Abstract:
The invention concerns a method for etching a PVD deposited barium strontium titanate (BST) layer, wherein a non-ionic surfactant at a concentration between 0.1 and 1 percent is added to an acid etching solution.
Abstract:
A coupling interface couples a transceiver to one or more capacitive voltage dividers of a power transmission system. The coupling interface includes a first signal path including an adjustable inductance configured to form a resonance circuit with a capacitance associated with the one or more capacitive voltage dividers. The coupling interface may include a second signal path including an adjustable inductance configured to form a resonance circuit with the capacitance associated with the one or more capacitive voltage dividers.
Abstract:
A switching circuit (10) for an ultrasound transmission channel (1) is inserted between a connection terminal (Xdcr) and a low voltage output terminal (LVout) and comprising a receiving switch (30) a high voltage clamp circuit (HV1) inserted between the connection terminal (Xdcr) and a central node (Vc), a low voltage clamping switch (25) inserted between said central node (Vc) and a reference voltage (GND), the receiving switch (30) being low voltage and being inserted between the central node (Vc) and the low voltage output terminal (LVout), the clamping switch (25) and the receiving switch (30) being controlled in a complementary way with respect to each other. A transmission channel ( 1) for ultrasound applications is also described comprising at least such a switching circuit (10) and a process for driving said switching circuit (10).
Abstract:
A microelectromechanical detection structure (1; 1') for a MEMS resonant biaxial accelerometer (16) is provided with: an inertial mass (2; 2'), anchored to a substrate (30) by means of elastic elements (8) in such a way as to be suspended above the substrate (30), the elastic elements (8) enabling inertial movements of detection of the inertial mass (2; 2') along a first axis of detection (x) and a second axis of detection (y) that belong to a plane (xy) of main extension of said inertial mass (2; 2'), in response to respective linear external accelerations (a x , a y ); and at least one first resonant element (10a) and one second resonant element (10b), which have a respective longitudinal extension, respectively along the first axis of detection (x) and the second axis of detection (y), and are mechanically coupled to the inertial mass (2; 2') through a respective one of the elastic elements (8) in such a way as to undergo a respective axial stress (N 1 , N 2 ) when the inertial mass moves respectively along the first axis of detection (x) and the second axis of detection (y).
Abstract:
A process for manufacturing a semiconductor device (10; 10') envisages the steps of: providing a semiconductor material body (2) having at least one deep trench (4) that extends through said body of semiconductor material starting from a top surface (2a) thereof; and filling the deep trench (4) via an epitaxial growth of semiconductor material, thereby forming a columnar structure (8) within the body of semiconductor material (2). The manufacturing process further envisages the step of modulating the epitaxial growth by means of a concurrent chemical etching of the semiconductor material that is undergoing epitaxial growth so as to obtain a compact filling free from voids of the deep trench (4); in particular, a flow of etching gas is introduced into the same reaction environment as that of the epitaxial growth, wherein a flow of source gas is supplied for the same epitaxial growth.
Abstract:
A method for manufacturing a semiconductor wafer (112) is provided. The method comprises providing a monocrystalline silicon wafer (102), epitaxially growing a first layer (108) of a first material on the silicon wafer (102), and epitaxially growing a second layer (110) of a second material on the first layer. Said first material is monocrystalline silicon carbide, and said second material is monocrystalline silicon.
Abstract:
A clamping circuit (10) to a voltage reference (GND) is described, of the type comprising at least one clamping core (11) connected to an output terminal (HVout) and having a central node (XC) connected to the voltage reference (GND) and in turn including at least one first and one second clamp transistor (MC1; MC2), connected to the central node (XC) and having respective control terminals (XG1, XG2), the clamping core (11) being also connected at the input to a low voltage input driver block (13). Advantageously according to the invention, the clamping core (11) further comprises at least one first switching off transistor (MS1) connected to the output terminal (HVout) and to the first clamp transistor (MC1), as well as a second switching off transistor (MS2) connected to the output terminal (HVout) and to the second clamp transistor (MC2), these first and second clamp transistors (MC1, MC2) being high voltage MOS transistors of complementary type and these first and second switching off transistors (MS1, MS2) being high voltage MOS transistors of complementary type and connected to the first and second clamp transistors (MC1, MC2) by having the respective equivalent or body diodes in anti-series so as to close themselves when the clamping circuit (10) is active and to sustain positive and negative high voltages when the clamping circuit (10) is not active.
Abstract:
The invention relates to a driving method for obtaining a linear gain variation of a transconductance amplifier, of the type comprising at least one differential transistor cell, with adjustment of a driving voltage value (Vtgc1) of a degenerative driving transistor (MD1) of said transconductance amplifier, comprising the steps of : generating an output current signal of a differential cell (11) being a copy of said differential transistor cell of said transconductance amplifier, said output current signal having a linear relationship with a transconductance value of said copy differential cell (11) as said driving voltage (Vtgc1) varies; generating a reference current signal having a linear relationship with a differential input voltage; comparing said output current signal and said reference current signal for adjusting said driving voltage value (Vtgc1) and modifying said transconductance value of said copy differential cell (11) up to a balance of said current signals.
Abstract:
A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board (20) with opposite first and second surfaces (20a, 20b) having first and second metal layers (21a, 21b) disposed thereon, respectively, wherein a through cavity (200) extends through the first board and the first and second metal layers; a second board (23) with opposite third and fourth surfaces (23a, 23b); an adhesive layer (22) sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess (200); and a first conductor layer (25a) coating the bottom and the side surfaces (201a, 201b) of the recess. The lid enhances the shielding effect upon the MEMS device.
Abstract:
Ring oscillator comprising a plurality of elementary units (5) connected in cascade and linked in order to make a chain with the respective output terminals (OUT) connected to the input terminals (IN) of the successive elementary units (5) of the chain, the elementary units (5) being crossed by a cyclic signal (CLK) during a time period (Δt) of activation, each of said elementary units (5) comprising an auxiliary recovery terminal (15) for temporarily resetting each elementary unit (5) during each loop of said cyclic signal (CLK), said auxiliary recovery terminal (15) being connected to an output terminal (OUT) of a successive elementary unit (5) of the chain.