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公开(公告)号：EP1913997B1
公开(公告)日：2011-06-29
申请号：EP08000281.9
申请日：2003-02-25
Applicant: Hitachi Chemical Co., Ltd.
Inventor： Kawazoe, Hiroshi c/o Hitachi Chemical Co Ltd Res. & Dev. Center , Nakaso, Akishi c/o Hitachi Chemical Co Ltd Res. & Dev. Center , Arike, Shigeharu c/o Hitachi Chemical Co Ltd Res. & Dev. Center
CPC classification number: B01L3/502707 , B01J19/0093 , B01J2219/00783 , B01J2219/00788 , B01J2219/00822 , B01J2219/00833 , B01J2219/0086 , B01J2219/00869 , B01L2200/12 , B01L2300/0816 , B01L2300/0838 , B01L2300/0874 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B81B2201/051 , B81C1/00119 , B81C2201/019 , B81C2203/032 , Y10T156/10
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公开(公告)号：EP2252727A2
公开(公告)日：2010-11-24
申请号：EP09722137.8
申请日：2009-03-12
Inventor： CORNELIUS, Thomas , ENSINGER, Wolfgang , NEUMANN, Reinhard , RAUBER, Markus
CPC classification number: C25D1/006 , B01J19/0093 , B01J23/42 , B01J23/72 , B01J35/0006 , B01J2219/00783 , B01J2219/00835 , B01J2219/00846 , B01J2219/00853 , B01J2219/0086 , B01J2219/00873 , B22F1/0025 , B22F3/002 , B81B2201/0292 , B81B2201/051 , B81C99/0085 , B82Y15/00 , B82Y30/00 , B82Y40/00 , C25D1/00 , C25D1/003 , C25D1/04 , C25D1/08 , C25D5/18 , G01F1/688 , G01N25/00 , Y10S977/762 , Y10T29/49117 , Y10T428/12201 , Y10T428/12389 , Y10T428/24562 , Y10T428/24893 , Y10T428/25
Abstract: The invention relates to a nanowire structural element suitable for installing, for example, in a microreactor system or microcatalyst system. A template-based method is used for producing the nanowire structural element, wherein electrochemical deposition of the nanowires takes place in nanopores, preferably continuing at least until caps have formed and at least partially grown together. After reinforcing the two cover layers, the structured hollow space between the two cover layers is exposed by dissolving the template foil and removing the dissolved template material, wherein the two cover layers remain intact. The result is a stable, sandwich-like nanostructure having a two-dimensional, open-celled hollow space structure, bounded on two sides by the cover layers and penetrated by the nanowires in a columnar manner in the plane parallel to the cover layers.
Abstract translation: 本发明涉及适用于例如安装在微反应器系统或微型催化剂系统中的纳米线结构元件。 使用基于模板的方法来制造纳米线结构元件，其中纳米线的电化学沉积发生在纳米孔中，优选至少持续直到帽已经形成并且至少部分地一起生长。 在增强两个覆盖层之后，通过溶解模板箔片并去除溶解的模板材料来暴露两个覆盖层之间的结构化中空空间，其中两个覆盖层保持完整。 其结果是具有二维开孔中空结构的稳定的三明治状纳米结构，其两侧由覆盖层界定，并且在平行于覆盖层的平面中以柱状方式被纳米线穿透。
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183.发明公开PROCESSES FOR RAPID MICROFABRICATION USING THERMOPLASTICS AND DEVICES THEREOF 审中-公开法快速MICRO制造使用热塑性和器件THEREFOR
公开(公告)号：EP2217694A1
公开(公告)日：2010-08-18
申请号：EP08848829.1
申请日：2008-11-12
Applicant: The Regents of the University of California
Inventor： KHINE, Michelle , CHEN, Chi-shuo , GRIMES, Anthony , BRESLAUER, David Nate , LEE, Luke , DUNLAP, Michael , GOPINATHAN, Ajay , GHOSH, Sayantani
IPC: C12M1/34
CPC classification number: B01L3/502707 , B01F5/0057 , B01F5/0646 , B01F5/0647 , B01F13/0059 , B01F2215/0037 , B01L2200/12 , B01L2300/0816 , B01L2300/0867 , B01L2300/0887 , B81B1/002 , B81B2201/051 , B81B2201/058 , B81B2203/0338 , B81C1/00071 , B81C2201/0152 , B82Y40/00 , G03F7/0002 , H01L21/02269 , H01L21/02271
Abstract: A method is provided to prepare one or more microfluidic channels on a receptive material by applying an image-forming material to a heat sensitive thermoplastic receptive material in a designed pattern and heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%. In an alternative aspect, the microfluidic channels on receptive material are prepared by etching a designed pattern into a heat sensitive thermoplastic material support and then heating the material under conditions that reduce the size of the thermoplastic receptive material by at least about 60%.
