公开(公告)号：US11889622B2

公开(公告)日：2024-01-30

申请号：US17650309

申请日：2022-02-08

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Gerald Weis

IPC: H05K1/02 ,  H05K3/36 ,  H01R12/52 ,  H05K1/18

CPC classification number: H05K1/0272 ,  H01R12/52 ,  H05K1/185 ,  H05K3/368 ,  H05K2201/064

Abstract: An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.

公开(公告)号：US20230387719A1

公开(公告)日：2023-11-30

申请号：US17901948

申请日：2022-09-02

Applicant: Inventec (Pudong) Technology Corporation ,  INVENTEC CORPORATION

Inventor： Chi-Cheng HSIAO

IPC: H02J50/00 ,  H02J50/10 ,  H02J50/40 ,  H05K1/02 ,  H05K1/18

CPC classification number: H02J50/005 ,  H02J50/10 ,  H02J50/402 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/1003 ,  H05K2201/10098

Abstract: A wireless charging module is configured to be disposed on a circuit board. The wireless charging module includes a frame, a wireless communication antenna board, and a charging coil. The frame has a plurality of first assembly parts and a plurality of second assembly parts. The plurality of first assembly parts are configured to be mounted on the circuit board. The wireless communication antenna board is mounted on the plurality of second assembly parts. The charging coil is located between the frame and the wireless communication antenna board.

公开(公告)号：US11716831B2

公开(公告)日：2023-08-01

申请号：US17437047

申请日：2019-04-22

Applicant: Mitsubishi Electric Corporation

Inventor： Koji Kise ,  Hiroaki Ishikawa ,  Takashi Moriyama ,  Yuki Sakata

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

CPC classification number: H05K7/20327 ,  H05K1/0203 ,  H05K1/14 ,  H05K7/20272 ,  F28D15/025 ,  F28D2021/0021 ,  H01L23/427 ,  H05K2201/064

Abstract: A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

公开(公告)号：US20230219340A1

公开(公告)日：2023-07-13

申请号：US18153419

申请日：2023-01-12

Applicant: SEIKO EPSON CORPORATION

Inventor： Ryota KINOSHITA ,  Taiki HANAGAMI

IPC: B41J2/14 ,  H05K1/02

CPC classification number: B41J2/14 ,  H05K1/0201 ,  B41J2002/14491 ,  H05K2201/064

Abstract: A liquid ejecting head unit includes a first connector configured to be coupled to an external wiring member. The liquid ejecting head unit includes a wiring board having the first connector, a housing for the liquid ejecting head unit, the housing having an opening through which the first connector is exposed outside and having a housing space accommodating the wiring board, and a flexible member in the housing space. The flexible member separates the housing space into a first space that has at least a portion of the first connector and the opening and a second space that is larger than the first space.

公开(公告)号：US11659648B2

公开(公告)日：2023-05-23

申请号：US16152659

申请日：2018-10-05

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Marco Gavagnin ,  Jonathan Silvano de Sousa

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/46 ,  H05K1/18 ,  B22F7/08 ,  B33Y80/00 ,  B33Y10/00 ,  H05K3/12 ,  B22F10/20

CPC classification number: H05K1/0206 ,  B22F7/08 ,  B33Y10/00 ,  B33Y80/00 ,  H05K1/021 ,  H05K1/0209 ,  H05K1/0353 ,  H05K1/09 ,  H05K1/181 ,  H05K1/185 ,  H05K3/1241 ,  H05K3/4644 ,  H05K3/4664 ,  B22F10/20 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/107

Abstract: A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.

公开(公告)号：US11653475B2

公开(公告)日：2023-05-16

申请号：US17164562

申请日：2021-02-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Ioannis Manousakis ,  Husam Atallah Alissa ,  Nicholas Andrew Keehn ,  Bharath Ramakrishnan

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/203 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/2039 ,  H05K2201/064

Abstract: An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

公开(公告)号：US20180269371A1

公开(公告)日：2018-09-20

申请号：US15761485

申请日：2016-09-07

Applicant: Siemens Aktiengesellschaft

Inventor： Martin Franke ,  Peter Frühauf ,  Rüdiger Knofe ,  Bernd Müller ,  Stefan Nerreter ,  Michael Niedermayer ,  Ulrich Wittreich ,  Manfred Zäske

IPC: H01L35/30 ,  H02H5/04 ,  H05K1/02 ,  F04D33/00 ,  F04D25/06

CPC classification number: H01L35/30 ,  F04D25/06 ,  F04D33/00 ,  H01L23/38 ,  H01L23/467 ,  H01L35/28 ,  H02H5/04 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10037 ,  H05K2201/10151 ,  H05K2201/10219

Abstract: The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.

公开(公告)号：US20180263106A1

公开(公告)日：2018-09-13

申请号：US15914228

申请日：2018-03-07

Applicant: Delphi International Operations Luxembourg S.A.R.L

Inventor： Timo Feismann ,  Matthias Rieke

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/14 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  F04D25/06 ,  F04D25/08 ,  F04D29/28

CPC classification number: H05K1/0203 ,  F04D25/068 ,  F04D25/08 ,  F04D29/282 ,  H02K7/14 ,  H02K11/33 ,  H02K21/24 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/144 ,  H05K7/20172 ,  H05K7/20863 ,  H05K2201/042 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/1009

Abstract: An electronic assembly including a cooling device comprises a cooling plate equipped, on its upper face, with a plurality of pin-fins; a first printed circuit board including at least one heat-generating zone bearing against the lower face of the cooling plate; each pin including a blowing means comprising a hub equipped with blades, the blades being arranged axially along each pin so as to be able to rotate about the pin, thus creating a flow of air for cooling the pins.

公开(公告)号：US10010020B2

公开(公告)日：2018-06-26

申请号：US14847620

申请日：2015-09-08

Applicant: Raytheon Company

Inventor： Travis Mayberry ,  Jeffrey A. Shubrooks

IPC: B32B37/00 ,  H05K13/04 ,  H05K1/02 ,  H05K3/14

CPC classification number: H05K13/0404 ,  B33Y80/00 ,  H05K1/0272 ,  H05K3/14 ,  H05K2201/064 ,  H05K2203/0285

Abstract: A machine is provided and includes a machine body formed to define a single enclosed space, an ultrasonic consolidation (UC) processing element operably disposed in the single enclosed space for executing UC processing of a part within the single enclosed space and an electronics printing element operably disposed in the single enclosed space for executing electronics printing of the part within the single enclosed space.

公开(公告)号：US20180160523A1

公开(公告)日：2018-06-07

申请号：US15825856

申请日：2017-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUNG-HOON KIM

IPC: H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0204 ,  H05K1/0272 ,  H05K1/117 ,  H05K1/181 ,  H05K3/4644 ,  H05K3/4697 ,  H05K7/20336 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/10159 ,  H05K2201/10416 ,  H05K2201/10522

Abstract: A printed circuit board includes a substrate base including first and second inner base layers, a plurality of cover base layers, and a screw hole extending from a top to a bottom surface of the substrate base. At least one first cover base layer is disposed on the first inner base layer. At least one second cover base layer is disposed on the second inner base layer. A heat pipe is disposed along an interface between the first and second inner base layers. A ground conductive layer is disposed on at least one of the top surface and the bottom surface of the substrate base at an edge of the screw hole. A first heat dissipating structure is positioned between the top and bottom surfaces of the substrate base. The first heat dissipating structure is connected to the heat pipe and is in direct contact with the ground conductive layer.