公开(公告)号：US20070235683A1

公开(公告)日：2007-10-11

申请号：US11309365

申请日：2006-08-01

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: C09K5/00

CPC classification number: C09K5/14

Abstract: A heat conductive silicone grease composition is provided. The heat conductive silicone grease composition comprises: (A) a hydroxyl group-containing organopolysiloxane, and (B) a thermoconductive inorganic filler having an average particle size of 0.1˜10 micrometers.

Abstract translation: 提供导热硅脂组合物。 导热硅脂组合物包含：（A）含羟基的有机聚硅氧烷，和（B）平均粒径为0.1〜10微米的导热无机填料。

公开(公告)号：US20070148425A1

公开(公告)日：2007-06-28

申请号：US11309250

申请日：2006-07-20

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: D04H13/00

CPC classification number: B32B25/02 ,  B32B5/024 ,  B32B15/02 ,  B32B15/06 ,  B32B15/18 ,  B32B15/20 ,  B32B25/10 ,  B32B25/20 ,  B32B2262/103 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2307/302 ,  B32B2457/00 ,  Y10T428/249924

Abstract: A thermal interface material (13) and a semiconductor device (10) using the thermal interface material are provided. The thermal interface material is formed as a sheet, comprising a pair of cured sheets (131) and a reinforcement member (132) arranged between the cured sheets. The reinforcement member, which improves the physical strength of the thermal interface material, is made of a material chosen from the group consisting of woven copper fabric, woven copper cloth, woven stainless fabric, woven stainless cloth, and any appropriate combination of the aforementioned materials.

Abstract translation: 提供了使用热界面材料的热界面材料（13）和半导体器件（10）。 热界面材料形成为片材，其包括一对固化片（131）和布置在固化片之间的加强构件（132）。 提高热界面材料的物理强度的加强构件由选自编织铜布，编织铜布，编织不锈织物，编织不锈布和上述材料的任何适当组合的材料制成 。

公开(公告)号：US20110111537A1

公开(公告)日：2011-05-12

申请号：US13006226

申请日：2011-01-13

Applicant: CHING-TAI CHENG ,  Jui-Kang Yen

Inventor： CHING-TAI CHENG ,  Jui-Kang Yen

IPC: H01L33/48 ,  H01L21/60

CPC classification number: H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.

Abstract translation: 提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。 本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP） 。 对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。 对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

公开(公告)号：US20080303157A1

公开(公告)日：2008-12-11

申请号：US11760369

申请日：2007-06-08

Applicant: Ching-Tai Cheng ,  Jui-Kang Yen

Inventor： Ching-Tai Cheng ,  Jui-Kang Yen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.

Abstract translation: 提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。 本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP） 。 对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。 对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

公开(公告)号：US07381346B2

公开(公告)日：2008-06-03

申请号：US11521918

申请日：2006-09-15

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C09K5/08 ,  H05K7/20 ,  F28F7/00

CPC classification number: H01L23/42 ,  F28F13/00 ,  F28F2013/006 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermal interface material is for being applied to the contact surfaces to eliminate the air interstices between the heat dissipating apparatus and the electronic component in order to improve heat dissipation of the electronic component. The thermal interface material includes pentaerythritol oleate as base oil and fillers filled in the pentaerythritol oleate for improving the heat conductivity of the thermal interface material. The pentaerythritol oleate is used for holding the fillers therein and filling the air interstices to achieve an intimate contact between the heat dissipating apparatus and the electronic component. The fillers include aluminum powders, zinc oxide powders and zinc oxide nano-particles.

Abstract translation: 热界面材料用于施加到接触表面以消除散热装置和电子部件之间的空气间隙，以便改善电子部件的散热。 热界面材料包括作为基础油的季戊四醇油酸酯和填充在油酸季戊四醇酯中的填料，用于改善热界面材料的导热性。 油酸季戊四醇用于保持其中的填料并填充空气间隙以实现散热装置和电子部件之间的紧密接触。 填料包括铝粉，氧化锌粉和氧化锌纳米颗粒。

公开(公告)号：US20060219391A1

公开(公告)日：2006-10-05

申请号：US11164323

申请日：2005-11-18

Applicant: Chu-Wan Hong ,  Jung-Yuan Wu ,  Chang-Ting Lo ,  Ching-Tai Cheng

Inventor： Chu-Wan Hong ,  Jung-Yuan Wu ,  Chang-Ting Lo ,  Ching-Tai Cheng

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a casing (12) and a sintered powder wick (14) arranged at an inner surface of the casing. The sintered powder wick is in the form of a multi-layer structure in a radial direction of the casing and at least one layer is divided into multiple sections in a longitudinal direction of the casing, and the multiple sections have powder sizes different from each other. The sections with large-sized powders are capable of reducing the flow resistance to the condensed liquid to flow back while the sections with small-sized powders are capable of providing a satisfactory capillary force for moving the condensed liquid.

Abstract translation: 热管（10）包括壳体（12）和布置在壳体的内表面处的烧结粉末灯芯（14）。 烧结的粉末芯在壳体的径向方向上呈多层结构的形式，并且至少一层在壳体的纵向方向上分成多个部分，并且多个部分具有彼此不同的粉末尺寸 。 具有大尺寸粉末的部分能够降低冷凝液体的流动阻力以流回，而具有小尺寸粉末的部分能够提供用于移动冷凝液体的令人满意的毛细管力。

公开(公告)号：US20060213061A1

公开(公告)日：2006-09-28

申请号：US11164859

申请日：2005-12-08

Applicant: Jung-Yuan Wu ,  Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo

Inventor： Jung-Yuan Wu ,  Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo

IPC: B23P6/00

CPC classification number: H01L23/427 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/046 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A method (50) for making a heat pipe (10) includes the following steps: a) providing a screen mesh (30) in the form of a multi-portion structure with at least one portion having an average pore size different from that of the other portions; b) rolling the screen mesh into a hollow column form; c) inserting the screen mesh into a hollow pipe body (22) of the heat pipe; d) sintering the screen mesh received therein at a predetermined temperature; and e) filling a working fluid into the pipe body and sealing the pipe body. The portion with large-sized pores is capable of reducing the flow resistance to a condensed fluid to flow back, whereas the portion with small-size pores is capable of providing a relatively large capillary pressure for drawing the condensed fluid from the condensing section to the evaporating section of the heat pipe.

