公开(公告)号：US20090104471A1

公开(公告)日：2009-04-23

申请号：US12076284

申请日：2008-03-17

Applicant: Chung-Lin Wang

Inventor： Chung-Lin Wang

IPC: B32B15/00

CPC classification number: B32B15/017 ,  C22C21/00 ,  Y10T428/12229

Abstract: The present invention discloses a solderable aluminum-based material, wherein electron donors combine with the non-bonded atoms on the surface of an aluminum-based material. The bonding between the electron donors and the aluminum atoms on the surface generates a protective film to prevent from the formation of an aluminum oxide layer on the surface of the aluminum-based material. The present invention improves the conventional aluminum-based material, and has lightweightness, a low price, a high economic value, a high electric conductivity, a high thermal conductivity and a superior solderability. Thereby, a normal soldering, a total-face soldering or a double-side soldering can be easily performed on the solderable aluminum-based material of the present invention with a common soldering technology.

Abstract translation: 本发明公开了一种可焊接铝基材料，其中电子给体与铝基材料表面上的非键合原子结合。 电子给体和表面上的铝原子之间的键合产生保护膜，以防止在铝基材料的表面上形成氧化铝层。 本发明改进了传统的铝基材料，具有轻便性，低价格，高经济价值，高导电性，高导热性和优异的可焊性。 因此，通过普通的焊接技术，可以容易地对本发明的可焊接的铝基材料进行正常的焊接，总面焊接或双面焊接。