公开(公告)号：KR100728752B1

公开(公告)日：2007-06-19

申请号：KR1020060038737

申请日：2006-04-28

Applicant: 삼성전기주식회사

Inventor： 현정호 ,  오흥재

IPC: H05K3/40 ,  H05K3/34

Abstract: A method and an apparatus for manufacturing a printed circuit board are provided to prevent damage of a circuit pattern when separating a mask from the board by improving a cohesive power of the circuit pattern printed on the board. A method for manufacturing a printed circuit board includes the steps of: compressing air by using an air compressor; filtering the compressed air by passing the compressed air through a filter; expanding the compressed air; printing a circuit pattern on the board; cooling the board by providing the expanded air to the board to correspond to the printing; and repeating one of the compressing step and the expanding step so that a temperature of the compressed air is within a predetermined temperature range by detecting the temperature of the compressed air.

Abstract translation: 提供一种用于制造印刷电路板的方法和装置，以通过改进印刷在电路板上的电路图案的内聚力来防止当从电路板分离掩模时损坏电路图案。 一种制造印刷电路板的方法包括以下步骤：通过使用空气压缩机压缩空气; 通过使压缩空气通过过滤器来过滤压缩空气; 扩大压缩空气; 在电路板上印刷电路图案; 通过向板提供膨胀的空气来冷却板以对应于印刷; 以及通过检测压缩空气的温度，重复压缩步骤和膨胀步骤中的一个，使得压缩空气的温度在预定温度范围内。