Abstract:
A device for pressing an electronic component with different downward forces includes a first downward-pressure generating device, a depressing head, a second downward-pressure generating device and a depressing piston. The first downward-pressure generating device has the depressing head to apply a first downward pressure to the test socket and a portion of the electronic component. The second downward-pressure generating device has the depressing piston to apply a second downward pressure downward to another portion on the electronic component, so that the electronic component can couple electrically with a plurality of probe of the test socket. Thereupon, at least two downward-pressure generating devices are included to provide at least two different downward pressures to the electronic component solely or simultaneously to the electronic component and the testing equipment, such that specific downward-pressure requirements by precision electronic components can be fulfilled.
Abstract:
A method for testing air tightness includes connecting a testing chamber and a storage chamber, supplying negative pressure to the storage chamber, measuring the pressure in the storage or testing chamber to obtain a first pressure value, determining air tightness of the testing chamber according to the negative pressure and the first pressure value, stopping the negative pressure to the storage chamber, measuring the pressure in the storage chamber to obtain a second pressure value, measuring the pressure in the storage chamber after stopping the negative pressure to the storage chamber to obtain a third pressure value, and determining air tightness of the testing chamber according to the second and third pressure values. The device includes testing and storage chambers, a negative pressure generator, and a pressure gauge connected to the storage chamber, which is connected to the testing chamber. The negative pressure generator is connected to the storage chamber.
Abstract:
A dew resistant module for a test socket, and an electronic component testing device having the same are provided. An enclosure body is provided to circumscribe the test socket; and a test socket base plate provided on top of the test socket and enclosure body. A cover is provided to cover the test socket, enclosure body and test socket base plate. With the provision of the enclosure body and the cover, the test socket, test socket base plate and a portion of the thermal head are prevented from coming into contact directly with the atmosphere, whereby condensation or dewing is prevented, thermal insulation achieved and energy consumption minimized.
Abstract:
A battery simulator for simulating the status of a battery connected to a load component includes a controllable current source, a voltage detector, and a gain controller. The controllable current source supplies an output current to the load component according to a current control signal. The voltage detector measures a detection voltage that is generated in response to the output current flowing through the load component. The gain controller is electrically connected to the controllable current source and the voltage detector and generates the current control signal according to a voltage control signal, a gain control signal and the detection voltage.
Abstract:
A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.
Abstract:
A clock generating device includes a first timing delay module, a multiplexer, and a second timing delay module. The multiplexer is electrically connected to the first timing delay module. The second timing delay module is electrically connected to the multiplexer. The first timing delay module generates a plurality of delayed clock signals based on a reference clock signal. The multiplexer outputs a first delayed clock signal and a second delayed clock signal, among the plurality of delayed clock signals, based on a clock generating signal. The second timing delay module generates an output clock signal based on the clock generating signal, the first delayed clock signal and the second delayed clock signal.
Abstract:
An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.
Abstract:
A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.
Abstract:
A wide range of temperature control equipment for controlling a tested object to a predetermined temperature is provided. The wide range of temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.
Abstract:
A test table including a chuck base, a flow guide mechanism and a dry air generator is provided. The chuck base includes a test area. The flow guide mechanism is disposed around the chuck base. The dry air generator connects to the flow guide mechanism for generating a dry air. The flow guide mechanism guides the dry air to flow toward the test area to cover the test area and the object to be tested and to create a dry environment to prevent dew condensation.