Abstract:
PROBLEM TO BE SOLVED: To provide a means for achieving high-speed continuous production and reducing shrinkage in drying for improving quality and uniformity of the quality in a method for producing a polyolefin microporous film. SOLUTION: In a drying process after extraction of the polyolefin microporous film, drying is carried out while a film/sheet width is restricted mechanically. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for producing an electronic component, and more specifically, to provide a pressure-sensitive adhesive tape for production, in which pressure-sensitive adhesion is expressed only during a thermal lamination step, although a pressure-sensitive adhesive layer is not pressure-sensitive adhesive at room temperature, and consequently with which lamination on a lead frame is enabled, which has improved thermal resistance with regard to thermal history due to exposure of the pressure-sensitive adhesive tape during a production process of a semiconductor apparatus, owing to formation of a partial interpenetration reticular structure caused by additional photo-curing of the pressure-sensitive adhesive layer, which is useful for reliability improvement of a device during production of the semiconductor apparatus, and which can prevent leakage of an encapsulation material and can prevent a transfer of a pressure-sensitive adhesive to the lead frame or to the encapsulation material in removing the tape after completion of the process.SOLUTION: A pressure-sensitive adhesive tape for producing an electronic component includes a thermal-resistant substrate, a pressure-sensitive adhesive layer formed by applying a pressure-sensitive adhesive composition to the thermal-resistant substrate, the pressure-sensitive adhesive composition includes a phenoxy resin, a thermal curing agent, an energy ray-curable acrylic resin, and a photoinitiator, and the pressure-sensitive adhesive layer is cured by heat and an energy ray.
Abstract:
PROBLEM TO BE SOLVED: To provide a phenoxy resin composition for a transparent plastic substrate, which is excellent in heat resistance, chemical resistance and adhesivity, has low moisture permeability and linear thermal expansion coefficient, and can effectively be substituted for conventional glass substrates, by using a phenoxy resin as a polymer; and to provide a transparent plastic substrate material using the same.SOLUTION: The phenoxy resin composition for a transparent plastic substrate contains a phenoxy resin having a chemical structure of formula (1) wherein n is ≥35 and ≤400.
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive masking tape for a molded underfill process of die exposed flip-chip packages, which exhibits improved reliability and can prevent contamination.SOLUTION: The adhesive masking tape for a molded underfill process of die exposed flip-chip packages comprises a heat resistant substrate and an adhesive layer applied on the heat resistant substrate, wherein the heat resistant substrate is a PEN film and has a thickness of 25-50 μm.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a lens shape of a roll for optical film manufacturing, which can form a linear or nonlinear lens shape directly on the roll for optical film manufacturing, which can diversify a pattern of a lens, which can arbitrarily adjust curvature of the lens shape, and which can form the curvature deeper than a hemisphere, and to provide the roll for optical film manufacturing, in which the lens shape is formed by the method.SOLUTION: The method for manufacturing the lens shape of the roll for optical film manufacturing, includes a first step of forming a resin coated film on a cylindrical roll including a plating layer whose surface is plated with copper (Cu) or nickel (Ni); a second step of hitting a surface of the resin coated film of the cylindrical roll with a chisel to form a preliminary lens shape; a third step of performing etching on the cylindrical roll in which the preliminary lens shape is formed with etching liquid; and a fourth step of removing the resin coated film.