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    Photostructured Mechanical Devices and Methods for Making Same
    161.
    发明申请
    Photostructured Mechanical Devices and Methods for Making Same 审中-公开
    光电结构机械设备及其制作方法

    公开(公告)号：US20110167941A1

    公开(公告)日：2011-07-14

    申请号：US12686976

    申请日：2010-01-13

    Applicant: Henry Helvajian

    Inventor： Henry Helvajian

    IPC: F16M11/00 ,  B23P11/00

    CPC classification number: B81C1/00634 ,  B81B2201/051 ,  B81B2203/0338

    Abstract: A photostructurable ceramic is processed using photostructuring process steps for embedding devices within a photostructurable ceramic volume, the devices may include one or more of chemical, mechanical, electronic, electromagnetic, optical, and acoustic devices, all made in part by creating device material within the ceramic or by disposing a device material through surface ports of the ceramic volume, with the devices being interconnected using internal connections and surface interfaces.

    Abstract translation: 使用用于将器件嵌入可光可陶瓷陶瓷体积内的光学结构化工艺步骤来处理可光电陶瓷，该器件可以包括化学，机械，电子，电磁，光学和声学设备中的一种或多种，​​所有这些都部分地通过在 陶瓷或通过陶瓷体的表面端口设置器件材料，使用内部连接和表面接口互连这些器件。

    Microchip and Process for Producing Microchip
    162.
    发明申请
    Microchip and Process for Producing Microchip 有权
    Microchip和Microchip生产工艺

    公开(公告)号：US20110135539A1

    公开(公告)日：2011-06-09

    申请号：US13057466

    申请日：2009-07-13

    Applicant: Kanji Sekihara ,  Takehiko Goshima

    Inventor： Kanji Sekihara ,  Takehiko Goshima

    IPC: G01N33/48 ,  B29C45/14

    CPC classification number: B81C99/009 ,  B01J2219/00891 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B01L2200/141 ,  B01L2300/0816 ,  B29C45/2628 ,  B29C45/40 ,  B29C65/02 ,  B29C66/54 ,  B29L2031/756 ,  B81B2201/051 ,  B81B2203/0338 ,  B81B2203/0384 ,  B81C2201/034

    Abstract: A microchip which comprises: a resinous base having a plurality of fine channels formed on one side thereof, one or more cylindrical parts disposed so as to protrude from the other side, and a through-hole which pierces each cylindrical part along the axis thereof and communicates with the fine channel so that the diameter of the inner wall of the through-hole gradually decreases from the tip end of the cylindrical part toward the fine channel at a first inclination angle; and a resinous covering member bonded to that side of the resinous base on which the fine channels have been formed. The microchip has been configured so that a liquid sample can be introduced from the tip end of each cylindrical part through the through-hole. The wall thickness of the cylindrical part on the end side where a liquid sample is to be introduced has been made smaller than the wall thickness thereof on the base side where the cylindrical part has been formed, by forming a step therebetween.

    Abstract translation: 一种微芯片，包括：具有形成在其一侧上的多个细通道的树脂基底，一个或多个从另一侧突出设置的圆柱形部分，以及沿着其轴线刺穿每个圆柱形部分的通孔， 与细通道连通，使得通孔的内壁的直径从圆筒部的前端朝向第一倾斜角的细通道逐渐减小; 以及与形成有微细通道的树脂基底的该侧接合的树脂覆盖部件。 微芯片已经被构造成使得液体样品可以通过通孔从每个圆柱形部分的末端引入。 通过在它们之间形成一个台阶，使得待引入液体样品的端侧的圆筒部分的壁厚比通过形成圆柱形部分的基底侧的壁厚小。

