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公开(公告)号：CN102687257A
公开(公告)日：2012-09-19
申请号：CN201080050769.4
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301
CPC classification number: H01L24/27 , C08F220/30 , H01L21/565 , H01L21/67132 , H01L21/6836 , H01L23/3128 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/27002 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83201 , H01L2224/83855 , H01L2224/83856 , H01L2224/92247 , H01L2224/93 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , Y10T428/2809 , Y10T428/31935 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/27 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种半导体装置的制造方法，其包括：使粘接剂组合物在半导体晶片的与电路面相反侧的面上成膜而形成粘接剂层的工序；通过光照射对粘接剂层进行B阶化的工序；将半导体晶片与经B阶化的所述粘接剂层一起切断而切成多个半导体芯片的工序；以及对于半导体芯片和支撑构件或其它半导体芯片，在它们之间夹着粘接剂层的状态下进行压接，从而进行粘接的工序。
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公开(公告)号：CN102160163A
公开(公告)日：2011-08-17
申请号：CN200980137097.8
申请日：2009-06-25
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , C09J4/00 , C09J7/00 , C09J11/06 , C09J163/00 , C09J179/04 , C09J201/00
CPC classification number: C08G73/1082 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J163/00 , C09J179/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L27/14618 , H01L27/14625 , H01L27/14806 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明目的在于提供一种耐热性优异的半导体装置。提供一种半导体装置，其为半导体元件和被粘物经由图形化的薄膜状感光性粘接剂被热压接而成的半导体装置，图形化的薄膜状感光性粘接剂在即将热压接前的水分量为1.0重量％以下。
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公开(公告)号：CN101910350A
公开(公告)日：2010-12-08
申请号：CN200980101712.X
申请日：2009-01-09
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J4/02 , C09J7/00 , C09J7/02 , C09J11/06 , C09J163/00 , C09J179/08 , C09J201/06 , H01L21/02 , H01L21/52
CPC classification number: C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种感光性粘接剂组合物，其含有(A)具有羧基和/或羟基的树脂、(B)热固性树脂、(C)放射线聚合性化合物、和(D)光引发剂，组合物中的所有光引发剂混合物的3％重量减少温度为200℃以上。
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公开(公告)号：CN102915932A
公开(公告)日：2013-02-06
申请号：CN201210280867.8
申请日：2008-12-02
Applicant: 日立化成工业株式会社
IPC: H01L21/58 , H01L21/683 , C09J4/06 , G03F7/027
CPC classification number: C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: 本发明涉及半导体装置的制造方法以及半导体装置，所述半导体装置的制造方法具备：通过曝光及显影将设置于半导体芯片的电路面上的感光性粘接剂形成图案的工序、和将其他的半导体芯片与形成图案后的所述感光性粘接剂直接粘接的工序，所述感光性粘接剂通过曝光及显影而形成图案后对于被粘接物具有粘接性。
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公开(公告)号：CN101868852B
公开(公告)日：2012-11-21
申请号：CN200880117162.6
申请日：2008-12-02
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种半导体装置(1)的制造方法，其具备：在具有连接端子的基板(3)上设置感光性胶粘剂(绝缘树脂层(7))的第一工序；通过曝光及显影使感光性胶粘剂形成图案，以形成连接端子露出的开口(13)的第二工序；向开口(13)填充导电材料来形成导电层(9)的第三工序；将具有连接用电极部的半导体芯片(5)直接胶粘于感光性胶粘剂，并且通过导电层(9)将基板(3)的连接端子与半导体芯片(5)的连接用电极部电连接的第四工序。
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Patent Agency Ranking
公开(公告)号：CN102598234A
公开(公告)日：2012-07-18
申请号：CN201080050649.4
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301
CPC classification number: H01L23/3128 , C08F220/32 , C08F222/1006 , C09J4/06 , H01L21/565 , H01L21/67115 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48221 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/92 , H01L2224/92247 , H01L2224/94 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/0665 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/03 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种粘接剂组合物，其含有放射线聚合性化合物、光引发剂和热固性树脂，并用于粘接半导体芯片。在通过光照射对形成了粘接剂层的粘接剂组合物进行B阶化时，粘接剂层表面的粘力在30℃时为200gf/cm2以下，在120℃时为200gf/cm2以上。
