Abstract:
The present invention provides a memory card realizing a simplified erasing process and shortened process time as a whole and capable of preventing an illegal access to the memory card discarded, and a system using the memory card. A system includes a flash memory card and a host device which is electrically connected to the flash memory card and controls the operation of the flash memory card. The system includes an erase command for executing an operation of erasing information in a data area in a flash memory and, in addition, a purge command for executing an operation of erasing all of information in the data area and a management information area in the flash memory. The purge command is issued by the host device to the flash memory card, thereby enabling the whole areas in the flash memory to be erased by the single issue of the purge command without issuing the erase command a plurality of times.
Abstract:
Disclosed is a nonvolatile memory with a shortened total write time, capable of stably writing data by making a write current constant while reducing fluctuations in a voltage generated by a booster circuit. In a nonvolatile memory such as a flash memory, data is determined at the time of writing operation. While skipping a bit corresponding to write data having the logic null1null (or logic null0null), writing operation to bits corresponding to write data having the logic null1null (or logic null1) is successively performed.
Abstract:
The invention facilitates to meet both of the mode of use that finds precedence in frequent rewrite to the nonvolatile memory and data retention during the power supply being cut off, and the mode of use that finds precedence in the data retention characteristic. The controller enables an information storage operation to the nonvolatile memory cells, by means of erase and write processing through boosting of the voltage applied to the nonvolatile memory cells and clamping of the boosted voltage, and performs a selection control that selects the application interval of the boosted voltage applied during the information storage operation and so forth. This selection control enables utilizing the nonvolatile memory cells as temporary rewrite areas, and facilitates to meet both of the mode of use that finds precedence in data retention during the power supply being cut off, and the mode of use that finds precedence in the data retention characteristic.
Abstract:
The present invention is directed to simplify a circuit for fixing an output logic of a logic gate while suppressing a subthreshold current. A logic circuit has an n-channel type first transistor capable of interrupting power supply to a logic gate in accordance with an input control signal, and a p-channel type second transistor capable of fixing an output node of the logic gate to a high level interlockingly with the power supply interrupting operation by the first transistor, and a threshold of the first transistor is set to be higher than that of a transistor as a component of the logic gate. Means for interrupting the power supply to the logic gate is realized by the first transistor, and means for fixing an output node of the logic gate to the high level is realized by the second transistor, thereby simplifying the circuit for fixing the output logic of the logic gate while suppressing a subthreshold current.
Abstract:
A semiconductor integrated circuit having therein a plurality of memories, realizing an improved yield by efficiently repairing a defective bit in a memory. This semiconductor integrated circuit has: a plurality of circuit blocks (RAM macro cells) each having an identification code coincidence detecting circuit for determining whether an input identification code coincides with a self identification code or not and a reception data latch and performing an operation according to latched data; a setting circuit capable of setting the identification code and information corresponding to the identification code and serially outputting the set information; and a control circuit capable of sequentially reading the setting information from the setting circuit, converting the setting information to parallel data, and transferring the parallel data to the plurality of circuit blocks. Each of the plurality of circuit blocks captures and holds the setting information transferred when the identification code coincidence detecting circuit determines that the input identification code and the self identification code coincide with each other.
Abstract:
A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.
Abstract:
In a method of fabricating a semiconductor device having a MISFET of trench gate structure, a trench is formed from a major surface of a semiconductor layer of first conductivity type which serves as a drain region, in a depth direction of the direction of the semiconductor layer, a gate insulating film including a thermal oxide film and a deposited film is formed over the internal surface of the trench, and after a gate electrode has been formed in the trench, impurities are introduced into the semiconductor substrate of first conductivity type to form a semiconductor region of second conductivity type which serves as a channel forming region, and impurities are introduced into the semiconductor region of second conductivity type to form the semiconductor region of first conductivity type which serves as a source region.
Abstract:
A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a relationship of tc
Abstract:
There is provided an error rate select circuit activated in an information sustaining mode, wherein a plurality of pieces of data is read out from a memory circuit comprising dynamic memory cells and inspection bits for detection and correction of an error existing in the pieces of data are generated. The inspection bits are stored in an additional memory circuit. An ECC circuit reads out the pieces of data from the memory circuit and the inspection bits associated with the pieces of data from the additional memory circuit to detect and correct an error existing in the pieces of data at fixed refresh intervals. If no error is detected, a first detection signal is accumulated in a first direction, that is, the first detection signal is added to a sum. If an error is detected, on the other hand, a second detection signal is accumulated in a second direction, that is, the second direction signal is multiplied by a weight to give a product before subtracting the product from the sum wherein the weight is large enough to result in a value of the product greater than the first detection signal. If the sum increases in the first direction, exceeding a predetermined value, the refresh period is lengthened by a predetermined incremental time. If the sum decreases in the second direction, becoming smaller than another predetermined value, on the other hand, the refresh period is shortened by a predetermined decremental time.
Abstract:
In a semiconductor integrated circuit device that includes macro cells (circuit blocks that can be designed independently) such as a storage circuit and operates synchronously with an external clock, total delay time from signal input to output is reduced and the speed of operation is increased. In the semiconductor integrated circuit device which has plural circuit blocks coupled in series for signal transmission and whose whole operation is controlled by a clock signal, the semiconductor integrated circuit device including first circuit blocks that receive input signals in response to a first timing signal based on a clock signal, and a second circuit block that forms output signals in response to a second timing signal based on the clock signal, a time difference between the first timing signal and the second timing signal is set to a non-integral multiple of the cycle of the clock signal.