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公开(公告)号：KR1020150059341A
公开(公告)日：2015-06-01
申请号：KR1020130142821
申请日：2013-11-22
Applicant: (주)파트론
IPC: G06K9/00
CPC classification number: G06K9/00013 , G01R27/2605 , G06K19/07724
Abstract: 지문인식센서모듈이개시된다. 본발명에따른지문인식센서모듈은상면과하면을구비하는제1 기판, 상기제1 기판의하면과결합되고, 중심부에개구부를구비하는지지부재및 상기제1 기판의하면중심부에결합되는돔키를포함한다.
Abstract translation: 公开了一种手指扫描传感器模块。 根据本发明的手指扫描传感器模块包括：具有上表面和下表面的第一基底; 支撑构件，其联接到所述第一基板的下表面并且在其中心具有开口部; 以及耦合到第一基板的下表面的中心的宿主键。
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公开(公告)号：KR1020140109586A
公开(公告)日：2014-09-16
申请号：KR1020130023677
申请日：2013-03-06
Applicant: (주)파트론
CPC classification number: G06K9/209 , G06K9/0002
Abstract: The present invention relates to a fingerprint recognition module comprising a support protrusion which makes a resin layer be formed in a thin and fixed thickness, and a manufacturing method thereof. According to the present invention, recognition rate of a sensor can be increased because deviation between products can be small while reducing the thickness between a sensor part and a fingerprint to be recognized. Also, because a production process is simple, process efficiency is high and also process yield can be increased. The fingerprint recognition module of the present invention includes a body including a lower part and an upper part combined with the lower part; a sensor part combined with the body; and a resin combined with the sensor part. The lower part comprises a mounting part where the sensor part is mounted, and the upper part comprises an aperture part where the mounting part is inserted. The mounting part is inserted into the aperture part. Thus a cavity surrounded by an inner surface of the aperture part and the mounting part is formed, and the sensor part is combined with the mounting part, and the resin is filled in the inside of the cavity.
Abstract translation: 本发明涉及一种指纹识别模块及其制造方法，该指纹识别模块包括使树脂层形成为薄而固定的厚度的支撑突起。 根据本发明，传感器的识别率可以增加，因为产品之间的偏差可以小，同时减小传感器部分和指纹之间的厚度以被识别。 另外，由于制造工序简单，工艺效率高，而且能够提高加工成品率。 本发明的指纹识别模块包括：主体，其包括下部和与下部结合的上部; 与身体结合的传感器部分; 和与传感器部件组合的树脂。 下部包括安装传感器部件的安装部，上部包括插入安装部的开口部。 安装部分插入开口部分。 因此，形成由开口部的内表面和安装部包围的空腔，将传感器部与安装部结合，将树脂填充到空腔的内部。
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公开(公告)号：KR1020140095691A
公开(公告)日：2014-08-04
申请号：KR1020130008354
申请日：2013-01-25
Applicant: (주)파트론
CPC classification number: G06K9/209 , G06K9/0002 , G06K9/00053
Abstract: The present invention relates to a fingerprint recognition module capable of maintaining strength while reducing the thickness of a body positioned between a fingerprint to be recognized and an input/output unit of a sensor unit, and a manufacturing method thereof. Since a distance between the input/output unit of the sensor unit and a surface with which a fingerprint is brought into contact is short, a recognition rate can be increased, manufacturing processes are simple, and a high level of strength is provided to guarantee reliability. The fingerprint recognition module comprises a body including an upper portion and a lower portion coupled to the upper portion; and a sensor unit coupled to the body between the upper portion and the lower portion, wherein the sensor unit includes an input/output unit inputting and outputting a fingerprint recognition signal, wherein the upper portion includes a contact portion having one surface in contact with one surface of the input/output unit and the other surface in contact with a fingerprint to be recognized, and a surface of the one surface of the contact portion is ground to be formed and the other surface of the contact portion has a coating layer formed on a surface thereof.
Abstract translation: 本发明涉及一种指纹识别模块及其制造方法，所述指纹识别模块能够在减小位于要识别的指纹和传感器单元的输入/输出单元之间的身体的厚度的同时保持强度。 由于传感器单元的输入/输出单元与指纹接触的表面之间的距离短，因此可以提高识别率，制造过程简单，并提供高水平的强度以确保可靠性 。 所述指纹识别模块包括主体，所述主体包括联接到所述上部的上部和下部; 以及传感器单元，其在所述上部和下部之间联接到所述主体，其中所述传感器单元包括输入和输出指纹识别信号的输入/输出单元，其中所述上部包括具有与一个表面接触的一个表面的接触部分 输入/输出单元的表面和与要被识别的指纹接触的另一表面，并且接触部分的一个表面的表面被研磨以形成，并且接触部分的另一个表面具有形成在 其表面。
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公开(公告)号：KR1020160126725A
公开(公告)日：2016-11-02
申请号：KR1020150058168
申请日：2015-04-24
Applicant: (주)파트론
IPC: H01L23/28 , H01L23/495 , H01L23/488
CPC classification number: H01L2224/73204
Abstract: 반도체패키지및 그제조방법이개시된다.본발명의반도체패키지및 그제조방법은상면중 일부는이후의단계에서상부에반도체칩이위치하게되는실장영역이고, 상기실장영역에적어도하나의전극패드가형성된회로기판을준비하는단계, 상기실장영역의주변부를포함하는영역에마스킹테이프를부착하는단계, 상기전극패드와대응하는부분에솔더볼이형성된반도체칩을상기실장영역에실장하는단계, 상기반도체칩과상기실장영역사이에언더필재를형성하는단계및 상기실장영역의주변부에부착된마스킹테이프및 그상면에결합된언더필재를제거하는단계를포함한다.