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公开(公告)号：CN102471664A
公开(公告)日：2012-05-23
申请号：CN201080029241.9
申请日：2010-06-28
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J4/00 , C09J7/00 , C09J7/02 , C09J11/06 , C09J163/00 , C09J179/08 , G03F7/004 , G03F7/037 , H01L21/52
CPC classification number: C09J4/00 , C08G73/1039 , C09J7/22 , C09J7/35 , C09J163/00 , C09J179/08 , C09J2201/28 , C09J2203/326 , C09J2463/00 , C09J2479/08 , G03F7/0046 , G03F7/037 , G03F7/40 , H01L2224/05554 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , Y10T428/24802 , Y10T428/2809 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: 本发明提供一种在粘附性、图形形成性、热压接性和高温粘接性的所有方面都十分优异，并且在通过曝光和显影而图形化后具有对被粘接物的热压接性，以及能够碱显影的感光性粘接剂，和使用该感光性粘接剂的膜状粘接剂、粘接片、粘接剂图形、带有粘接剂层的半导体晶片以及半导体装置。一种感光性粘接剂，其含有(A)具有氟代烷基的含有酰亚胺基的树脂、(B)放射线聚合性化合物、(C)光引发剂和(D)热固性成分。
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公开(公告)号：CN102131883A
公开(公告)日：2011-07-20
申请号：CN200980132765.8
申请日：2009-07-30
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J7/02 , C09J7/00 , C09J11/06 , C09J163/00 , C09J179/08 , G03F7/004 , G03F7/037 , H01L21/52 , C09J4/00
CPC classification number: C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/20 , C09J7/22 , C09J7/38 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/00 , C09J2479/08 , G03F7/0387 , G03F7/0388 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05554 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/351 , Y10T428/24479 , Y10T428/2809 , Y10T428/31504 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种感光性粘接剂组合物，在图形形成后，在20℃～200℃下的最低熔融温度为30000Pa·s以下。
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公开(公告)号：CN101681104A
公开(公告)日：2010-03-24
申请号：CN200880018517.6
申请日：2008-04-30
Applicant: 日立化成工业株式会社
IPC: G03F7/027 , C08G73/10 , C09J4/02 , C09J7/02 , C09J163/00 , C09J179/08 , G03F7/004 , G03F7/037 , H01L21/027
CPC classification number: C09J4/06 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/10 , C09J7/22 , C09J7/38 , C09J179/08 , C09J2201/28 , C09J2203/326 , C09J2463/00 , C09J2475/00 , C09J2479/00 , G03F7/027 , G03F7/037 , G03F7/038 , H01L24/31 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/27436 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/83194 , H01L2225/0651 , H01L2225/06568 , H01L2225/06596 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/351 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 一种感光性粘结剂树脂组合物，含有(A)碱溶性聚合物、(B)热固性树脂、(C)一种或多种放射线聚合性化合物、(D)光引发剂，组合物中的全部放射线聚合性化合物的混合物的5％重量减少温度为200℃以上。
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公开(公告)号：CN101646741A
公开(公告)日：2010-02-10
申请号：CN200880010718.1
申请日：2008-03-19
Applicant: 日立化成工业株式会社
IPC: C09J179/08 , C08L63/00 , C09J4/00 , C09J7/02 , C09J11/06 , C09J163/00 , H01L21/301 , H01L21/52
CPC classification number: G03G15/0812 , G03G2215/0866
Abstract: 本发明的感光性粘接剂组合物，其含有(A)碱可溶性树脂、(B)环氧树脂、(C)放射线聚合性化合物和(D)光引发剂，其中，(D)光引发剂至少含有(D1)通过放射线照射而表现出促进环氧树脂的聚合和/或固化反应的功能的光引发剂。
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