MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME
    174.
    发明申请
    MOULD FOR GALVANOPLASTY AND METHOD OF FABRICATING THE SAME 有权
    糖尿病模型及其制备方法

    公开(公告)号:US20100230290A1

    公开(公告)日:2010-09-16

    申请号:US12723147

    申请日:2010-03-12

    CPC classification number: C25D1/10 B29C33/3842 B81C99/009 B81C2201/034

    Abstract: The invention relates to a method (3) of fabricating a mould (39, 39′) including the following steps: a) depositing (9) an electrically conductive layer on the top (20) and bottom (22) of a wafer (21) made of silicon-based material; b) securing (13) said wafer to a substrate (23) using an adhesive layer; c) removing (15) one part (26) of said conductive layer from the top of the wafer (21); d) etching (17) said wafer as far as the bottom conductive layer (22) thereof in the shape (26) of said part removed from the top conductive layer (22) to form at least one cavity (25) in said mould. The invention concerns the field of micromechanical parts, particularly for timepiece movements.

    Abstract translation: 本发明涉及一种制造模具(39,39')的方法(3),包括以下步骤:a)在晶片(21)的顶部(20)和底部(22)上沉积(9)导电层 )由硅基材料制成; b)使用粘合剂层将所述晶片固定(13)到基底(23)上; c)从晶片(21)的顶部去除(15)所述导电层的一部分(26); d)将所述晶片刻蚀(17)所述晶片至所述部分的形状(26)的底部导电层(22)从顶部导电层(22)去除,以在所述模具中形成至少一个空腔(25)。 本发明涉及微机械部件领域,特别是用于钟表运动。

    Method of forming a sintered microfluidic device
    175.
    发明授权
    Method of forming a sintered microfluidic device 失效
    形成烧结微流体装置的方法

    公开(公告)号:US07767135B2

    公开(公告)日:2010-08-03

    申请号:US11975414

    申请日:2007-10-19

    Abstract: Disclosed is a method of forming a structured sintered article including providing a mixture comprising a sinterable particulate material and a binder, the binder comprising, as a function of total resin content of the binder, at least 50% by weight of a thermoplastic binder material and at least 5% by weight of a radiation-curable binder material; shaping the mixture with a mold to form a structure; setting the structure by cooling the structure or by allowing the structure to cool; separating the structure from the mold; irradiating the structure so as to at least partially cure the radiation-curable binder material, and debinding and sintering the structure so as to form a structured sintered article. Shaping may include forming a structure having one or more open channels, and sintering may include sintering in together in contact with at least one additional structure so as to cover or enclose the channels.

    Abstract translation: 公开了一种形成结构化烧结制品的方法,包括提供包含可烧结颗粒材料和粘合剂的混合物,所述粘合剂包含作为粘合剂的总树脂含量的函数,至少50重量%的热塑性粘合剂材料和 至少5重量%的可辐射固化粘合剂材料; 用模具成型混合物以形成结构; 通过冷却结构或通过使结构冷却来设定结构; 将结构与模具分离; 照射该结构以至少部分地固化可辐射固化的粘合剂材料,以及脱结和烧结该结构以便形成结构化的烧结制品。 成形可以包括形成具有一个或多个开放通道的结构,并且烧结可以包括与至少一个附加结构接触在一起的烧结以覆盖或封闭通道。

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