Abstract:
A field electron emission material has a substrate with an electrically conductive surface. Electron emission sites on the conductive surface each include a layer of electrically insulating material to define a primary interface region between the conductive surface and the insulating layer, and a secondary interface region between the insulating layer and the vacuum environment,. Each primary interface region is treated or created so as to enhance the probability of electron injection form the conductive surface into the insulating layer. Each primary interface region after such treatment or creation is either an insulator or graded from conducting adjacent the conductive surface to insulating adjacent the insulating layer.
Abstract:
A field emission type cold cathode device comprises a substrate, and a metal plating layer formed on the substrate, the metal plating layer contains at least one carbon structure selected from a group of fullerenes and carbon nanotubes, the carbon structure is stuck out from the metal plating layer and a part of the carbon structure is buried in the metal plating layer.
Abstract:
An electron emitting device includes at least a first electrode and an electron emitting section provided on the first electrode. The electron emitting section is formed of a particle or an aggregate of particles. The particle contains a carbon material having a carbon six-membered ring structure. The carbon material having a carbon six-membered ring structure contains, for example, graphite or a carbon nanotube as a main component.
Abstract:
A field emission display device and a method of fabricating the same are provided. The field emission display device includes a substrate, a transparent cathode layer, an insulation layer, a gate electrode, a resistance layer, and carbon nanotubes. The transparent cathode layer is deposited on the substrate. The insulation layer is formed on the cathode layer and has a well exposing the cathode layer. The gate electrode is formed on the insulation layer and has an opening corresponding to the well. The resistance layer is formed to surround the surface of the gate electrode and the inner walls of the opening and the well so as to block ultraviolet rays. The carbon nanotube field emitting source is positioned on the exposed cathode layer. An alignment error between the gate electrode and the cathode is removed, and carbon nanotube paste is prevented from remaining during development, thereby preventing current leakage and short circuit between the electrodes and diode emission. Accordingly, the performance of the field emission display device can be improved.
Abstract:
A system in accordance with the invention which generates electrons by means of a field-emission cathode comprises an array of electron-emitting micropoints associated with a grid and carried by a substrate with integral heater means for heating the micropoints to a temperature in the range approximately 300° C. to approximately 400° C. and maintaining them at that temperature during emission of electrons. The cathode can therefore function at higher residual air pressures with no risk of breakdown.
Abstract:
To form a sharp edge portions of an electron emission part of a field emission type cathode to face an electron application surface. At least an electron emission part 40 of a field emission type cathode K is constituted by stacking thin plate-like conductive fine grains 30 and the field emission type cathode K is formed so that the plane direction of the thin plate-like fine grains of the electron emission part 40 crosses an electron application surface.
Abstract:
Triode pixel devices and complementary triode logic devices for control of the pixel devices are disclosed. The pixel and logic devices are integrally fabricated in arrays suitable for full color flat display panels. Both pixel and logic elements are operated in a gate controlled avalanche mode. Pixel elements are formed from organic or inorganic electroluminescent (EL) materials ohmically contacted by low work function metal. The depletion region necessary for controlling EL intensity or preventing EL avalanche is affected by potentials to a gate element injected into the EL material. The shape of the gate element multiplies the field produced by the gate potential. Luminescence is directly viewed from the brighter, lateral EL emission not available in the prior art. The complementary logic devices are formed from separate depositions of n-type and p-type silicon with their respective gates connected in common. A manufacturing process to produce economical full color, large area, flat-panel, displays of high pixel density and redundancy is described. Small area high pixel density displays suitable for head-mounted military, avionic, and virtual reality display products are also discussed.
Abstract:
A process is provided for forming sharp asperities useful as field emitters. The process comprises patterning and doping a silicon substrate. The doped silicon substrate is anodized. The anodized area is then use for field emission tips. The process of the present invention is also useful for low temperature sharpening of tips fabricated by other methods. The tips are anodized, and then exposed to radiant energy and the resulting oxide is removed.
Abstract:
A process is provided for forming sharp asperities useful as field emitters. The process comprises patterning and doping a silicon substrate. The doped silicon substrate is anodized. The anodized area is then used for field emission tips. The process of the present invention is also useful for low temperature sharpening of tips fabricated by other methods. The tips are anodized, and then exposed to radiant energy and the resulting oxide is removed.
Abstract:
In one aspect, the invention encompasses a method of treating the end portions of an array of substantially upright silicon-comprising structures. A substrate having a plurality of substantially upright silicon-comprising structures extending thereover is provided. The substantially upright silicon-comprising structures have base portions, and have end portions above the base portions. A masking layer is formed over the substrate to cover the base portions of the substantially upright silicon-comprising structures while leaving the end portions exposed. The end portions are then exposed to conditions which alter the end portions relative to the base portions. In another aspect, the invention encompasses a method of treating the ends of an array of silicon-comprising emitter structures. A substrate having a plurality of silicon-comprising emitter structures thereover is provided. The emitter structures have base portions and ends above the base portions. A layer of spin-on-glass is formed over the substrate. The layer of spin-on-glass covers the base portions of the emitter structures and leaves the ends exposed. The ends are then exposed to conditions which alter the ends relative to the base portions. In yet another aspect, the invention encompasses a cathode assembly which includes a plurality of silicon-comprising emitter structures projecting over a substrate. The emitter structures have base portions and ends above the base portions, and the ends comprise a different material than the base portions.