Abstract:
A process for fabricating a vertical structure high carrier mobility transistor on a substrate (1) of crystalline silicon doped with impurities of the N type, having a collector region (2) located at a lower portion of the substrate, the process comprising the steps of:
defining a window (10) in the semiconductor substrate (1); providing a first implantation of germanium (Ge) atoms through said window (10); providing a second implantation of acceptor dopants through said window (10) to define a base region; applying an RTA treatment, or treatment in an oven, to reconstruct the crystal lattice within the semiconductor substrate comprising a silicon/germanium alloy (Si 1-x Ge x ); forming a first thin dielectric layer (12) of silicon dioxide (SiO 2 ) by chemical vapor deposition; depositing a second dielectric layer (14) onto said first dielectric layer (12); depositing a polysilicon layer (15) onto said second dielectric layer (14); etching away, within the window region (10), said first (12) and second (14) dielectric layers, and the polysilicon layer (15), to expose the base region (3) and form isolation spacers (50) at the window edges; forming an N-doped emitter (4) in the base (3) and window regions.
This fabrication process is specially attentive to the formation of the silicon dioxide SiO 2 /Ge x Si 1-x interface present in vertical structure HBT transistors, if isolation spacers are to be formed. The fabrication process of this invention allows the frequency field of application of HBT transistors to be further extended, while eliminating deviations of the base currents from the ideal.
Abstract translation:一种用于在掺杂有N型杂质的晶体硅的衬底(1)上制造垂直结构的高载流子迁移率晶体管的方法,其具有位于衬底下部的集电极区域(2),该方法包括以下步骤: :在所述半导体衬底(1)中限定窗口(10); 提供通过所述窗口(10)的锗(Ge)原子的第一注入; 提供通过所述窗口(10)的受体掺杂剂的第二注入以限定基极区域; 在烘箱中进行RTA处理或处理以重构包括硅/锗合金(Si1-xGex)的半导体衬底内的晶格; 通过化学气相沉积形成二氧化硅(SiO 2)的第一薄介电层(12); 将第二介电层(14)沉积到所述第一介电层(12)上; 将多晶硅层(15)沉积到所述第二介电层(14)上; 在窗口区域(10),所述第一(12)和第二(14)电介质层和多晶硅层(15)之间蚀刻掉,以暴露基部区域(3)并在窗口处形成隔离间隔物(50) 边缘; 在基底(3)和窗口区域中形成N掺杂发射体(4)。 如果要形成隔离间隔物,则该制造工艺特别注意垂直结构HBT晶体管中存在的二氧化硅SiO 2 / G x Si 1-x界面的形成。 本发明的制造方法允许HBT晶体管的应用频率域进一步扩展,同时消除基极电流与理想电流的偏差。
Abstract:
An integrated structure is described, that comprises a vertical bipolar transistor and a vertical MOSFET transistor, where, in order to reduce the series resistance of the MOSFET transistor, the collector region of the bipolar transistor and the drain region of the MOSFET transistor are both parts of a common zone and are contiguous each other, so that the high charge injection in the collector region when the bipolar transistor is in conduction state, causes a simultaneous increase in the conductivity of the drain region of the MOSFET transistor. Both transistors are formed by cells each containing an elementary bipolar transistor and an elementary MOSFET transistor.
Abstract:
A monolithically integrated power device for driving electrical loads comprises a power stage (1) including a high-voltage bipolar transistor (TR1) and a low-voltage auxiliary transistor (M or TR2) cascade-connected and inserted between a first power supply terminal (C) and a second power supply terminal (S) of the device. The power device also comprises a driver circuit (4) for the power stage (1) having an input connected to an input terminal (IN) of the device. In accordance with the present invention the device includes a circuit (3) for protection thereof against an excessive temperature rise and controlling power down of the power stage (1). It comprises specifically a temperature sensing circuit (5) which generates a signal dependent on the temperature present in the device, a comparator circuit (6) which receives this signal and compares it with a reference voltage (VREF) and at least a first switch circuit (I1) generating an interdiction signal when the temperature in the device exceeds a preset maximum value and which is interlocked with an output of the comparator circuit and connected functionally through its output to the power stage. The device is advantageously usable e.g. in a fluorescent lamp driving circuit, that is to say the so-called "lamp ballast".
Abstract:
A circuit (30) for biasing epitaxial wells of a semiconductor integrated circuit comprises a first transistor (T1) and a second transistor (T2) driven in phase opposition to the first; when the supply voltage is positive, the first transistor (T1), being connected between the power supply and the epitaxial well, is conducting whereas the second transistor (T2) is cut off. When, on the contrary, the supply voltage is negative, the second transistor (T2), being connected between the epitaxial well and the ground reference GND, goes into saturation, thereby holding the epitaxial well biased to ground since, at that time, it is the highest potential present on the device. In this way, it becomes possible to always ensure reverse biasing of the parasitic diodes which form at the junctions between the epitaxial wells and the adjacent regions thereto.
Abstract:
The purpose of the present invention is to supply a method and a circuit simple and accurate enough to protect at least one transistor against exceeding a complex limit implying processing of multiple electrical quantities associated with said transistor. Since in many practical cases said complex limit corresponds to the product of at least two quantities, typically a current and a voltage, the circuit in accordance with the present invention generates electrical signals basically proportional to said quantities, multiplies them, compares the product with a reference signal corresponding to the limit placed on the transistor and acts on the transistor in such a way that said limit is not exceeded. Advantageously the multiplication of currents can be provided simply by means of connection in series of bipolar transistor junctions at which said currents are supplied to the respective emitters. In this case it is additionally advantageous to generate the reference signal by means of connection in series of the bipolar transistor junctions in such a manner as to have an analogous behaviour of the multiplier and the generator.
Abstract:
This invention is directed to provide a method, and associated circuit, which can prevent the latch-down phenomenon in transistors protected from going out of their SOAs. By supplementing the first protection circuit (against moving out of the SOA) with a second protection circuit which can drive the control terminal of the transistor such that when, upon the voltage across the main conduction path of the transistor being increased, the value of the current flowing through said path would tend, due to the first protection, to drop below a predetermined lower limit, that value can be kept approximately constant and unaffected by the load as seen from the output terminal of the transistor; the transistor will at all events supply the load with some current up to the acceptable limit VMAX by the transistor.
Abstract:
Memorization method in an electronic controller operating with fuzzy logic procedures for membership functions (FA) of logical variables (M) defined in a so-called discourse universe (U) discretized at a finite number of points (m) which provide memorization of triangular or trapezoid membership functions (FA) by means of memory words comprising a first portion in which is contained a codification of the vertex of the membership function (FA) and a second portion containing a codification corresponding to the slope of at least one side of the membership function (FA) as well as a third portion containing a codification corresponding to the slope of at least one other side of the function.