11 having a shield cover and a mounting part 113 for arranging a circuit board body thereon; a press-bonding mechanism 13 movably connected to the base 11 and having a press-bonding part facing the mounting part 113; and a drive mechanism 15 arranged on the base 11 having a drive part 151 connected to a press-bonding mechanism 13, driving the press-bonding mechanism 13 by the drive part 151 moved in the direction of the mounting part 113, bending and respective second positioning parts, and making the second positioning parts engaged with each other. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种能够降低电路板的制造成本，提高制造成品率和稳定定位的组装夹具。 解决方案：组装夹具1包括：具有屏蔽盖的基座11和用于在其上布置电路板主体的安装部113; 压接机构13，其可移动地连接到基座11并具有面向安装部113的压接部; 以及驱动机构15，其配置在具有与压接机构13连接的驱动部151的基座11上，通过沿着安装部113的方向移动的驱动部151来驱动压接机构13， 定位部件，并使第二定位部件彼此接合。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010093220A

公开(公告)日：2010-04-22

申请号：JP2009032693

申请日：2009-02-16

Applicant: Askey Computer Corp ,  亞旭電腦股▲ふん▼有限公司

Inventor： HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0026 ,  Y10T29/49124

Abstract: PROBLEM TO BE SOLVED: To provide a circuit board equipped with an isolation cover, and a method of assembling the circuit board equipped with the isolation cover. SOLUTION: In the circuit board equipped with the isolation cover and the method of assembling the circuit board equipped with the isolation cover, the circuit board is provided with a circuit board body and the isolation cover provided in the circuit board body. The circuit board body and the isolation cover are provided with a plurality of first normal positions and a plurality of second normal positions which are faced with each other. And, a ground is provided in at least one side of each of the first normal positions. The isolation cover is arranged while covering a first front surface of the circuit board body. Each of the second normal positions is penetrated in a second front surface of the circuit board body through each of the first normal positions, and an end of each of the second normal positions is press-fitted to each of the grounds, thereby completing the assembly. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种配备有隔离盖的电路板，以及组装配有隔离盖的电路板的方法。

解决方案：在配备有隔离盖的电路板和装配有隔离盖的电路板的方法中，电路板设置有电路板主体和设置在电路板主体中的隔离盖。 电路板主体和隔离盖设置有彼此面对的多个第一正常位置和多个第二正常位置。 并且，在每个第一正常位置的至少一侧设置地面。 隔离盖被布置成覆盖电路板主体的第一前表面。 第二正常位置中的每一个通过每个第一正常位置被穿透在电路板主体的第二前表面中，并且每个第二正常位置的端部被压配合到每个接地，从而完成组装 。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：NL1036864C

公开(公告)日：2012-02-28

申请号：NL1036864

申请日：2009-04-16

Applicant: ASKEY COMPUTER CORP

Inventor： HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K9/00

CPC classification number: H05K9/0026 ,  Y10T29/49124

公开(公告)号：ES2361547A1

公开(公告)日：2011-06-20

申请号：ES200900787

申请日：2009-03-23

Applicant: ASKEY COMPUTER CORP

Inventor： CHEN KUO-CHING ,  HSIEH CHING-FENG ,  DAI CHENG-WEN ,  HUANG CHUNG-SHAO ,  YU JEN-HUAN

IPC: H05K9/00 ,  H05K1/18 ,  H05K5/03

Abstract: Circuito impreso de producto de comunicación y su método de fabricación. El circuito impreso consta de cuerpo principal y cubierta de islamiento. La superficie del cuerpo principal del circuito impreso tiene transistor de potencia, capa islante, una pluralidad de primeras aberturas dispuestas a intervalos en la capa aislante y alrededor del transistor de potencia, y una pluralidad de partes de soldadura expuestas fuera de cada primera abertura respectivamente. La cubierta de islamiento comprende una tapa y una pluralidad de segundas aberturas abiertas equidistantemente en un lateral de la tapa. La cubierta de islamiento se dispone en la superficie del cuerpo principal del circuito impreso, y se suelda a las partes de soldadura a través de un proceso de soldadura local por puntos.

公开(公告)号：GB2464570A

公开(公告)日：2010-04-28

申请号：GB0905845

申请日：2009-04-03

Applicant: ASKEY COMPUTER CORP

Inventor： LEE CHIA-HUNG ,  YU JEN-HUAN ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K13/04 ,  B23P19/02 ,  H05K9/00

Abstract: Apparatus and method for assembling an isolation cover to a main body of a circuit board using a press-fit device having mechanism (13) attached to a drive mechanism (15 — see figs 3, 5). Preferably comprising handle (155). The cover 30 has positioning portions 301 pass through respective holes in the board 50. The press-fit device base has a supporting portion 113 receiving first (fig 6a) the cover 30 and then the board (fig 6b) 50 on top so that the positioning portions 1331 extending past the underside of the board to face the press-fit means (13 figs 3, 5). The driving mechanism presses the press-fit means onto the board and cover so as to bend and fasten ends of the positioning portions 301, preferably via a central portion continuing to move downwards (see figures 6e, 6f) relative to sprung guiding and bending elements 133.

公开(公告)号：DE102009001744A1

公开(公告)日：2010-04-15

申请号：DE102009001744

申请日：2009-03-23

Applicant: ASKEY COMPUTER CORP

Inventor： HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN ,  CHEN KUO-CHING

IPC: H05K9/00

Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.

公开(公告)号：DE102009001741A1

公开(公告)日：2010-04-15

申请号：DE102009001741

申请日：2009-03-23

Applicant: ASKEY COMPUTER CORP

Inventor： CHEN KUO-CHING ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUAN ,  DAI CHENG-WEN

IPC: H05K9/00 ,  H05K1/18

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.

公开(公告)号：IT1393924B1

公开(公告)日：2012-05-17

申请号：ITMC20090109

申请日：2009-05-13

Applicant: ASKEY COMPUTER CORP

Inventor： YU JEN-HUAN ,  DAI CHENG-WEN ,  LEE CHIA-HUNG ,  CHEN KUO-CHING ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG

公开(公告)号：NL1036863C2

公开(公告)日：2012-02-28

申请号：NL1036863

申请日：2009-04-16

Applicant: ASKEY COMPUTER CORP

Inventor： CHEN KUO-CHING ,  HUANG CHUNG-SHAO ,  HSIEH CHING-FENG ,  YU JEN-HUANG ,  DAI CHENG-WEN

IPC: H05K9/00

Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.