Pressure-sensitive adhesive tape for electronic part production
    8.
    发明专利
    Pressure-sensitive adhesive tape for electronic part production 有权
    用于电子零件生产的压敏胶带

    公开(公告)号:JP2013040276A

    公开(公告)日:2013-02-28

    申请号:JP2011178023

    申请日:2011-08-16

    Abstract: PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for electronic part production which enables detaping of the pressure-sensitive adhesive tape for electronic part production at normal temperature after a tight resin sealing process without an additional heating process, and satisfies any demand characteristics of a lamination processing condition, and can improve the limit of adhesive residues and sealing resin leakage of the pressure-sensitive adhesive tape used in a production process of an existing electronic part.SOLUTION: The pressure-sensitive adhesive tape for electronic part production includes a heat-resistant base material, and a pressure-sensitive adhesive layer obtained by applying a pressure-sensitive adhesive composition on the heat-resistant base material, wherein the pressure-sensitive adhesive composition contains a phenoxy resin, an acrylic resin, a heat curing agent, an energy ray-curable acrylic resin and a photoinitiator, and the pressure-sensitive adhesive layer is cured by heat curing and an energy ray.

    Abstract translation: 要解决的问题:提供一种用于电子部件生产的压敏粘合带,其能够在紧密的树脂密封过程之后在常温下脱离用于电子部件生产的压敏胶带而不需要额外的加热工艺,以及 满足层压处理条件的任何需求特性,并且可以改善在现有电子部件的生产过程中使用的压敏粘合带的粘合残留物的限制和密封树脂的泄漏。 解决方案:用于电子部件生产的压敏粘合带包括耐热基材和通过在耐热基材上施加压敏粘合剂组合物获得的压敏粘合剂层,其中压力 敏感性粘合剂组合物含有苯氧基树脂,丙烯酸树脂,热固化剂,能量射线固化性丙烯酸树脂和光引发剂,并且通过热固化和能量射线固化该粘合剂层。 版权所有(C)2013,JPO&INPIT

    Adhesive tape for manufacturing electronic component
    9.
    发明专利
    Adhesive tape for manufacturing electronic component 审中-公开
    胶带用于制造电子元件

    公开(公告)号:JP2012144727A

    公开(公告)日:2012-08-02

    申请号:JP2012004095

    申请日:2012-01-12

    Abstract: PROBLEM TO BE SOLVED: To provide an adhesive tape for manufacturing an electronic component, which satisfies conditions and characteristics required in a manufacturing process of a semiconductor device.SOLUTION: The adhesive tape for manufacturing an electronic component includes: an adhesive layer; and a non-adhesive layer, which is applied onto the adhesive. The adhesive layer and the non-adhesive layer are composed of compositions including a phenoxy resin, a thermal curing agent, an energy beam-curable acrylic resin and a photoinitiator, wherein the compositions of the adhesive layer and the non-adhesive layer are different in composition ratio.

    Abstract translation: 解决的问题:提供一种满足半导体器件的制造工艺中所需的条件和特性的电子部件的制造用胶带。 解决方案:用于制造电子部件的胶带包括:粘合剂层; 以及施加到粘合剂上的非粘合剂层。 粘合剂层和非粘合剂层由包括苯氧树脂,热固化剂,能量束固化丙烯酸树脂和光引发剂的组合物组成,其中粘合剂层和非粘合剂层的组成不同 组成比。 版权所有(C)2012,JPO&INPIT

    Optical polyester film
    10.
    发明专利
    Optical polyester film 有权
    光学聚酯膜

    公开(公告)号:JP2011231333A

    公开(公告)日:2011-11-17

    申请号:JP2011147272

    申请日:2011-07-01

    Abstract: PROBLEM TO BE SOLVED: To provide an optical polyester film which has excellent travellability and scratch resistance while holding high transparency, can be improved in the planarity of the film by improving drawability of the film, and is suitable for the field of displays.SOLUTION: The optical polyester film has a substrate layer composed of a biaxially oriented polyester, and an adhesive layer easily adhered at least on one surface of the substrate layer. The substrate layer contains fine particles having an average particle diameter of 0.03 to 0.50 μm, and the substrate layer further contains particles having an average particle diameter of 1.0 to 10.0 μm, so that a desired optical polyester film can be produced.

    Abstract translation: 解决的问题:为了提供具有优异的导电性和耐划伤性同时保持高透明度的光学聚酯膜,可以通过改善膜的可拉伸性来提高膜的平面性,并且适用于显示器领域 。 解决方案:光学聚酯膜具有由双轴取向聚酯构成的基材层,并且至少在基材层的一个表面上容易粘合的粘合剂层。 基材层含有平均粒径为0.03〜0.50μm的微粒,基材层还含有平均粒径为1.0〜10.0μm的粒子,能够制造所需的光学聚酯膜。 版权所有(C)2012,JPO&INPIT

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