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公开(公告)号:US20240427085A1
公开(公告)日:2024-12-26
申请号:US18652174
申请日:2024-05-01
Applicant: Skorpios Technologies, Inc.
Inventor: Majid Sodagar , Wenyi Wang , Changyi Li , Guoliang Li , Murtaza Askari , Yi Wang , John Dallesasse , Stephen B. Krasulick
Abstract: A polarization-independent, optical circulator is formed in silicon photonics. The polarization-independent, optical circulator uses an optical splitter having two couplers and two waveguides joining the two couplers. One of the two waveguides is thinner than the other to create a large effective index difference between TE and TM modes transmitted through the one waveguide. Polarization rotators, including reciprocal and/or non-reciprocal rotators, are further used to create the optical circulator.
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公开(公告)号:US20210184435A1
公开(公告)日:2021-06-17
申请号:US17061305
申请日:2020-10-01
Applicant: Skorpios Technologies, Inc.
Inventor: John Y. Spann , John Zyskind
IPC: H01S5/30
Abstract: A method of fabricating a gain medium includes growing a p-type layer doped with zinc on a substrate, growing an undoped layer including one or both of InP or InGaAsP on the p-type layer, growing a region that includes multiple quantum wells (MQWs) on the undoped layer, and growing an n-type layer on the region. The undoped layer has a thickness that is sufficient to prevent Zn diffusion from the p-type layer into the region during subsequent growth or wafer fabrication steps.
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公开(公告)号:US20210116295A1
公开(公告)日:2021-04-22
申请号:US16914117
申请日:2020-06-26
Applicant: Skorpios Technologies, Inc.
Inventor: Robert J. Stone , Stephen B. Krasulick
IPC: G01J1/08 , G01R31/3187 , H04B10/073 , H04B10/035 , H04B10/077 , H04B17/00 , G01J1/42
Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.
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公开(公告)号:US10928588B2
公开(公告)日:2021-02-23
申请号:US16160706
申请日:2018-10-15
Applicant: Skorpios Technologies, Inc.
Inventor: Majid Sodagar , Stephen B. Krasulick , John Zyskind , Paveen Apiratikul , Luca Cafiero
Abstract: A device for optical communication is described. The device comprises two transceivers integrated on one chip. A first transceiver can be used with existing optical-communication architecture. As a more advanced optical-communication architecture becomes adopted, the device can be switched from using the first transceiver to using a second transceiver to communicate using the more advanced optical-communication architecture.
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公开(公告)号:US10768369B2
公开(公告)日:2020-09-08
申请号:US16428193
申请日:2019-05-31
Applicant: Skorpios Technologies, Inc.
Inventor: Guoliang Li , Damien Lambert , Nikhil Kumar
Abstract: A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder and a ridge. In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages having different widths at a given cross section.
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公开(公告)号:US20190384002A1
公开(公告)日:2019-12-19
申请号:US16245615
申请日:2019-01-11
Applicant: Skorpios Technologies, Inc.
Inventor: Damien Lambert
IPC: G02B6/12 , H01S5/022 , G02B6/122 , G02B6/136 , H01S5/02 , H01S5/026 , H01S5/028 , H01S5/22 , H01S5/30 , H01S5/343 , H01S5/40 , H04B10/50 , H04J14/02
Abstract: A photonic device includes a semiconductor wafer having a waveguide formed therein. An end of the waveguide includes a step. The photonic device further includes a semiconductor chip bonded to the semiconductor wafer and having an active region, and a waveguide coupler disposed in a gap between a sidewall of the semiconductor chip and the end of the waveguide. The waveguide coupler includes an optical bridge that has a first end and a second end opposing the first end. The first end of the optical bridge is interfaced with a facet of the active region of the semiconductor chip. The second end of the optical bridge is interfaced with the end of waveguide, and has a portion thereof disposed over the step at the end of the waveguide.
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公开(公告)号:US10509163B2
公开(公告)日:2019-12-17
申请号:US15426823
申请日:2017-02-07
Applicant: Skorpios Technologies, Inc.
Inventor: Guoliang Li , Stephen B. Krasulick , Samir Desai
IPC: G02B6/12 , H04B10/50 , H01S5/022 , G02B6/122 , G02B6/136 , H01S5/02 , H01S5/028 , H01S5/22 , H01S5/343 , H01S5/40 , H01S5/30 , H04J14/02 , H01S5/026
Abstract: A 400 Gb/s transmitter is integrated on a silicon substrate. The transmitter uses four gain chips, sixteen lasers, four modulators to modulate the sixteen lasers at 25 Gb/s, and four multiplexers to produce four optical outputs. Each optical output can transmit at 100 Gb/s to produce a 400 Gb/s transmitter. Other variations are also described.
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168.
公开(公告)号:US20190379476A1
公开(公告)日:2019-12-12
申请号:US16224409
申请日:2018-12-18
Applicant: Skorpios Technologies, Inc.
Inventor: Guoliang Li , Murtaza Askari
Abstract: An optical receiver, used in wavelength-division multiplexing, has multiple photodetectors per channel. The optical receiver comprises a demultiplexer to separate incoming light into different output waveguides, one output waveguide for each channel. A splitter is used in each output waveguide to split each output waveguide into two or more branches. A separate photodetector is coupled with each branch so that two or more photodetectors are used to measure each channel.
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公开(公告)号:US20190170953A1
公开(公告)日:2019-06-06
申请号:US16140006
申请日:2018-09-24
Applicant: Skorpios Technologies, Inc.
Inventor: Daming Liu , John Zyskind
Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.
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公开(公告)号:US20190170572A1
公开(公告)日:2019-06-06
申请号:US16178840
申请日:2018-11-02
Applicant: Skorpios Technologies, Inc.
Inventor: Robert J. Stone , Stephen B. Krasulick
IPC: G01J1/08 , H04B17/00 , H04B10/073 , G01J1/42 , G01R31/3187 , H04B10/077 , H04B10/035
CPC classification number: G01J1/08 , G01J1/42 , G01J2001/083 , G01J2001/4247 , G01R31/3187 , H04B10/035 , H04B10/0731 , H04B10/0779 , H04B17/0082
Abstract: A photonics system includes a transmit photonics module and a receive photonics module. The photonics system also includes a transmit waveguide coupled to the transmit photonics module, a first optical switch integrated with the transmit waveguide, and a diagnostics waveguide optically coupled to the first optical switch. The photonics system further includes a receive waveguide coupled to the receive photonics module and a second optical switch integrated with the receive waveguide and optically coupled to the diagnostics waveguide.
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