公开(公告)号：US20100212944A1

公开(公告)日：2010-08-26

申请号：US12694005

申请日：2010-01-26

Applicant: Jeffrey Donald Gelorme ,  Joseph Kuczynski

Inventor： Jeffrey Donald Gelorme ,  Joseph Kuczynski

IPC: H05K1/03 ,  C07D251/04 ,  H05K1/02 ,  B05D5/12

CPC classification number: H05K1/0366 ,  C07F7/1804 ,  H05K2201/0239 ,  H05K2201/0769

Abstract: The present invention is directed to silane coupling agents for printed circuit boards, such as high-temperature printed circuit boards (PCBs), a process for synthesizing the silane coupling agent, and PCBs with such coupling agents. The silane coupling agent is defined by the following formula: wherein at least one R′ is an allyl and the other one is hydrogen, an alkyl, a cycloalkyl, an aryl, a heteroaryl, a non-aromatic heterocyclic ring, or an allyl; and R1 is an alkyl, a cycloalkyl, an aryl, a heteroaryl, a non-aromatic heterocyclic ring, or an allyl.

Abstract translation: 本发明涉及用于印刷电路板的硅烷偶联剂，例如高温印刷电路板（PCB），用于合成硅烷偶联剂的方法，以及具有这种偶联剂的PCB。 硅烷偶联剂由下式定义：其中至少一个R'是烯丙基，另一个是氢，烷基，环烷基，芳基，杂芳基，非芳族杂环或烯丙基; 并且R 1是烷基，环烷基，芳基，杂芳基，非芳族杂环或烯丙基。

公开(公告)号：US20100155123A1

公开(公告)日：2010-06-24

申请号：US12482463

申请日：2009-06-11

Applicant: Bin JIAN ,  Li-Chun CHEN

Inventor： Bin JIAN ,  Li-Chun CHEN

IPC: H05K1/02 ,  C08G69/02 ,  C08K3/34 ,  C08L83/00 ,  C08K5/07 ,  B32B17/04

CPC classification number: H05K1/0326 ,  B32B17/04 ,  B32B27/12 ,  B32B27/20 ,  B32B27/24 ,  B32B27/26 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2307/306 ,  B32B2307/718 ,  B32B2457/08 ,  C08G59/62 ,  C08G59/688 ,  C08K5/3155 ,  C08K5/54 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0239 ,  Y10T428/249946

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract translation: 提供了一种制备无卤素树脂的组合物，该组合物包括无卤素磷酸化环氧树脂，氨基甲酸酯改性共聚酯，固化剂，填料，表面活性剂和溶剂。 还提供了一种无卤素预浸料，其包括玻璃织物和玻璃织物上的无卤素树脂层。 无卤树脂层由上述无卤素树脂制成。

公开(公告)号：US07727423B2

公开(公告)日：2010-06-01

申请号：US12003782

申请日：2007-12-31

Applicant: Kang Bae Yoon ,  Kyoung Soo Park ,  Cheon Seok Lee

Inventor： Kang Bae Yoon ,  Kyoung Soo Park ,  Cheon Seok Lee

IPC: H01B1/00 ,  H01B1/04 ,  H01B1/02

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0239

Abstract: An anisotropic conductive film (ACF) composition includes a thermoplastic resin having a weight average molecular weight of about 150,000 to about 600,000, a thermosetting curing agent having a weight average molecular weight of about 100 to about 10,000, the thermosetting curing agent including an acrylate functional group or a methacrylate functional group, an organic peroxide, a silane coupling agent, and conductive particles.

Abstract translation: 各向异性导电膜（ACF）组合物包括重均分子量为约150,000至约600,000的热塑性树脂，重均分子量为约100至约10,000的热固性固化剂，所述热固性固化剂包括丙烯酸酯官能 基团或甲基丙烯酸酯官能团，有机过氧化物，硅烷偶联剂和导电颗粒。

公开(公告)号：US07723407B2

公开(公告)日：2010-05-25

申请号：US11197587

申请日：2005-08-05

Applicant: Takuo Sugioka ,  Yasunori Tsujino

Inventor： Takuo Sugioka ,  Yasunori Tsujino

IPC: H01L21/00 ,  C08L63/00 ,  B32B27/38

CPC classification number: H05K1/0373 ,  C08K3/016 ,  C08L61/28 ,  C08L63/00 ,  C08L83/04 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0257 ,  Y10T428/31511 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00