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公开(公告)号：EP1902780A2
公开(公告)日：2008-03-26
申请号：EP08000283.5
申请日：2003-02-25
Applicant: Hitachi Chemical Co., Ltd.
CPC classification number: B01L3/502707 , B01J19/0093 , B01J2219/00783 , B01J2219/00788 , B01J2219/00822 , B01J2219/00833 , B01J2219/0086 , B01J2219/00869 , B01L2200/12 , B01L2300/0816 , B01L2300/0838 , B01L2300/0874 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B81B2201/051 , B81C1/00119 , B81C2201/019 , B81C2203/032 , Y10T156/10
Abstract: A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.
Abstract translation: 用于微流体系统的支撑单元包括第一支撑件; 设置在所述第一支撑体的表面上的第一粘合剂层; 以及放置在第一粘合剂层的表面上以具有任意形状并用作微流体系统的流动通道层的中空细丝。 在第一支撑件上不设置用于容纳中空细丝的凹槽。
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公开(公告)号：EP1623760B1
公开(公告)日：2008-03-26
申请号：EP05001743.3
申请日：2005-01-27
Applicant: Hitachi Industries Co., Ltd.
Inventor： Ito, Yuzuru , Endo, Yoshishige , Koide, Akira
CPC classification number: B01F13/0062 , B01F5/0451 , B01F5/0453 , B01F5/0456 , B01F5/0646 , B01F5/0647 , B01F13/0066 , B01J19/0093 , B01J2219/00783 , B01J2219/00889 , B01J2219/00891 , B81B1/00 , B81B2201/051
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Patent Agency Ranking
公开(公告)号：EP1623760A2
公开(公告)日：2006-02-08
申请号：EP05001743.3
申请日：2005-01-27
Applicant: Hitachi Industries Co., Ltd.
Inventor： Ito, Yuzuru , Endo, Yoshishige , Koide, Akira
CPC classification number: B01F13/0062 , B01F5/0451 , B01F5/0453 , B01F5/0456 , B01F5/0646 , B01F5/0647 , B01F13/0066 , B01J19/0093 , B01J2219/00783 , B01J2219/00889 , B01J2219/00891 , B81B1/00 , B81B2201/051
Abstract: The invention relates to a micro fluid chip that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing and reaction (chemical reaction) of the liquids in the minute flow passage, and obtains a liquid having been processed from a liquid discharge port.
A micro fluid chip 1 that leads liquids supplied from a plurality of liquid supply ports, respectively, to a minute flow passage, performs mixing/reaction of the liquids in the minute flow passage 16, and obtains a liquid having been processed from a liquid discharge port 17, the micro fluid chip comprising liquid supplies 11, 13 that supply a plurality of flows, which are formed by division of two kinds of liquids, respectively, in an alternate arrangement, and a flow flattening portion 15 provided downstream of the liquid supplies 11, 13 to be configured in flow passage such that liquids alternately arranged are decreased in dimension as they go downstream and increased in dimension in a direction, which intersects the direction of arrangement and a direction of flow, as they go downstream, to be made substantially the same or slightly large in cross sectional area in the direction of flow.
According to the invention, liquids of large flow rates can be processed at high speed and an apparatus is not made large in size.Abstract translation: 本发明涉及将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片，进行微流路中的液体的混合和反应（化学反应），得到液体 从液体排出口处理。 将从多个液体供给口供给的液体分别引导到微小流路的微流体芯片1进行微小流路16中的液体的混合/反应，并且从液体排出口获得已经处理的液体 端口17，微流体芯片包括供给多个流的液体供给部11,13，该液体供给部11,13分别通过以交替排列的方式分割两种液体而形成，以及设置在液体供给部下游的流动平坦化部15 11,13设置在流动通道中，使得交替布置的液体随着它们向下游而在尺寸上减小，并且随着它们向下游而在与排列方向和流动方向相交的方向上尺寸增大 在流动方向上的截面积基本相同或略大。 根据本发明，可以高速度地处理大流量的液体，并且不会使装置尺寸变大。
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187.发明公开A manufacturing method of a microchemical chip made of a resin and a microchemical chip made of a resin by the method 有权由铸造树脂的微量化学芯片的制造方法和由铸塑树脂的产生微量芯片
公开(公告)号：EP1591223A2
公开(公告)日：2005-11-02
申请号：EP05252336.2
申请日：2005-04-14
Applicant: NIPPON FILCON CO., LTD.
