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公开(公告)号：CN102131883A
公开(公告)日：2011-07-20
申请号：CN200980132765.8
申请日：2009-07-30
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J7/02 , C09J7/00 , C09J11/06 , C09J163/00 , C09J179/08 , G03F7/004 , G03F7/037 , H01L21/52 , C09J4/00
CPC classification number: C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/20 , C09J7/22 , C09J7/38 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/00 , C09J2479/08 , G03F7/0387 , G03F7/0388 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05554 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/351 , Y10T428/24479 , Y10T428/2809 , Y10T428/31504 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种感光性粘接剂组合物，在图形形成后，在20℃～200℃下的最低熔融温度为30000Pa·s以下。
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公开(公告)号：CN101681104A
公开(公告)日：2010-03-24
申请号：CN200880018517.6
申请日：2008-04-30
Applicant: 日立化成工业株式会社
IPC: G03F7/027 , C08G73/10 , C09J4/02 , C09J7/02 , C09J163/00 , C09J179/08 , G03F7/004 , G03F7/037 , H01L21/027
CPC classification number: C09J4/06 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/38 , C09J179/08 , C09J2201/28 , C09J2203/326 , C09J2463/00 , C09J2475/00 , C09J2479/00 , G03F7/027 , G03F7/037 , G03F7/038 , H01L24/31 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83194 , H01L2225/0651 , H01L2225/06568 , H01L2225/06596 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 一种感光性粘结剂树脂组合物，含有(A)碱溶性聚合物、(B)热固性树脂、(C)一种或多种放射线聚合性化合物、(D)光引发剂，组合物中的全部放射线聚合性化合物的混合物的5％重量减少温度为200℃以上。
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公开(公告)号：CN101646741A
公开(公告)日：2010-02-10
申请号：CN200880010718.1
申请日：2008-03-19
Applicant: 日立化成工业株式会社
IPC: C09J179/08 , C08L63/00 , C09J4/00 , C09J7/02 , C09J11/06 , C09J163/00 , H01L21/301 , H01L21/52
CPC classification number: G03G15/0812 , G03G2215/0866
Abstract: 本发明的感光性粘接剂组合物，其含有(A)碱可溶性树脂、(B)环氧树脂、(C)放射线聚合性化合物和(D)光引发剂，其中，(D)光引发剂至少含有(D1)通过放射线照射而表现出促进环氧树脂的聚合和/或固化反应的功能的光引发剂。
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公开(公告)号：CN102576681A
公开(公告)日：2012-07-11
申请号：CN201080045628.3
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301
CPC classification number: H01L23/293 , C09J4/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明的半导体用粘接剂组合物，其特征在于含有(A)放射线聚合性化合物、(B)光引发剂和(C)热固性树脂，其中(A)成分含有在25℃下为液状并且分子内具有1个碳碳双键的化合物。
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公开(公告)号：CN101868852A
公开(公告)日：2010-10-20
申请号：CN200880117162.6
申请日：2008-12-02
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种半导体装置(1)的制造方法，其具备：在具有连接端子的基板(3)上设置感光性胶粘剂(绝缘树脂层(7))的第一工序；通过曝光及显影使感光性胶粘剂形成图案，以形成连接端子露出的开口(13)的第二工序；向开口(13)填充导电材料来形成导电层(9)的第三工序；将具有连接用电极部的半导体芯片(5)直接胶粘于感光性胶粘剂，并且通过导电层(9)将基板(3)的连接端子与半导体芯片(5)的连接用电极部电连接的第四工序。
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Patent Agency Ranking
公开(公告)号：CN101809107A
公开(公告)日：2010-08-18
申请号：CN200880109746.9
申请日：2008-10-02
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , B23K35/363 , C09J9/02 , C09J11/06 , H01B1/22 , H01L21/60 , H05K3/32
