公开(公告)号：US07911059B2

公开(公告)日：2011-03-22

申请号：US11760369

申请日：2007-06-08

Applicant: Ching-Tai Cheng ,  Jui-Kang Yen

Inventor： Ching-Tai Cheng ,  Jui-Kang Yen

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L33/641 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation.

Abstract translation: 提供了一种用于封装半导体管芯以提高导热性并且与常规半导体封装技术相比更简单的制造的方法和装置。 本文描述的封装技术可适用于各种半导体器件，例如发光二极管（LED），中央处理单元（CPU），图形处理单元（GPU），微控制器单元（MCU）和数字信号处理器（DSP） 。 对于一些实施例，封装包括陶瓷衬底，其具有上空腔，其中设置有一个或多个半导体管芯，并且具有沉积有一个或多个金属层的下部空腔，以将散热从半导体管芯散出。 对于其它实施例，封装包括陶瓷衬底，该陶瓷衬底具有上空腔，其中设置有一个或多个半导体管芯，并且具有下表面，其上沉积有一个或多个金属层，用于有效散热。

公开(公告)号：US07728052B2

公开(公告)日：2010-06-01

申请号：US11309896

申请日：2006-10-24

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C08K3/22

CPC classification number: C09K5/10

Abstract: A thermal interface material (10) includes 100 parts by weight of a silicone oil (11) and 800˜1200 parts by weight of a metal powder (12) mixed into the silicone oil. An outer surface of each metal particle (121) of the metal powder is coated with a metal oxide layer (122). A method of producing the thermal interface material includes steps of: (1) applying a layer of organo coupling agent on the metal powder; (2) heating the metal powder at a temperature between 200 to 300° C. to coat a metal oxide layer on an outer surface of the metal powder; and (3) adding the metal powder with the coated metal oxide layer to a silicone oil. The thermal interface material has an excellent thermal conductivity and an excellent electrical insulating property.

Abstract translation: 热界面材料（10）包括100重量份的硅油（11）和800〜1200重量份的混合到硅油中的金属粉末（12）。 金属粉末的每个金属颗粒（121）的外表面涂覆有金属氧化物层（122）。 一种制备该热界面材料的方法包括以下步骤：（1）在金属粉末上涂一层有机偶联剂; （2）在200〜300℃的温度下加热金属粉末，以在金属粉末的外表面上涂覆金属氧化物层; 和（3）将金属粉末与涂覆的金属氧化物层一起添加到硅油中。 热界面材料具有优异的导热性和优异的电绝缘性能。

公开(公告)号：US20080179618A1

公开(公告)日：2008-07-31

申请号：US11627489

申请日：2007-01-26

Applicant: CHING-TAI CHENG

Inventor： CHING-TAI CHENG

IPC: H01L33/00 ,  H05K7/20

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/10106 ,  H05K2201/10113 ,  H01L2924/00014

Abstract: Light-emitting diode (LED) packages with improved heat transfer paths for LED dies encased therein when compared to conventional LED packages are provided. For some embodiments, the LED package includes a ceramic substrate having a top cavity with one or more LED dies disposed within and having a bottom cavity for receiving a metallic insert to dissipate heat away from the LED dies. For other embodiments, an LED package is provided that includes a ceramic substrate having a heat spreader coupled to thermal vias filled with a highly thermally conductive composite.

Abstract translation: 提供了与常规LED封装相比，其中封装有LED管芯的改善的传热路径的发光二极管（LED）封装。 对于一些实施例，LED封装包括具有顶部空腔的陶瓷衬底，所述顶部空腔具有设置在其内的一个或多个LED管芯，并且具有底部空腔，用于接收金属插入件以将热量从LED管芯散开。 对于其他实施例，提供了一种LED封装，其包括陶瓷衬底，该陶瓷衬底具有耦合到填充有高导热性复合材料的热通孔的散热器。

公开(公告)号：US20070187460A1

公开(公告)日：2007-08-16

申请号：US11309786

申请日：2006-09-26

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: A47J36/02

CPC classification number: H01L23/3736 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in spaces formed between the heat source and the heat-dissipating component. The thermal interface material includes 30% to 60% by weight of bismuth, up to 40% by weight of tin, and the rest indium.

