Tiled, flat-panel display having invisible seams
    11.
    发明授权
    Tiled, flat-panel display having invisible seams 失效
    平铺的平板显示屏具有不可见的接缝

    公开(公告)号:US5661531A

    公开(公告)日:1997-08-26

    申请号:US593759

    申请日:1996-01-29

    CPC classification number: G02F1/133512 G02F1/13336

    Abstract: The present invention features a tiled, substantially flat, panel display having the characteristic of visually imperceptible seams between the tiles for the intended viewing conditions, which include the perception thresholds of the human eye, the view distance, the display brightness and the level of the ambient light. The panel consists of an image source plane having spaced-apart pixels containing light-transmitting elements comprising single or multiple lightvalves. These lightvalves transmit monochromatic light, or primary color light spectra, for example, red, green and blue, in gray-scale and color displays, respectively. Each of the pixels is located along the image source plane at a uniform pitch greater than approximately 0.2 mm. Many adjacently-situated tiles are located in a plane in proximity to the image source plane. Secondary light rays can be controlled via light shields, aperture plates, masks and optical elements. The view angles of the tiled display may be further enhanced by using dispersive, optical elements such as microlens arrays. If desired, the brightness of the tiled display can be enhanced by increasing the backlight intensity or the collection of light by using optical, focusing elements such as microlens arrays.

    Abstract translation: 本发明的特征在于平铺的,基本平坦的面板显示器,其具有用于预期观看条件的瓷砖之间的视觉上不可察觉的接缝的特征,其包括人眼的感知阈值,视距,显示亮度和 环境光。 该面板包括具有间隔开的像素的图像源平面,其包含包含单个或多个光阀的透光元件。 这些光阀分别在灰度和彩色显示器上分别传输单色光或原色光谱,例如红色,绿色和蓝色。 每个像素以大于约0.2mm的均匀间距沿着图像源平面定位。 许多相邻的瓦片位于靠近图像源平面的平面中。 二次光线可以通过遮光罩,孔板,掩模和光学元件进行控制。 通过使用诸如微透镜阵列之类的色散的光学元件,可以进一步增强平铺显示器的视角。 如果需要,可以通过使用诸如微透镜阵列的光学,聚焦元件增加背光强度或收集光来增强平铺显示器的亮度。

    Interconnect structures using group VIII metals
    12.
    发明授权
    Interconnect structures using group VIII metals 失效
    使用第VIII族金属的互连结构

    公开(公告)号:US5563449A

    公开(公告)日:1996-10-08

    申请号:US374059

    申请日:1995-01-19

    CPC classification number: H01L23/53242 H01L23/53252 H01L2924/0002

    Abstract: A multiple layer interconnect structure for a semiconductor chip includes a graded transition layer of tungsten and a Group VIII metal, such as palladium, platinum or nickel (Pd, Pt or Ni) which allows formation of a Group VIII metal interconnect on a conventional pad of Al or Al alloy. The graded transition layer is interfaced between a thin adhesion layer on the pad and the Group VIII metal interconnect, and is approximately 100% tungsten where it interfaces the adhesion layer and approximately 100% Group VIII metal where it interfaces the interconnect layer. The tungsten in the graded transition layer acts as a solder barrier and the Group VIII metal interconnect is compatible with the silicon substrate so that packaging processing steps, including lead soldering, can be carried out, and the chip electrically tested, in the semiconductor fabrication facility.

    Abstract translation: 用于半导体芯片的多层互连结构包括钨的渐变过渡层和诸如钯,铂或镍(Pd,Pt或Ni)的第VIII族金属,其允许在常规的焊盘上形成第VIII族金属互连 Al或Al合金。 梯度过渡层接合在焊盘上的薄粘合层和第VIII族金属互连之间,并且是大约100%的钨,其中它粘合粘合层和大约100%的VIII族金属,其中它连接互连层。 渐变过渡层中的钨作为焊料阻挡层,第VIII族金属互连与硅衬底兼容,从而可以在半导体制造设备中进行包括铅焊接在内的包装处理步骤,并进行电路测试。 。

    Interconnect structures containing blocked segments to minimize stress
migration and electromigration damage
    13.
    发明授权
    Interconnect structures containing blocked segments to minimize stress migration and electromigration damage 失效
    互连结构包含阻塞段以最小化应力迁移和电迁移损伤

    公开(公告)号:US5439731A

    公开(公告)日:1995-08-08

    申请号:US208598

    申请日:1994-03-11

    Abstract: Interconnect or metallization structures for integrated circuits on semiconductor chips contain blocked conductor segments to limit atomic transport from one segment to another thus minimizing stress migration and electromigration damage. Since the blocked conductor segments prevent atomic transport between two neighboring segments, the total amount of atoms and vacancies available for hillock and void growth in a segment can be controlled by the length of the segment. The conductor segments are made of high electrical conductance metals, such as aluminum, copper or gold based alloys, and are separated by very short segments of a high melting temperature refractory metal or alloy. Because of their high melting temperatures, refractory metals or alloys suppress atomic transport. The interconnect structures can be fabricated by conventional lithographic and deposition techniques.