    Micro fluid chip
    164.
    发明授权
    Micro fluid chip 有权
    微流体芯片

    公开(公告)号：US07485266B2

    公开(公告)日：2009-02-03

    申请号：US11039940

    申请日：2005-01-24

    Applicant: Yuzuru Ito ,  Yoshishige Endo ,  Akira Koide

    Inventor： Yuzuru Ito ,  Yoshishige Endo ,  Akira Koide

    IPC: B01J19/26 ,  B01F340/06 ,  B01J19/00

    CPC classification number: B01F13/0062 ,  B01F5/0451 ,  B01F5/0453 ,  B01F5/0456 ,  B01F5/0646 ,  B01F5/0647 ,  B01F13/0066 ,  B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00889 ,  B01J2219/00891 ,  B81B1/00 ,  B81B2201/051

    Abstract: The invention relates to a micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing and reaction (chemical reaction) of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port. A micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing/reaction of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port, the micro fluid chip comprising liquid supplies that supply a plurality of flows, which are formed by division of two kinds of liquids, respectively, in an alternate arrangement, and a flow flattening portion provided downstream of the liquid supplies to be configured in flow passage such that liquids alternately arranged are decreased in dimension as they go downstream and increased in dimension in a direction, which intersects the direction of arrangement and a direction of flow, as they go downstream, to be made substantially the same or slightly large in cross sectional area in the direction of flow. According to the invention, liquids of large flow rates can be processed at high speed and an apparatus is not made large in size.

    Abstract translation: 本发明涉及将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片，进行微流路中的液体的混合和反应（化学反应），得到液体 从液体排出口处理。 将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片，进行微小流路中的液体的混合/反应，得到从液体排出口处理的液体， 微流体芯片包括供给多个流的液体供应源，其分别通过以交替排列分开两种液体形成的流动平面化部分和设置在流动通道中构成的液体供应的下游的流动平坦化部分， 交替布置的液体随着它们向下游而在尺寸上减小，并且随着它们向下游而在与排列方向和流动方向相交的方向上的尺寸增大，使得其横截面积基本相同或稍大 在流动的方向。 根据本发明，可以高速度地处理大流量的液体，并且不会使装置尺寸变大。

    Microfluidics Package and Method of Fabricating the Same
    166.
    发明申请
    Microfluidics Package and Method of Fabricating the Same 审中-公开
    微流体包装及其制造方法

    公开(公告)号：US20080199362A1

    公开(公告)日：2008-08-21

    申请号：US11816396

    申请日：2005-02-15

    Applicant: Ser Choong Chong ,  Ling Xie ,  Hongmiao Ji ,  Jing Li ,  Yu Chen ,  Levent Yobas

    Inventor： Ser Choong Chong ,  Ling Xie ,  Hongmiao Ji ,  Jing Li ,  Yu Chen ,  Levent Yobas

    IPC: B01L3/00

    CPC classification number: B81B7/0061 ,  B01F5/0603 ,  B01F13/0059 ,  B01L3/502707 ,  B01L3/502715 ,  B01L9/527 ,  B01L2200/028 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0887 ,  B81B2201/051 ,  B81B2201/058

    Abstract: A microfluidics package (1) comprising a substrate (6) having a top surface, said top surface comprises at least one fluid channel (11, 12), at least one fluidic chip (2) having a top surface, a bottom surface, at least one side surface, and at least one passage to allow a fluid to traverse from the top surface or any side surface to the bottom surface of the chip; sides are adhesive, wherein the first adhesive side of the sheet (4) is secured to the substrate (6), and the at least one fluidic chip (2) is secured by the second adhesive side of the sheet (4), said fluidic chip (2) being arranged such that the at least one passage of the fluidic chip is in fluid communication with the at least one fluid channel (11, 12) of the substrate.

    Abstract translation: 一种微流体封装（1），包括具有顶表面的衬底（6），所述顶表面包括至少一个流体通道（11,12），至少一个流体芯片（2），其具有顶表面，底表面， 至少一个侧表面和至少一个通道，以允许流体从所述芯片的顶表面或任何侧表面到所述底表面横越; 侧面是粘合剂，其中片材（4）的第一粘合剂侧固定到基底（6），并且至少一个流体碎片（2）由片材（4）的第二粘合剂侧固定，所述流体 芯片（2）布置成使得流体芯片的至少一个通道与衬底的至少一个流体通道（11,12）流体连通。

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