Abstract translation: 半导体装置（10）包括热源（12），用于散热由热源产生的热量的散热部件（13）和填充在热源和热源之间的空间中的热界面材料（14） 耗散组分 热界面材料包括30重量％至60重量％的铋，至多40重量％的锡，余下的铟。

公开(公告)号：US20070131913A1

公开(公告)日：2007-06-14

申请号：US11462673

申请日：2006-08-04

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: H01B1/12

CPC classification number: C09K5/14 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/3737 ,  H01L2224/16 ,  H01L2224/73253

Abstract: A semiconductor device (10) includes a heat source (12), a heat-dissipating component (13) for dissipating heat generated by the heat source, and a thermal interface material (14) filled in a space formed between the heat source and the heat-dissipating component. The thermal interface material includes a mixture of first copper powders having an average particle size of 2 um and second copper powders having an average particle size of 5 um, a silicone oil having a viscosity from 50 to 50,000 cs at 25° C., and at least one oxide powder selected from the group consisting of zinc oxide and alumina powders. The mixture of copper powders is 50% to 90% in weight, the silicone oil is 5% to 15% in weight and the at least one oxide powder is 0% to 35% in weight of the thermal interface material.

Abstract translation: 半导体器件（10）包括热源（12），用于散热由热源产生的热量的散热部件（13），以及填充在形成于热源和热源之间的空间中的热界面材料 散热部件。 热界面材料包括平均粒度为2μm的第一铜粉末和平均粒度为5μm的第二铜粉末，在25℃下具有50至50,000cs粘度的硅油，以及 至少一种选自氧化锌和氧化铝粉末的氧化物粉末。 铜粉的混合物的重量比为50重量％至90重量％，硅油的重量为5重量％至15重量％，至少一种氧化物粉末为热界面材料重量的0至35重量％。

公开(公告)号：US20070131055A1

公开(公告)日：2007-06-14

申请号：US11309379

申请日：2006-08-02

Applicant: CHING-TAI CHENG ,  NIEN-TIEN CHENG

Inventor： CHING-TAI CHENG ,  NIEN-TIEN CHENG

IPC: C22C1/05

CPC classification number: C22C32/0042 ,  B22F2998/00 ,  C22C32/0026 ,  C22C32/0094 ,  H01L23/3737 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29294 ,  H01L2224/29311 ,  H01L2224/29355 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01055 ,  B22F1/0048

Abstract: A semiconductor device includes a heat source, a heat-dissipating component for dissipating heat generated by the heat source, and thermal interface material filled in a space formed between the heat source and the heat-dissipating component. The thermal interface material includes 50% to 90% in weight of at least one metal powders having an average particle size of 2 to 20 μm and selected from the group consisting of spherical tin powders and powders of memory alloy, and 5% to 15% in weight of silicone oil having a viscosity from 50 tO 50,000 cs at 25° C.

Abstract translation: 半导体器件包括热源，用于耗散由热源产生的热量的散热部件和填充在形成于热源和散热部件之间的空间中的热界面材料。 热界面材料包括平均粒径为2至20μm的至少一种金属粉末的重量的50％至90％，并且选自球形锡粉末和记忆合金粉末，和5％至15％ 在25℃下粘度为50吨50,000cs的硅油重量

公开(公告)号：US20060162906A1

公开(公告)日：2006-07-27

申请号：US11164093

申请日：2005-11-10

Applicant: Chu-Wan Hong ,  Jung-Yuan Wu ,  Ching-Tai Cheng ,  Chang-Ting Lo

Inventor： Chu-Wan Hong ,  Jung-Yuan Wu ,  Ching-Tai Cheng ,  Chang-Ting Lo

IPC: F28D15/02

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a pipe body (20) having an inner wall (22) and a screen mesh (30) disposed on the inner wall of the pipe body. The screen mesh is in the form of a multi-layer structure with at least one layer thereof having an average pore size different from that of the other layers. The layer with large-sized pores is capable of reducing the flow resistance to the condensed fluid to flow back, whereas the layer with small-size pores is capable of providing a relatively large capillary pressure for drawing the condensed fluid from the condensing section to the evaporating section.