CPC classification number: H01L24/16 , B22F1/0059 , B22F2001/0066 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/264 , B23K35/302 , B23K35/3613 , B23K35/3618 , B23K35/362 , B23K35/365 , C08K3/017 , C08K3/08 , C09J9/02 , C09J11/04 , H01B1/22 , H01L24/12 , H01L2224/05568 , H01L2224/13099 , H01L2224/1329 , H01L2224/13347 , H01L2224/13439 , H01L2224/16 , H01L2224/16225 , H01L2224/16265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/15747 , H01L2924/19043 , H01L2924/20107 , H05K1/141 , H05K3/321 , H05K2201/0272 , H05K2203/0425 , Y10T428/31511 , Y10T428/31678 , H01L2924/00 , H01L2224/05599
Abstract: 本发明提供一种粘接剂组合物，其既维持保存稳定性，又以固化物在该部件之间良好地浸润而摊开的状态形成金属键，且粘接性、导电性和耐TCT性或者耐高温放置性等安装可靠性优良。另外，本发明的目的还在于提供具有良好的可靠性的搭载有电子部件的基板或者半导体装置。本发明的特征在于，其是含有导电粒子(A)和粘合剂成分(B)的粘接剂组合物，上述导电粒子(A)含有熔点在回流焊温度以上且不含铅的金属(a1)以及熔点小于回流焊温度且不含铅的金属(a2)，上述粘合剂成分(B)含有热固化性树脂组合物(b1)和脂肪族二羟基羧酸(b2)。
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公开(公告)号：CN101218539A
公开(公告)日：2008-07-09
申请号：CN200680024508.9
申请日：2006-06-30
Applicant: 日立化成工业株式会社
IPC: G03F7/037 , C09J179/08 , C09J7/00 , G03F7/004
CPC classification number: H01L23/488 , C09J179/08 , G03F7/037 , H01L21/2007 , H01L21/76251 , H01L21/78 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , Y10T156/1002 , Y10T428/24479 , Y10T428/24802 , H01L2924/00014
Abstract: 本发明关于一种感光性粘接剂组合物，其含有(A)具有羧基作为侧链、酸值为80～180mg/KOH的聚酰亚胺、(B)放射线聚合性化合物、及(C)光聚合引发剂。
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公开(公告)号：CN103257527A
公开(公告)日：2013-08-21
申请号：CN201310088478.X
申请日：2009-07-30
Applicant: 日立化成工业株式会社
CPC classification number: C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/20 , C09J7/22 , C09J7/38 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/00 , C09J2479/08 , G03F7/0387 , G03F7/0388 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05554 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/351 , Y10T428/24479 , Y10T428/2809 , Y10T428/31504 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明涉及一种感光性粘接剂组合物，其含有（A）热塑性树脂、（B）热固性树脂、（C）放射线聚合性化合物和（D）光引发剂，所述（C）放射线聚合性化合物包含具有乙烯性不饱和基团和环氧基的化合物。
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公开(公告)号：CN103021881A
公开(公告)日：2013-04-03
申请号：CN201210369627.5
申请日：2008-12-02
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种半导体装置(1)的制造方法，其具备：在具有连接端子的基板(3)上设置感光性胶粘剂(绝缘树脂层(7))的第一工序；通过曝光及显影使感光性胶粘剂形成图案，以形成连接端子露出的开口(13)的第二工序；向开口(13)填充导电材料来形成导电层(9)的第三工序；将具有连接用电极部的半导体芯片(5)直接胶粘于感光性胶粘剂，并且通过导电层(9)将基板(3)的连接端子与半导体芯片(5)的连接用电极部电连接的第四工序。
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公开(公告)号：CN101910350B
公开(公告)日：2013-01-16
申请号：CN200980101712.X
申请日：2009-01-09
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J4/02 , C09J7/00 , C09J7/02 , C09J11/06 , C09J163/00 , C09J179/08 , C09J201/06 , H01L21/02 , H01L21/52
CPC classification number: C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种感光性粘接剂组合物，其含有(A)具有羧基和/或羟基的树脂、(B)热固性树脂、(C)放射线聚合性化合物、和(D)光引发剂，组合物中的所有光引发剂混合物的3％重量减少温度为200℃以上。
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