Abstract:
A process for producing an aqueous dispersion which contains a conductive polymer ingredient and is capable of forming a thin conductive film excellent in transparency and conductivity; and an aqueous dispersion obtained by the process. The process comprises a step in which a 3,4-dialkoxythiophene is polymerized in an aqueous medium in the presence of a polyanion with the aid of an oxidizing agent. In this step, the oxidizing agent is added by dropping a solution or dispersion of the oxidizing agent into the reaction mixture. Alternatively, the concentration of alkali metal ions in the reaction mixture in the polymerization step is kept at 400 ppm or lower.
Abstract:
본 발명은 특정한 비스페놀플루오렌 구조를 갖는 에폭시 화합물과 지환식 또는 방향족 단염기성 카복실산으로부터 형성된 에폭시에스테르 화합물에 1종 이상의 다염기성 카복실산 또는 이의 무수물을 반응시킴으로써 수득되는 알칼리 가용성 수지에 관한 것이며, 당해 알칼리 가용성 수지는 내열성, 감도, 현상성이 우수하며 막 잔류율이 우수한 동시에 내약품성, 기판과의 밀착성 및 가시광선 영역에서의 투명성이 우수한 내식막을 형성할 수 있는 감방사선성 수지 조성물의 주성분이 된다. 에폭시 화합물, 지환식 또는 방향족 단염기성 카복실산, 에폭시에스테르 화합물, 감방사선성 수지 조성물, 알칼리 가용성
Abstract:
A liquid repelling resin composition, and a molded product using the composition are provided to show an excellent water repellency stably without the dependency on the film making condition. A liquid repelling resin composition comprises an epoxy ester compound represented by the formula 1 as a condensed ring structure-containing an alkali-soluble resin; a condensed ring structure-containing an alkali-soluble resin obtained by reacting a polybasic carboxylic acid or its anhydride; and a fluorine-containing polyether compound, wherein D1~4 are independently a group selected from the groups represented by the formula 2 or 3; and p1~4 are independently an integer of 0-4.
Abstract:
A conductive resin composition which contains a composite of a poly(3,4-dialkoxythiophene) and a polyanion, wherein the composite has a conductivity of 0.30 S/cm or higher. This composition is suitable for use in producing a conductive film comprising a conductive layer made of the composition. The conductive film is suitable for use in a resistive-film switch.
Abstract:
본 발명에 의해 퀴논디아지드설폰산 에스테르 그룹을 갖는 에스테르형 플루오렌 화합물, 당해 화합물을 함유하는 감광제 및 당해 감광제를 함유하는 감방사선성 수지 조성물이 제공된다. 이러한 조성물은 반도체 집적 회로 또는 LCD용 TFT 회로 제조용의 내식막 재료 또는 층간 절연막, 보호막 등의 영구막 형성재료로서 유용하다. 에스테르형 플루오렌 화합물, 감광제, 알칼리 가용성 수지, 가교제, 감방사선성 수지 조성물, 내열성, 투명성, 내약품성, 저장안정성.
Abstract:
An alkali-soluble resin is provided, which can be advantageously used in a radiosensitive resin composition useful for an anticorrosive layer, an insulating layer or protecting layer of LCD and the like, owing to its improved sensitivity, insoluble fraction, developing properties, resolution, heat resistance, heat-induced discoloration properties, chemical resistance, transparency within the range of visible light, sealing property to various substrates, and stability during storage. The alkali-soluble resin is produced by reacting (a1) an epoxy ester compound represented by formula 1 and (a2) a polyhydric alcohol, and (a3) a polybasic carboxylic acid or anhydride thereof, wherein R is independently a hydrogen, a linear or branched alkyl group having C1-5, a phenyl group or a halogen atom, and R1 is independently parts derived from a monobasic carboxylic acid, wherein the molar ratio of hydroxyl groups of (a1) to hydroxyl groups of (a2) is 99/1-50/50.
Abstract:
PURPOSE: A fluorene-containing epoxy resin, its preparation method, an epoxy resin composition containing the epoxy resin, a fluorene-containing epoxy acrylate resin, its preparation method, a thermosetting composition and a radiation sensitive resin composition containing the epoxy acrylate resin, a fluorene-containing alkali-soluble radiation polymerizable unsaturated resin, its preparation method, a radiation sensitive resin composition containing the unsaturated resin, and a molded product obtained from the compositions are provided, to improve the hardness of a cured material, heat resistance, electric characteristics and patterning property and to reduce contraction rate in curing. CONSTITUTION: The fluorene-containing epoxy resin is represented by the formula 1, wherein R1's are independently H or CH3; n's are independently an integer of 0-10; and m's are independently an integer of 2-5. The fluorene-containing epoxy acrylate resin is represented by the formula 3, wherein R1 and R2 are independently H or CH3; n's are independently an integer of 0-10; and m's are independently an integer of 2-5. The fluorene-containing alkali-soluble radiation polymerizable unsaturated resin is prepared by reacting the fluorene-containing epoxy acrylate resin of the formula 3 with a polybasic carboxylic acid or its anhydride.