Abstract translation: 热管（10）包括具有设置在管体内壁上的内壁（22）和筛网（30）的管体（20）。 筛网是多层结构的形式，其中至少一层具有不同于其它层的平均孔径。 具有大尺寸孔的层能够降低对冷凝流体的流动阻力以流回，而具有小尺寸孔的层能够提供相对较大的毛细管压力，用于将冷凝流体从冷凝部分抽出到 蒸发段。

公开(公告)号：US20060157229A1

公开(公告)日：2006-07-20

申请号：US11292258

申请日：2005-12-01

Applicant: Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo ,  Jung-Yuan Wu

Inventor： Chu-Wan Hong ,  Ching-Tai Cheng ,  Chang-Ting Lo ,  Jung-Yuan Wu

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: A heat pipe (10) includes a pipe body (30) filled with working fluid, a screen mesh (50) located in the pipe body, a porous support member (70) supporting the screen mesh to contact with an inner wall (32) of the pipe body.

Abstract translation: 热管（10）包括填充有工作流体的管体（30），位于管体内的筛网（50），支撑筛网以与内壁（32）接触的多孔支撑构件（70） 的管体。

公开(公告)号：US07852015B1

公开(公告)日：2010-12-14

申请号：US11548604

申请日：2006-10-11

Applicant: Jui-Kang Yen ,  Trung Tri Doan ,  Yung-Wei Chen ,  Ching-Tai Cheng

Inventor： Jui-Kang Yen ,  Trung Tri Doan ,  Yung-Wei Chen ,  Ching-Tai Cheng

IPC: H05B41/16

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21Y2105/10 ,  F21Y2115/10

Abstract: A solid state light module incorporating light emitting diodes (LEDs) disposed on a metal substrate, a solid state lighting system employing such modules, and method of replacing LEDs of the light modules are provided. The metal substrate may allow for lower LED junction temperature and, hence, a longer device lifetime. In addition, the metal substrate may allow for the potential omission of a heat sink, which may reduce light module size, when compared to conventional solid state light emitters.

Abstract translation: 提供了一种结合设置在金属基板上的发光二极管（LED）的固态光模块，采用这种模块的固态照明系统，以及替换该光模组的LED的方法。 金属基板可以允许较低的LED结温度，并因此允许更长的器件寿命。 此外，与传统的固态发光体相比，金属基板可以允许潜在的省略散热器，这可能减少光模块尺寸。

公开(公告)号：US07541403B2

公开(公告)日：2009-06-02

申请号：US11309611

申请日：2006-08-31

Applicant: Ching-Tai Cheng ,  Nien-Tien Cheng

Inventor： Ching-Tai Cheng ,  Nien-Tien Cheng

IPC: C08K3/22

CPC classification number: C08L83/08 ,  C08K3/10 ,  C08K3/22 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2982 ,  Y10T428/31663 ,  C08L83/00

Abstract: A thermal interface material includes 100 parts by weight of base oil including amino-modified silicone fluid and at least one of methylphenylsilicone fluid and fluorosilicone fluid, and 800 to 1200 parts by weight of fillers filled in the base oil. The fillers have an average particle size of 0.1 to 5 um and are selected from the group consisting of zinc oxide powder, alumina powder and metallic aluminum powder.

Abstract translation: 热界面材料包括100重量份的基础油，包括氨基改性的硅氧烷流体和甲基苯基硅酮流体和氟硅酮流体中的至少一种，以及填充在基础油中的800至1200重量份的填料。 填料的平均粒径为0.1-5μm，选自氧化锌粉末，氧化铝粉末和金属铝粉末。