Inventor： Saito, Mitsuru, c/o Nippon Filcon Co., Ltd , Ikegami, Yoshiyuki, c/o Nippon Filcon Co., Ltd
CPC classification number: B29C39/26 , B01L3/502707 , B29C33/306 , B29C33/3842 , B29C33/424 , B29C39/006 , B29C45/2673 , B29C45/372 , B29K2033/08 , B29K2083/00 , B29L2031/756 , B81B2201/051 , B81B2201/058 , B81C99/0085 , B81C99/009
Abstract: A manufacturing method of a microchemical chip made of a resin and having a micro channel, which comprises forming a photoresist film (2) over the surface of one side of a metal support substratum (1), stacking a photomask (4) for the formation of a channel pattern over the photoresist film (2), forming a minute-structure photoresist pattern over the metal support substratum (1) by a photofabrication technology as a flat-sheet mold, disposing the flat-sheet mold (7) or unit mold obtained by separating the flat-sheet mold (7) on the bottom of a contour forming frame for resin molding, pouring a resin into the contour forming frame for resin molding and curing the resin to form a resin structure having a micro channel formed by the mold, and attaching the resin structure having a micro channel to a flat sheet to be a lid of the micro channel; and microchemical chips manufactured by this method.
Abstract translation: 由树脂制成的微量化学芯片的制造方法，以及具有微通道，该方法包括形成金属支撑基质（1）的一侧的表面上形成光致抗蚀剂薄膜 - （2），用于形成（4）层叠的光掩模 在光刻胶膜（2）的信道的图案，形成由光加工技术在金属支持基质（1）的微小结构光致抗蚀剂图案作为平片模具中，设置所述平片模具（7）或单位模具的 通过分离上的轮廓形成为树脂模制框架的底部的平片材模具（7），浇注的树脂进入轮廓形成用于树脂模制框架和固化所述树脂以形成具有由形成的微通道的树脂结构得到 模具，以及将具有微通道的平片是微通道的盖的树脂结构; 和微量化学芯片通过该方法制造。
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公开(公告)号：EP1198344B1
公开(公告)日：2003-06-25
申请号：EP00943638.7
申请日：2000-05-23
Applicant: ATOTECH Deutschland GmbH
Inventor： THIES, Andreas , CRÄMER, Konrad , MEYER, Heinrich
CPC classification number: F28F3/048 , B01J19/0093 , B01J2219/00317 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B32B15/01 , B81B2201/0214 , B81B2201/051 , B81B2203/033 , B81C1/00206 , C40B60/14 , F28F2260/02 , G03F7/00 , H01M8/0631 , Y02P70/56
Abstract: The invention relates to a method for producing microcomponents with at least one individual layer, which has functional layers (3) on the walls of inner structures such as flow channels. The aim of the invention is to produce microcomponents that are suitable for a variety of different applications in chemical reaction engineering, for heat-exchange applications, for mixing substances or for evaporating liquids. In particular, the inventive microcomponents should not present any problems in terms of the tightness of the flow channels. To this end, the inventive method comprises the following steps: A) producing the at least one individual layer by a) producing a first metal layer or metal film (1), b) forming the inner structures in and/or on said first metal layer or metal film (1) using suitable etching techniques and/or metal application techniques, and c) forming the functional layers (3) on the walls of the inner structures only, and then B) stacking and joining the one individual layer to a segment that closes the inner structures or joining several individual layers together and to the closing segment.
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公开(公告)号：EP1198344A1
公开(公告)日：2002-04-24
申请号：EP00943638.7
申请日：2000-05-23
Applicant: ATOTECH Deutschland GmbH
Inventor： THIES, Andreas , CRÄMER, Konrad , MEYER, Heinrich
CPC classification number: F28F3/048 , B01J19/0093 , B01J2219/00317 , B01J2219/00783 , B01J2219/00835 , B01J2219/00873 , B32B15/01 , B81B2201/0214 , B81B2201/051 , B81B2203/033 , B81C1/00206 , C40B60/14 , F28F2260/02 , G03F7/00 , H01M8/0631 , Y02P70/56
Abstract: The invention relates to a method for producing microcomponents with at least one individual layer, which has functional layers (3) on the walls of inner structures such as flow channels. The aim of the invention is to produce microcomponents that are suitable for a variety of different applications in chemical reaction engineering, for heat-exchange applications, for mixing substances or for evaporating liquids. In particular, the inventive microcomponents should not present any problems in terms of the tightness of the flow channels. To this end, the inventive method comprises the following steps: A) producing the at least one individual layer by a) producing a first metal layer or metal film (1), b) forming the inner structures in and/or on said first metal layer or metal film (1) using suitable etching techniques and/or metal application techniques, and c) forming the functional layers (3) on the walls of the inner structures only, and then B) stacking and joining the one individual layer to a segment that closes the inner structures or joining several individual layers together and to the closing segment.
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公开(公告)号：JP6343553B2
公开(公告)日：2018-06-13
申请号：JP2014231743
申请日：2014-11-14
Applicant: 株式会社エンプラス
CPC classification number: F16K99/0015 , B01J19/0093 , B01J2219/00891 , B01J2219/0095 , B01L3/502723 , B01L3/502738 , B01L2200/0621 , B01L2300/0887 , B01L2400/0688 , B01L2400/086 , B81B1/00 , B81B1/002 , B81B2201/051 , B81B2203/0338 , F16K2099/0084 , G01N35/08 , G01N37/00
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