Abstract:
Heat sealing a connector assembly can be performed by providing connector assembly in component accessible state, overlaying sealing tape on electrical contacts and housing, sealing tape being impregnated with heat sensitive adhesive, the overlaying leaving the dimples exposed, and sealing the connector assembly by applying heat to heat sensitive sealing tape.
Abstract:
A display device (10) has a thin-film transistor (TFT) substrate ("layer" 14B). One or more holes (50A) in the TFT substrate act as ducts for conductive bridges (56) connecting display circuitry (53) on the TFT substrate to a printed cirucit (58) circuitry located underneath the substrate. The conductive bridges may be formed using wire bonding. The wire bonds may be encapsulated with potting material to improve their reliability and to increase the resiliency of the display. Display signal lines fed through the holes (50A) in the TFT substrate, run along the underside of the display (14) so that the amount of space required for display circuitry at the display edge is reduced. Alternatively, contact is achieved by depositing a conducting material in the hole, in conjunction with wire bonds and flexible circuits. Display types can include LCD, OLED, plasma, electronic ink, electrochromic, and electrowetting technologies.
Abstract:
Techniques are provided for removing thermal gradients from an organic light emitting diode (OLED) display (34). In one embodiment, an OLED display device (36) includes a thermally conductive layer (76) placed between electronic components housed within the device (18, 24, 26, 28) and the OLED display (34). Heat given off by the electronic components is transferred from warm to cold regions of the thermally conductive layer to create a more uniform ambient temperature across the back of the OLED display. Some embodiments indicate a position of the thermally conductive layer within layers of an OLED display stack (e.g., between a glass substrate and polyimide layer). Some embodiments include a specific range of thermal conductivities and/or thicknesses desired for the thermally conductive layer.
Abstract:
An electronic device having a housing structure that is configured to receive at least one glass cover is disclosed. The glass cover serves to cover a display assembly provided within the electronic device. The glass cover can be secured to the housing structure so as to facilitate providing a narrow border between an active display area and an outer edge of the housing structure. The enclosure for the electronic device can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
Abstract:
An electronic device having a housing structure that is configured to receive at least one glass cover is disclosed. The glass cover serves to cover a display assembly provided within the electronic device. The glass cover can be secured to the housing structure so as to facilitate providing a narrow border between an active display area and an outer edge of the housing structure. The enclosure for the electronic device can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.
Abstract:
Electronic devices may be provided that contain flexible displays and internal components. An internal component may be positioned under the flexible display. The internal component may be an output device such as a speaker that transmits sound through the flexible display or an actuator that deforms the display in a way that is sensed by a user. The internal component may also be a microphone or pressure sensor that receives sound or pressure information through the flexible display. Structural components may be used to permanently or temporarily deform the flexible display to provide tactile feedback to a user of the device. Electronic devices may be provided with concave displays or convex displays formed from one or more flexible layers including a flexible display layer. Portions of the flexible display may be used as speaker membranes for display-based speaker structures.
Abstract:
A modular material antenna assembly is provided that includes an antenna block having a portion with a shape that interlocks with a corresponding portion of an electrically non-conductive frame and secures the antenna block to the electrically non-conductive frame. The electrically non-conductive frame is attached to an interior of an electrically conductive housing so that the electrically non-conductive frame and the electrically conductive housing form an integrated structure. An antenna flex is then mechanically secured to the antenna block. The antenna flex may also be electrically connected to a circuit board. The frame is designed to support a cover glass for the portable electronic device and may be affixed to a housing. The dielectric constant of the antenna block is substantially less than the dielectric constant of the frame.
Abstract:
Handheld electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include antenna structures. An antenna may be located in an upper right corner of the handheld device as the handheld device is operated in a portrait mode. When the handheld device is rotated counterclockwise and operated in a landscape mode, the antenna is located in an unobstructed upper left corner of the device. The antenna may be formed from a strip of conductor. A proximal end of the strip of conductor may be connected to a transmission line. A distal end of the strip of conductor may be routed away from housing surfaces by bends formed in the strip. A printed circuit board in the handheld electronic device may have a hole. The distal end of the strip of conductor may be located adjacent to the hole.