Abstract translation: 一种用于制造热管（10）的方法（50）包括以下步骤：a）提供多部分结构形式的筛网（30），其中至少一部分平均孔径与 其他部分; b）将筛网滚动成空心柱状; c）将筛网插入热管的中空管体（22）中; d）在预定温度下烧结其中容纳的筛网; 以及e）将工作流体填充到管体中并密封管体。 具有大孔的部分能够降低对冷凝流体的流动阻力以流回，而具有小尺寸孔的部分能够提供相对较大的毛细管压力，用于将冷凝流体从冷凝部分抽出到 热管的蒸发段。

公开(公告)号：US20060201655A1

公开(公告)日：2006-09-14

申请号：US11164325

申请日：2005-11-18

Applicant: Chu-Wan Hong ,  Chang-Ting Lo ,  Jung-Yuan Wu ,  Ching-Tai Cheng

Inventor： Chu-Wan Hong ,  Chang-Ting Lo ,  Jung-Yuan Wu ,  Ching-Tai Cheng

IPC: F28D15/00

CPC classification number: F28D15/046 ,  F28F1/003 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A mesh-type heat pipe (10) includes a casing (12), a tube (14) located inside the casing and a screen mesh wick (16) located between the casing and the tube. The tube defines therein a plurality of through holes (142) and at least one cutout (144). The wick is held against the casing by the tube. Under the support of the tube, the wick as a whole engages closely an inner surface of the casing, thereby establishing an effective heat transfer path between the casing and a working fluid that is saturated in the wick. Meanwhile, with the cutout in the tube presented, the heat pipe incorporating such tube is easily to be bent or flattened so as to enable the heat pipe to be applicable in electronic devices with a limited mounting space for a cooling device, such as notebook computers.

Abstract translation: 网状热管（10）包括壳体（12），位于壳体内的管（14）和位于壳体和管之间的筛网芯（16）。 管中限定有多个通孔（142）和至少一个切口（144）。 灯芯通过灯管固定在外壳上。 在管的支撑下，芯整体接合壳体的内表面，从而在壳体和芯体中饱和的工作流体之间建立有效的传热路径。 同时，由于管中的切口呈现，所以包含这种管的热管容易弯曲或平坦化，以使得热管能够适用于具有有限的安装空间的电子设备，例如笔记本电脑 。

公开(公告)号：US07682083B2

公开(公告)日：2010-03-23

申请号：US11245319

申请日：2005-10-06

Applicant: Chu-Wan Hong ,  Ching-Tai Cheng ,  Tze-Yuan Wang

Inventor： Chu-Wan Hong ,  Ching-Tai Cheng ,  Tze-Yuan Wang

IPC: F16C33/24

CPC classification number: F16C33/103

Abstract: A bearing system includes a bearing, a shaft extending in the bearing, and a layer of nano-structured coating coated on one of the bearing and the shaft. A space is formed between the bearing and the shaft, and a lubricant is filled in the space. The lubricant is made of polymer material with hydrophilic and hydropholic properties. The nano-structured coating has a high surface tension which results in the coating being capable of adsorbing the lubricant to form a layer of lubricant film between the coating and the other of the bearing and the shaft, thereby reducing possibility of direct contact between the lubricant and the other of the shaft and the bearing. Thus, loss of the lubricant is reduced to avoid contacting frication between the shaft and the bearing. Accordingly, noise generated by the bearing system is decreased and life of the bearing system is extended.

Abstract translation: 轴承系统包括轴承，在轴承中延伸的轴和涂覆在轴承和轴之一上的纳米结构涂层。 在轴承和轴之间形成空间，并且在该空间中填充润滑剂。 润滑剂由具有亲水和疏水性质的聚合物材料制成。 纳米结构涂层具有高的表面张力，这导致涂层能够吸附润滑剂以在涂层和轴承和轴的另一个之间形成润滑剂膜层，从而减少润滑剂之间的直接接触的可能性 和另一个轴和轴承。 因此，减少润滑剂的损失，以避免在轴和轴承之间接触磨料。 因此，由轴承系统产生的噪声减小，轴承系统的寿命延长。

公开(公告)号：US20070187641A1

公开(公告)日：2007-08-16

申请号：US11309896

申请日：2006-10-24

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C09K5/00

CPC classification number: C09K5/10

Abstract: A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.

Abstract translation: 热界面材料（10）包括100重量份的硅油（11）和800〜1200重量份的混合到硅油中的金属粉末（12）。 金属粉末的每个金属颗粒（121）的外表面涂覆有金属氧化物层（122）。 一种制备该热界面材料的方法包括以下步骤：（1）在金属粉末上涂一层有机偶联剂; （2）在200〜300℃的温度下加热金属粉末，以在金属粉末的外表面上涂覆金属氧化物层; 和（3）将金属粉末与涂覆的金属氧化物层一起添加到硅油中。 热界面材料具有优异的导热性和优异的电绝缘性能。