Abstract:
A wireless communication network, such as a IEEE 802.11 WLAN, includes an access point (AP) and a plurality of stations (STAl, STA2). The Access Point (AP) sends towards the stations (STAl, STA2) periodic information arranged in time frames or beacon intervals. The stations (STAl, STA2) in the network are configured to communicate: - in a first mode, called Infrastructure Mode (IM), through the access point (AP), and - in a second mode, called Direct Link Mode (DLM), directly with each other. The time frames are partitioned into: - a first time interval (IM_SI) wherein the stations (STAl, STA2) communicate in the first mode over a first channel; - a second time interval (DLM_SI) wherein the stations (STAl, STA2) communicate in the second mode over a second channel/ and - a third time interval (MIXED_SI) wherein the stations (STAl, STA2) communicate in either of the first (IM) or the second (DLM) mode.
Abstract:
A control device of a plurality of switching converters (Convl.ConvN) is disclosed; each converter comprises at least one power switch and is associated with a control circuit (Mod1 ...ModN) of the at least one power switch. The control device comprises means (100) suitable for comparing a signal (CTRL) representative of the load of the plurality of converters (ConvL.ConvN) with a plurality of reference signals (Vref1 ...Vref(N-l)) and suitable for enabling or disabling at least one of said plurality of control circuits (Mod1...ModN) in response to said comparison.
Abstract:
Described herein is a power device (10) having a first current-conduction terminal (A) , a second current-conduction terminal (K) , a control terminal (G) receiving, in use, a control voltage (VGATE) of the power device (10), and a thyristor device (12) and a first insulated-gate switch device (14) connected in series between the first and the second conduction terminals; the first insulated-gate switch device (14) has a gate terminal connected to the control terminal (G), and the thyristor device (12) has a base terminal (16) . The power device (10) is further provided with: a second insulated-gate switch device (18), connected between the first current-conduction terminal (A) and the base terminal (16) of the thyristor device (12) , and having a respective gate terminal connected to the control terminal (G) ; and a Zener diode (19) , connected between the base terminal (16) of the thyristor device (12) and the second current-conduction terminal (K) so as to enable extraction of current from the base terminal (16) in a given operating condition.
Abstract:
Process for manufacturing a semiconductor power device, wherein a trench (8) is formed in a semiconductor body (2) having a first conductivity type; the trench is annealed for shaping purpose (8a) ; and the trench (8a) is filled with semiconductor material via epitaxial growth so as to obtain a first column (9) having a second conductivity type. The epitaxial growth is performed by supplying a gas containing silicon and a gas containing dopant ions of the second conductivity type in presence of a halogenide gas and occurs with uniform distribution of the dopant ions. The flow of the gas containing dopant ions is varied according to a linear ramp during the epitaxial growth; in particular, in the case of selective growth of the semiconductor material in the presence of a hard mask, the flow decreases; in the case of non-selective growth, in the absence of hard mask, the flow increases .
Abstract:
The present invention relates to a method for designing a complex circuit architecture (1) including a plurality of circuit portions interconnected one to the other in said architecture, each circuit portions including a VLSI number of on-board transistors of both NMOS and PMOS type and wherein a circuit architecture core (2) is associated to at least a couple of body bias generators (3), one for said NMOS and one for said PMOS transistors; characterized by the following steps: - providing said circuit architecture core by a library of basic transistor cells having N and P MOS substrates separated from their corresponding source terminals; - monitoring the active current (Ion) in said transistors; - comparing the monitored current with a predetermined current value corresponding to standard or typical working conditions of said transistors according to the result of the comparison phase providing a reverse bias for those cells of the circuit architecture core to be compensated because of a possible excess of current leakage.
Abstract:
A device for stabilizing images acquired by a digital-image sensor (5) includes a motion- sensing device (15, 16, 17, 18), for detecting quantities (P, Y, Y) correlated to pitch and yaw movements of the digital-image sensor (5), and a processing unit (14), connectable to the 5 digital-image sensor (5) for receiving a first image signal (IMG) and configured for extracting a second image signal (IMG') from the first image signal (IMG) on the basis of the quantities (P, Y, Y) detected by the motion-sensing device (15, 16, 17, 18). The motion-sensing device (15, 16, 17, 18) includes a first accelerometer (15) and a second accelerometer (16).
Abstract:
Method for manufacturing electronic devices on a semiconductor substrate (1, 1a; 10, 11) with wide band gap comprising the steps of: forming a screening structure (3a, 20) on said semiconductor substrate (1, 1a; 10, 11) comprising at least a dielectric layer (2, 20) which leaves a plurality of areas of said semiconductor substrate (1, 1a; 10, 11) exposed, carrying out at least a ion implantation of a first type of dopant in said semiconductor substrate (1, 1a; 10, 11) to form at least a first implanted region (4, 40), carrying out at least a ion implantation of a second type of dopant in said semiconductor substrate (1, 1a; 10, 11) to form at least a second implanted region (6, 6c; 60, 61) inside said at least a first implanted region (4, 40), carrying out an activation thermal process of the first type and second type of dopant with low thermal budget suitable to complete said formation of said at least first and second implanted regions (4, 40; 6, 60).
Abstract:
In a process for manufacturing a MOS device: forming a semiconductor layer (23) having a first type of conductivity; forming an insulated gate structure (27) having an electrode region (25), above the semiconductor layer (23); forming body regions (37) having a second type of conductivity, within the semiconductor layer (23), laterally and partially underneath the insulated gate structure (27); forming source regions (38) having the first type of conductivity, within the body regions (37); and forming a first enrichment region (42), in a surface portion of the semiconductor layer (23) underneath the insulated gate structure (27), the first enrichment region (42) having the first type of conductivity and being set at a distance from 10 the body regions (37). In order to form the first enrichment region (42), a first enrichment window (30) is defined within the insulated gate structure (27), and first dopant species of the first type of conductivity are introduced through the first enrichment window (30) and in a way self-aligned thereto.
Abstract:
Transmission of multicast packets over a local area network (30, 40, 50) is controlled by: - identifying the condition where only a single receiver (40, 50) exists within the local area network (30, 40, 50) for a given multicast group of packets, and - allowing, upon occurrence of that condition, Automatic Repeat Request (ARQ) of the packets multicast towards said single receiver (40, 50). A preferred field of application is wireless local area networks for use in a home environment.
Abstract:
An apparatus for removing or decreasing the resin flush from the top of the metallic part of a semiconductor device is described, comprising a main reservoir and nozzles for sprinkling a solution with abrasive material suspended therein onto a semiconductor device placed in said main reservoir. Said apparatus also comprises a pressure sensor placed at the bottom of said main reservoir, a liquid level sensor associated with said main reservoir and a control unit for feeding said solution to said nozzles according to the pressure and level raised by said sensors.