Abstract: It is an object of the present invention to provide a resin composition which can form cured formulations having various excellent properties such as an insulating property, thermal shock resistance, moldability/formability and strength, and exhibit an excellent appearance in which transparency is enhanced, a resin composition whose cured thin film has excellent flame retardancy, good mechanical property and heat resistance, a dispersing element containing an inorganic microfine particle which can give a flame retardancy to a resin, to which the inorganic microfine particle is added, and can reduce a hygroscopic property to the extent possible, a method for producing the same and a cured formulation obtained by using the resin composition. The present invention relates to a resin composition comprising a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a resin composition comprising three components of a phenolic compound, a compound having at least one of a glycidyl group and/or an epoxy group and an inorganic microfine particle, a flame retardant resin composition comprising a polyhydric phenol and an inorganic microfine particle, and a dispersing element containing an inorganic microfine particle obtained by a hydrolysis condensation reaction of alkoxide and/or metal carboxylate in a dispersion medium.

Abstract translation: 本发明的目的是提供一种树脂组合物，其可以形成具有绝缘性，耐热冲击性，成型性/成形性和强度等各种优异性能的固化剂，并且表现出透明性提高的优异外观， 其固化的薄膜具有优异的阻燃性，良好的机械性能和耐热性的树脂组合物，含有能够赋予无机微粒子的树脂阻燃性的无机微粒子的分散元件，并且可以减少吸湿性 特性，其制备方法和使用该树脂组合物得到的固化剂。 本发明涉及包含具有缩水甘油基和/或环氧基中的至少一种的化合物和无机微粒的树脂组合物，包含酚类化合物的三种成分的树脂组合物，具有以下的至少一种的化合物： 缩水甘油基和/或环氧基和无机微粒，包含多元酚和无机微粒的阻燃树脂组合物和含有通过醇盐和/或金属的水解缩合反应得到的无机微粒的分散体 羧酸酯在分散介质中。

公开(公告)号：US07638854B2

公开(公告)日：2009-12-29

申请号：US11332310

申请日：2006-01-17

Applicant: Yasuhiko Tanaka ,  Kenji Toyosawa

Inventor： Yasuhiko Tanaka ,  Kenji Toyosawa

IPC: H01L23/34 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/07811 ,  H01L2924/12044 ,  H01L2924/19105 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/323 ,  H05K3/389 ,  H05K2201/0239 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A semiconductor device is provided that includes wiring patterns on a substrate formed of an organic insulating film, and a semiconductor chip mounted on the substrate. A liquid crystal display panel and a PW board are electrically connected to each other with an anisotropic conductive adhesive. At least one surface of the insulating film is treated with a silicon coupling material. The silicon coupling material contains silicon (Si) at a surface element density of 0.5 atomic percent to 12.0 atomic percent on a surface of the insulating film.

Abstract translation: 提供一种半导体器件，其包括由有机绝缘膜形成的衬底上的布线图案和安装在该衬底上的半导体芯片。 液晶显示面板和PW板通过各向异性导电粘合剂彼此电连接。 用硅偶联材料处理绝缘膜的至少一个表面。 硅耦合材料在绝缘膜的表面上含有表面元素密度为0.5原子％至12.0原子％的硅（Si）。

公开(公告)号：US20090192241A1

公开(公告)日：2009-07-30

申请号：US12364435

申请日：2009-02-02

Applicant: Nachiket Raravikar ,  Ravindra Tanikella

Inventor： Nachiket Raravikar ,  Ravindra Tanikella

IPC: B32B3/24 ,  C08K3/38

CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且可以将复合材料的开口形成为对应于在纳米丝阵列中提供的空间的复合材料。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

公开(公告)号：US07491290B2

公开(公告)日：2009-02-17

申请号：US10505489

申请日：2003-02-14

Applicant: Takayuki Matsushima ,  Masao Saito

Inventor： Takayuki Matsushima ,  Masao Saito

IPC: C09J163/00 ,  B32B27/38

CPC classification number: H05K3/323 ,  C08G59/18 ,  C08J3/243 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L2224/16 ,  H01L2224/83101 ,  H05K2201/0239 ,  H05K2201/0379 ,  H05K2203/1163 ,  H05K2203/121 ,  Y10T428/31511 ,  Y10T428/31515

Abstract: Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.

