Abstract:
PROBLEM TO BE SOLVED: To achieve the effect of enhancing the reliability and yield while reducing the cost, by simplifying the element constitution and package process and assembly process to a minimum.SOLUTION: In a light-emitting diode device not requiring a package process nor a circuit board, and a manufacturing method therefor, any substrate for semiconductor package and a printed circuit board are not required. Mainly, two electrodes and one or a plurality of chip elements that can be connected externally by means of wires are provided on a light-emitting diode chip. The two electrodes are conducted by being connected electrically and directly with a DC power supply or an AC power supply by means of wires, and light is emitted from the light-emitting diode.
Abstract:
This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.
Abstract translation:本发明提供了一种用于近视控制的隐形眼镜,包括:物体侧表面,包括同心且具有不同屈光力的中心区域,过渡区域和周边区域,所述三个区域中的至少一个是非球面的; 和图像侧表面; 其中中心区域提供校正力以将视网膜聚焦在中心凹图像上,周边区域通过在视网膜前方产生对中央凹图像来提供近视散焦效果,并且具有一个或多个焦点的过渡区域提供折射力 屈光度(D)范围从+0.25 D到+8.00 D.
Abstract:
This invention provides a container for a contact lens, comprising: a central recess; a peripheral groove surrounding the central recess; and a rim surrounding the peripheral groove; wherein the central recess is a curved surface having one or a plurality of continuous R values less than an R value of the contact lens in its natural state, and wherein the R value is a radius of curvature of a curved surface.
Abstract:
The present invention provides a method of arranging a huge amount of chips, comprising the sequential steps: a providing step of providing a substrate and a plurality of chips; a spreading step of spreading a plurality of chips on the surface of the substrate; a tilting step of tilting the substrate by an angle to slide down the plurality of chips along the surface of the substrate so that the trapping stoppers trap the plurality of chips respectively in such a manner that the blocked chips are placed in the chip placing areas respectively; an adhering step of adhering, onto the chip placing areas, the chips with the working surface upward; and a removing step of removing, from the substrate, the chips which are not adhered onto the chip placing areas. A huge number of chips can be transferred efficiently by the method of the present invention.
Abstract:
A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.
Abstract:
A resistor comprises a substrate, an upper ohmic region disposed on a selective one of an upper surface and a lower surface of the substrate and a lower ohmic region disposed on the other one of the upper surface and the lower surface of the substrate. An upper metal conducting layer overlies on the substrate and the upper ohmic region, and a lower metal conducting layer overlies on the lower ohmic region. When the upper and lower metal conducting layers are electrified, the upper ohmic region and the lower ohmic region are electrically connected, and a contact interface between the substrate and the upper metal conducting layer forms an enlarged depletion region to block electrical conduction therebetween. As a result, a resistance value of the resistor is increased when an applied voltage on the resistor is increased.
Abstract:
This invention provides a contact lens for myopia control comprising: an object-side surface comprising a central zone, a transition zone and a peripheral zone which are concentric and have different refractive power, at least one of the three zones being aspheric; and an image-side surface; wherein the central zone provides correction power to focus a foveal image on the retina, the peripheral zone provides a myopic defocus effect by generating a para-fovea image in front of the retina, and the transition zone with one or more focuses provides a refractive power in diopter (D) ranging from +0.25 D to +8.00 D.
Abstract translation:本发明提供了一种用于近视控制的隐形眼镜,包括:物体侧表面,包括同心且具有不同屈光力的中心区域,过渡区域和周边区域,所述三个区域中的至少一个是非球面的; 和图像侧表面; 其中中心区域提供校正力以将视网膜聚焦在中心凹图像上,周边区域通过在视网膜前方产生对中央凹图像来提供近视散焦效果,并且具有一个或多个焦点的过渡区域提供折射力 屈光度(D)范围从+0.25 D到+8.00 D.
Abstract:
Contact lenses with pores having high oxygen permeability and a manufacturing method thereof. The manufacturing method comprises the steps of uniformly mixing water-soluble salts and the formula of contact lenses having hydrophilic monomers to form a mixed formula; molding and forming the mixed formula to obtain contact lenses; dissolving and dialyzing the water-soluble salts by a water solution so as to form a plurality of pores with a predetermined diameter on a surface and in the interior of the contact lenses. The diameter of pore size has an allowable range between 0.03 μm and 0.05 μm such that the contact lenses with high oxygen permeability can be obtained.
Abstract:
The present invention discloses a method for fabricating an AC LED package device, which comprises steps: providing a plurality of LED modular chips each having a plurality of LEDs in same polar direction in series; connecting forward and reversely the LED modular chips with a wire-bonding method to form an AC LED package device; and connecting the AC LED package device with an AC power source. In the present invention, the LED modular chips, each of which have LEDs all connected in same polar direction, are used to form an AC LED package device. Therefore, the present invention is using less-complicated photomasks compared with prior art. Accordingly, the present invention simplifies the process, promotes the yield and lowers the cost.
Abstract:
The present invention discloses a package-free and circuit board-free LED device and a method for fabricating the same. The LED device is exempted from the semiconductor package substrate and the printed circuit board and comprises at least one LED chip having two electrodes able to directly connect with external wires and at least one chip unit. A DC power or an AC power is directly electrically connected with the two electrodes through wires to drive the LED device to emit light. The present invention minimizes device components and fabrication steps, effectively reduces cost and promotes reliability and yield.