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公开(公告)号：CN102576681A
公开(公告)日：2012-07-11
申请号：CN201080045628.3
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , C09J4/02 , H01L21/301
CPC classification number: H01L23/293 , C09J4/00 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01067 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明的半导体用粘接剂组合物，其特征在于含有(A)放射线聚合性化合物、(B)光引发剂和(C)热固性树脂，其中(A)成分含有在25℃下为液状并且分子内具有1个碳碳双键的化合物。
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公开(公告)号：CN101868852A
公开(公告)日：2010-10-20
申请号：CN200880117162.6
申请日：2008-12-02
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种半导体装置(1)的制造方法，其具备：在具有连接端子的基板(3)上设置感光性胶粘剂(绝缘树脂层(7))的第一工序；通过曝光及显影使感光性胶粘剂形成图案，以形成连接端子露出的开口(13)的第二工序；向开口(13)填充导电材料来形成导电层(9)的第三工序；将具有连接用电极部的半导体芯片(5)直接胶粘于感光性胶粘剂，并且通过导电层(9)将基板(3)的连接端子与半导体芯片(5)的连接用电极部电连接的第四工序。
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公开(公告)号：CN103257527A
公开(公告)日：2013-08-21
申请号：CN201310088478.X
申请日：2009-07-30
Applicant: 日立化成工业株式会社
CPC classification number: C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/22 , C09J7/20 , C09J7/22 , C09J7/38 , C09J9/00 , C09J163/00 , C09J179/08 , C09J2203/326 , C09J2205/31 , C09J2433/00 , C09J2463/00 , C09J2479/00 , C09J2479/08 , G03F7/0387 , G03F7/0388 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/05554 , H01L2224/274 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/15311 , H01L2924/15788 , H01L2924/16235 , H01L2924/181 , H01L2924/351 , Y10T428/24479 , Y10T428/2809 , Y10T428/31504 , H01L2924/07025 , H01L2924/0635 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明涉及一种感光性粘接剂组合物，其含有（A）热塑性树脂、（B）热固性树脂、（C）放射线聚合性化合物和（D）光引发剂，所述（C）放射线聚合性化合物包含具有乙烯性不饱和基团和环氧基的化合物。
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公开(公告)号：CN103021881A
公开(公告)日：2013-04-03
申请号：CN201210369627.5
申请日：2008-12-02
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/27 , C08G18/8116 , C09J175/16 , C09J179/08 , G03F7/037 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0554 , H01L2224/05573 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/16225 , H01L2224/29076 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/94 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/351 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 一种半导体装置(1)的制造方法，其具备：在具有连接端子的基板(3)上设置感光性胶粘剂(绝缘树脂层(7))的第一工序；通过曝光及显影使感光性胶粘剂形成图案，以形成连接端子露出的开口(13)的第二工序；向开口(13)填充导电材料来形成导电层(9)的第三工序；将具有连接用电极部的半导体芯片(5)直接胶粘于感光性胶粘剂，并且通过导电层(9)将基板(3)的连接端子与半导体芯片(5)的连接用电极部电连接的第四工序。
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Patent Agency Ranking
公开(公告)号：CN101910350B
公开(公告)日：2013-01-16
申请号：CN200980101712.X
申请日：2009-01-09
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J4/02 , C09J7/00 , C09J7/02 , C09J11/06 , C09J163/00 , C09J179/08 , C09J201/06 , H01L21/02 , H01L21/52
CPC classification number: C09J179/08 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08K5/0025 , C08K5/3417 , C08L79/08 , C08L2312/06 , C09J7/20 , C09J163/00 , C09J2203/326 , C09J2205/102 , C09J2463/00 , C09J2479/08 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24612 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 一种感光性粘接剂组合物，其含有(A)具有羧基和/或羟基的树脂、(B)热固性树脂、(C)放射线聚合性化合物、和(D)光引发剂，组合物中的所有光引发剂混合物的3％重量减少温度为200℃以上。
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公开(公告)号：CN102687256A
公开(公告)日：2012-09-19
申请号：CN201080050375.9
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52 , H01L25/065 , H01L25/07 , H01L25/18
CPC classification number: H01L24/27 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H01L2924/3025 , Y10T428/2809 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
Abstract: 本发明的膜状粘接剂的制造方法，其特征在于，在基材上涂布溶剂的含量为5质量%以下且在25℃下为液状的粘接剂组合物而形成粘接剂组合物层，对该粘接剂组合物层进行光照射而形成膜状粘接剂，所述粘接剂组合物含有（A）放射线聚合性化合物、（B）光引发剂和（C）热固性树脂。
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公开(公告)号：CN102598233A
公开(公告)日：2012-07-18
申请号：CN201080050152.2
申请日：2010-11-10
Applicant: 日立化成工业株式会社
IPC: H01L21/52
CPC classification number: H01L24/27 , C08G73/10 , C09J179/08 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/274 , H01L2224/27416 , H01L2224/27418 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/92247 , H01L2225/0651 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01084 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明的液状半导体用粘接剂组合物，其特征在于含有（A）放射线聚合性化合物、（B）光引发剂，以及（C）热固性树脂，并且其中（B）成分含有（B1）对波长为365nm的光的分子吸光系数为100ml/g·cm以上的化合物。
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公开(公告)号：CN102131882A
公开(公告)日：2011-07-20
申请号：CN200980132606.8
申请日：2009-08-26
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J4/02 , C09J7/00 , C09J7/02 , C09J163/00 , C09J179/08 , C09J201/06 , H01L21/52
CPC classification number: C09J4/00 , C08G73/1042 , C08G73/1046 , C08G73/106 , C08G73/1082 , C08L63/00 , C08L79/08 , C08L2666/02 , C08L2666/20 , C08L2666/22 , C09J4/06 , C09J163/00 , C09J179/08 , G03F7/038 , G03F7/70383 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/50 , H01L2224/16 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83856 , H01L2224/92247 , H01L2225/06513 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/10253 , H01L2924/12041 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , Y10T428/24355 , Y10T428/287 , Y10T428/31518 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 本发明涉及可以通过在被粘接物上形成粘接剂层并利用放射线施加曝光处理及利用显影液施加显影处理而形成粘接剂图案的感光性粘接剂组合物，上述感光性粘接剂组合物具有溶解显影性，并且显影后形成的上述粘接剂图案的膜厚T1(μm)满足下述式(1)所示的条件。(T1/T0)×100≥90...(1)[式(1)中，T0表示显影处理前的粘接剂层的膜厚(μm)。]。
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公开(公告)号：CN101884104A
公开(公告)日：2010-11-10
申请号：CN200880119113.6
申请日：2008-12-02
Applicant: 日立化成工业株式会社
IPC: H01L25/065 , C09J4/00 , C09J179/08 , H01L21/52 , H01L25/07 , H01L25/18
CPC classification number: C09J4/00 , C08G65/3322 , C08G65/33306 , C08G2650/50 , C08L71/02 , C08L79/08 , C08L2666/20 , C08L2666/22 , C09J171/02 , C09J179/08 , H01L21/6836 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2221/68327 , H01L2224/05554 , H01L2224/274 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83855 , H01L2224/85 , H01L2224/92247 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
Abstract: 本发明的感光性粘接剂，其是通过曝光及显影来形成图案后对于被粘接物具有粘接性、可以碱显影的感光性粘接剂，用于具有以下工序的半导体装置100的制造方法，所述工序是：通过曝光及显影将设置于半导体芯片20的电路面上的感光性粘接剂1形成图案的工序，和将其他的半导体芯片21与形成图案后的所述感光性粘接剂1直接粘接的工序。
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