Abstract translation: 公开了一种双组分粘合剂，用于将两个物体电连接和机械互连以进行粘结。 双组分粘合剂分别由分别含有第一和第二固化剂的第一和第二粘合剂材料制成。 仅在第一和第二固化剂反应之后，第一和第二树脂组分聚合。 只要两种粘合剂材料彼此分离，粘合剂就不会固化。 在使用金属螯合物或金属醇化物作为第一固化剂并且使用硅烷偶联剂作为第二固化剂的情况下，分离作为固化组分的阳离子以使第一和第二树脂组分的阳离子聚合以允许 在比使用常规粘合剂的情况下更短的时间内在较低温度下固化。

公开(公告)号：US20080157030A1

公开(公告)日：2008-07-03

申请号：US12010172

申请日：2008-01-22

Applicant: Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

IPC: H01B1/02 ,  C08L85/02

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US07351353B1

公开(公告)日：2008-04-01

申请号：US09479089

申请日：2000-01-07

Applicant: Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

Inventor： Roger Bernards ,  Hector Gonzalez ,  Al Kucera ,  Mike Schanhaar

IPC: C09K13/00

CPC classification number: C23C22/68 ,  C23C22/52 ,  C23C2222/20 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/389 ,  H05K3/4611 ,  H05K2201/0239 ,  H05K2203/0793 ,  H05K2203/0796 ,  H05K2203/124

Abstract: The invention is directed to a method and composition for providing roughened copper surfaces suitable for subsequent multilayer lamination. A smooth copper surface is contacted with an adhesion promoting composition under conditions effective to provide a roughened copper surface, the adhesion promoting composition consisting essentially of an oxidizer, a pH adjuster, a topography modifier, and a uniformity enhancer. A coating promoter may be used in place of the uniformity enhancer or in addition to the uniformity enhancer. The adhesion promoting composition does not require a surfactant. The process may further comprise the step of contacting the uniform roughened copper surface with a post-dip, wherein the post-dip comprises an azole or silane compound or a combination of said azole and said silane. The post-dip may further comprise, alone or in combination, a titanate, zirconate, and an aluminate. The pH adjuster is preferably sulfuric acid and the oxidizer is preferably hydrogen peroxide. A hydrogen peroxide stabilizer may be used in the adhesion promoting composition.

Abstract translation: 本发明涉及一种用于提供适于随后的多层层压的粗糙化铜表面的方法和组合物。 在有效提供粗糙化铜表面的条件下，光滑的铜表面与增粘组合物接触，该粘附促进组合物基本上由氧化剂，pH调节剂，形貌改性剂和均匀性增强剂组成。 可以使用涂层促进剂来代替均匀性增强剂，或者除了均匀性增强剂之外。 粘合促进组合物不需要表面活性剂。 该方法还可以包括使均匀的粗糙化铜表面与浸渍后接触的步骤，其中后浸渍包括唑或硅烷化合物或所述唑和所述硅烷的组合。 后浸渍可以单独地或组合地包含钛酸盐，锆酸盐和铝酸盐。 pH调节剂优选为硫酸，氧化剂优选为过氧化氢。 在粘合促进组合物中可以使用过氧化氢稳定剂。

公开(公告)号：US20080032109A1

公开(公告)日：2008-02-07

申请号：US10556514

申请日：2004-05-13

Applicant: Gunther Leising ,  Johannes Stahr ,  Fritz Haring ,  Ping Zhao ,  Gerhard Nauer

Inventor： Gunther Leising ,  Johannes Stahr ,  Fritz Haring ,  Ping Zhao ,  Gerhard Nauer

IPC: H05K3/00

CPC classification number: H05K3/061 ,  C23C22/02 ,  C23C26/00 ,  C23C28/00 ,  H05K2201/0239 ,  H05K2203/0577 ,  H05K2203/107 ,  Y10T428/31504

Abstract: The invention relates to a PCB blank comprising a protective film which is resistant to acid and which is made of at least two layers which are chemically linked to each other underneath each other and/or are linked to the metal surface of the PCB blank. The invention also relates to a method for coating a PCB blank with a protective film which is resistant to acid and which is made of at least two layers.

Abstract translation: 本发明涉及一种PCB坯料，其包括耐酸性的保护膜，并且由彼此相互化学连接和/或连接到PCB坯料的金属表面的至少两层制成。 本发明还涉及一种用具有耐酸性并由至少两层制成的保护膜涂覆PCB坯料的方法。