    Abstract translation: 用于半导体芯片上的集成电路的互连或金属化结构包含阻塞的导体部分,以限制从一个部分到另一个部分的原子传输,从而最小化应力迁移和电迁移损伤。 由于阻塞的导体段阻止两个相邻段之间的原子传输,可用于段中的小丘和空隙生长的原子和空位的总量可以由段的长度来控制。 导体段由诸如铝,铜或金基合金的高电导金属制成,并且由非常短的高熔点难熔金属或合金段分开。 由于其熔融温度高,难熔金属或合金抑制原子运输。 互连结构可以通过常规的光刻和沉积技术制造。

    Electrical contact and connector system
    16.
    发明申请
    Electrical contact and connector system 失效
    电触点和连接器系统

    公开(公告)号:US20070105406A1

    公开(公告)日:2007-05-10

    申请号:US11334993

    申请日:2006-01-18

    Applicant: Che-Yu Li

    Inventor: Che-Yu Li

    CPC classification number: H01R13/2435 H01R13/03

    Abstract: An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. A connector system having a housing that has a plurality of through openings. A plurality of electrical contacts, each being formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. Each of the electrical contacts is arranged within a corresponding one of the plurality of through openings such that the first contact edge is positioned outside of the through-opening in which electrical contact is positioned, and the second contact edge is positioned outside of the through-opening in which electrical contact is positioned, but spaced from the first contact edge.

    Abstract translation: 由柔性折叠片形成的电接触件包括顶表面,底表面,第一接触边缘和第二接触边缘。 在顶表面和底表面上形成多个波纹,其终止于第一接触边缘和第二接触边缘。 一种具有壳体的连接器系统,该壳体具有多个通孔。 多个电触头,每个电触头由兼容的折叠片形成,包括顶表面,底表面,第一接触边缘和第二接触边缘。 在顶表面和底表面上形成多个波纹,其终止于第一接触边缘和第二接触边缘。 每个电接触件布置在所述多个通孔中的相应的一个中,使得所述第一接触边缘位于所述通孔的外侧,在所述通孔中位于所述通孔中,并且所述第二接触边缘位于所述通孔的外侧, 开口,其中电接触被定位,但是与第一接触边缘隔开。

    ELECTRICAL CONTACT
    17.
    发明申请
    ELECTRICAL CONTACT 审中-公开
    电气联系

    公开(公告)号:US20060211276A1

    公开(公告)日:2006-09-21

    申请号:US11279311

    申请日:2006-04-11

    Applicant: CHE-YU LI

    Inventor: CHE-YU LI

    Abstract: An electrical contact formed from a plurality of interlaced and annealed wires by weaving or braiding the wires together to form a mesh, annealing the mesh, and cutting the annealed mesh so as to form a plurality of individual electrical contacts. A method for forming a precursor material for use in manufacturing an electrical contact is also provided that includes manipulating a plurality of wires so as to interlace the wires into a unitary structure The unitary structure is then annealed. An electrical contact may then be formed from the precursor material by elastically rolling a portion of the unitary structure so as to form a tube, annealing the tube, and then cutting the unitary structure so as to release the tube thereby to form an electrical contact. An electrical contact may also be formed by folding a portion of the unitary structure so as to form one or more pleats, annealing the pleated unitary structure and then cutting the pleated unitary structure so as to release one or more electrical contacts. The precursor material may also be formed by photo-etching a sheet of conductive material so as to form a mesh, and then annealing the mesh. A connector system may be formed including a housing defining a plurality of openings that are each filled with an electrical contact comprising a plurality of interlaced and annealed wires that have been previously either rolled or pleated.

    Abstract translation: 通过将电线编织或编织在一起以形成网格,退火网格和切割退火的网格以形成多个单独的电触点,由多个交织和退火的线形成的电接触。 还提供了一种用于形成用于制造电触点的前体材料的方法,该方法包括操作多根导线以便将导线交织成整体结构。然后将整体结构退火。 然后可以通过弹性地滚动一体结构的一部分来形成电子接触,从而形成管,退火管,然后切割整体结构,从而释放管,从而形成电接触。 也可以通过折叠整体结构的一部分以形成一个或多个褶皱,对褶皱的整体结构进行退火,然后切割褶皱的整体结构以便释放一个或多个电触点,形成电接触。 前体材料也可以通过光刻蚀导电材料片以形成网格,然后对网格进行退火而形成。 可以形成连接器系统,其包括限定多个开口的壳体,每个开口填充有包括先前已经被卷起或打褶的多个隔行和退火的电线的电接触。

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