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Patent Agency Ranking
公开(公告)号：KR1020160055592A
公开(公告)日：2016-05-18
申请号：KR1020140155592
申请日：2014-11-10
Applicant: (주)파트론
IPC: G06K9/00 , H01L23/498
CPC classification number: H01L2224/14 , H01L2224/16225 , H01L2924/18161 , H01L2924/3511 , G06K9/0002 , H01L23/49816
Abstract: 지문인식센서패키지가개시된다. 본발명의지문인식센서패키지는베이스기판, 상기베이스기판의상면에결합되는지문인식센서칩 및상기베이스기판의상면에형성되어상기지문인식센서칩의주변을밀봉하되, 상기지문인식센서칩의상면은외부로노출되도록형성되는몰딩부를포함한다.
Abstract translation: 公开了一种指纹识别传感器封装，包括：基底; 指纹识别传感器芯片，其耦合到所述基底基板的上表面; 以及模制单元，形成在所述基底基板的上表面上，以密封所述指纹识别传感器芯片的周围区域并且被配置为将所述指纹识别传感器芯片的上表面暴露于外部。 本发明的目的是提供安装在电子设备上的指纹识别传感器封装，以能够识别要感测的指纹图案。
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公开(公告)号：KR1020140109584A
公开(公告)日：2014-09-16
申请号：KR1020130023674
申请日：2013-03-06
Applicant: (주)파트론
CPC classification number: G06K9/209 , G06K9/0002
Abstract: The present invention relates to a fingerprint recognition module comprising a support protrusion capable of determining thickness of a resin layer of the present invention and a manufacturing method thereof. According to the present invention, a manufacturing process is simple and yield can be increased while increasing the recognition rate because a distance between a sensor part and a surface contacting with a fingerprint to be recognized is short. The fingerprint recognition module of the present invention includes a body including a lower part and an upper part combined with the lower part; a sensor part combined with the body; and a resin layer combined with the sensor part. The lower part comprises a mounting part where the sensor part is mounted, and the upper part comprises an aperture part where the mounting part is inserted. A top surface of the upper part is polished, and the sensor part is combined with one plane of the mounting part and has at least one support protrusion on the surface. An end part of the support protrusion is formed to reach the surface of the resin layer, and a top surface of the resin layer is formed on the same plane as the top surface of the upper part.
Abstract translation: 本发明涉及一种指纹识别模块，其包括能够确定本发明的树脂层的厚度的支撑突起及其制造方法。 根据本发明，由于传感器部分和与要识别的指纹接触的表面之间的距离短，所以制造过程简单并且可以增加识别率，从而提高产量。 本发明的指纹识别模块包括：主体，其包括下部和与下部结合的上部; 与身体结合的传感器部分; 以及与传感器部件组合的树脂层。 下部包括安装传感器部分的安装部分，并且上部包括插入安装部分的孔部分。 上部的上表面被抛光，并且传感器部分与安装部分的一个平面组合，并且在表面上具有至少一个支撑凸起。 支撑突起的端部形成为到达树脂层的表面，并且树脂层的顶表面形成在与上部的顶表面相同的平面上。
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公开(公告)号：KR101783711B1
公开(公告)日：2017-10-10
申请号：KR1020150058168
申请日：2015-04-24
Applicant: (주)파트론
IPC: H01L23/28 , H01L23/495 , H01L23/488
CPC classification number: H01L2224/73204
Abstract: 반도체패키지및 그제조방법이개시된다.본발명의반도체패키지및 그제조방법은상면중 일부는이후의단계에서상부에반도체칩이위치하게되는실장영역이고, 상기실장영역에적어도하나의전극패드가형성된회로기판을준비하는단계, 상기실장영역의주변부를포함하는영역에마스킹테이프를부착하는단계, 상기전극패드와대응하는부분에솔더볼이형성된반도체칩을상기실장영역에실장하는단계, 상기반도체칩과상기실장영역사이에언더필재를형성하는단계및 상기실장영역의주변부에부착된마스킹테이프및 그상면에결합된언더필재를제거하는단계를포함한다.
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