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    Anisotropic conductive adhesive compositions
    184.
    发明专利
    Anisotropic conductive adhesive compositions 未知

    公开(公告)号：IL130212D0

    公开(公告)日：2000-06-01

    申请号：IL13021297

    申请日：1997-12-15

    Applicant: SHELL INT RESEARCH

    IPC: C09J201/00 ,  C09J9/02 ,  C09J201/06 ,  H05K3/32 ,  C09J

    Abstract: A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

    185.
    发明专利
    未知

    公开(公告)号：ID21670A

    公开(公告)日：1999-07-08

    申请号：ID990526

    申请日：1997-12-15

    Applicant: SHELL INT RESEARCH

    Inventor： IYER SHRIDHAR RATNASWAMY ,  WONG PUI KWAN

    IPC: C09J201/00 ,  C09J9/02 ,  C09J201/06 ,  H05K3/32

    Abstract: A novel thermally reworkable anisotropic conductive adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one electrically conductive material present in an effective amount to provide a conducting medium in only one direction.

    One-part, low viscosity, moisture curable composition
    186.
    发明专利
    One-part, low viscosity, moisture curable composition 未知

    公开(公告)号：AU704959B2

    公开(公告)日：1999-05-13

    申请号：AU1531997

    申请日：1997-01-13

    Applicant: TREMCO INC

    Inventor： DEPOMPEI MICHAEL F ,  JANOSKI RONALD J

    IPC: C08G18/10 ,  C08G18/42 ,  C08G18/48 ,  C09J175/00 ,  C09J175/04 ,  C09J201/06

    Abstract: A one-part, low viscosity, moisture curable composition which exhibits excellent shelf stability in the absence of water, but which quickly cures at ambient conditions upon exposure to moisture in the air is a substantially anhydrous mixture containing an acetoacetate functional compound and a polyisocyanate functional compound. The composition can be suitably formulated for use as an ambient temperature, moisture curable adhesive, sealant or coating composition. The acetoacetate functional compounds have a relatively low viscosity as compared with conventional isocyanate functional compounds and thereby reduce or eliminate the need for plasticizers, organic solvents, or both. The cure chemistry of the composition simultaneously consumes and generates moisture at approximately the same rate thereby facilitating rapid cure under even low humidity conditions, and allows for efficient and facile curing of even thick layers of the composition.

    One-part, low viscosity, moisture curable composition
    187.
    发明专利
    One-part, low viscosity, moisture curable composition 未知

    公开(公告)号：AU1531997A

    公开(公告)日：1997-08-11

    申请号：AU1531997

    申请日：1997-01-13

    Applicant: TREMCO INC

    Inventor： DEPOMPEI MICHAEL F ,  JANOSKI RONALD J

    IPC: C08G18/10 ,  C08G18/42 ,  C08G18/48 ,  C09J175/00 ,  C09J175/04 ,  C09J201/06

    Abstract: A one-part, low viscosity, moisture curable composition which exhibits excellent shelf stability in the absence of water, but which quickly cures at ambient conditions upon exposure to moisture in the air is a substantially anhydrous mixture containing an acetoacetate functional compound and a polyisocyanate functional compound. The composition can be suitably formulated for use as an ambient temperature, moisture curable adhesive, sealant or coating composition. The acetoacetate functional compounds have a relatively low viscosity as compared with conventional isocyanate functional compounds and thereby reduce or eliminate the need for plasticizers, organic solvents, or both. The cure chemistry of the composition simultaneously consumes and generates moisture at approximately the same rate thereby facilitating rapid cure under even low humidity conditions, and allows for efficient and facile curing of even thick layers of the composition.

    189.
    发明专利
    未知

    公开(公告)号：DE69308323D1

    公开(公告)日：1997-04-03

    申请号：DE69308323

    申请日：1993-12-09

    Applicant: MINNESOTA MINING & MFG

    Inventor： DELGADO JOAQUIN ,  GOETZ RICHARD ,  SILVER SPENCER

    IPC: C08F290/00 ,  C08F290/06 ,  C09J7/00 ,  C09J7/02 ,  C09J11/08 ,  C09J133/04 ,  C09J133/06 ,  C09J133/08 ,  C09J201/00 ,  C09J201/06

    Abstract: The invention provides inherently tacky, polymeric, organic, solvent-insoluble, solvent dispersible, elastomeric, pressure sensitive adhesive microspheres having pendant hydrophilic polymeric or oligomeric moieties having a degree of polymerization greater than or equal to 2. The microspheres which are sterically stabilized can offer enhanced stability against coagulation caused by alkali, alkali salts, polyelectrolytes and repeated freeze/thaw cycles. The present invention also provides pressure-sensitive adhesives comprising these microspheres including aerosol spray PSAs, coated sheet materials prepared therefrom, and method of making the microspheres.

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