公开(公告)号：KR100396524B1

公开(公告)日：2003-09-02

申请号：KR1020010071830

申请日：2001-11-19

Applicant: 삼성전자주식회사

Inventor： 문기태 ,  김태일 ,  하선용 ,  장동훈

IPC: G02B6/42

Abstract: PURPOSE: An optical communication module using an absorbing layer is provided to prevent the transmission of the stress to an optical fiber by absorbing the stress between a silicon optical bench and a substrate. CONSTITUTION: A substrate(110) is formed with a Kovar material. A bonding pad and circuit elements are formed on an upper surface of a silicon optical bench(120). A V-shaped groove(115) is formed on the upper surface of the silicon optical bench in order to fix an optical fiber(150). The first and the second semiconductor chips(130,140) are adhered on the upper surface of the silicon optical bench by using AuSn material. The optical fiber is formed on the V-shaped groove. An epoxy(160) is coated on an upper surface of the optical fiber. An absorbing layer(170) is used for absorbing the stress transmitted from the silicon optical bench to the substrate.

Abstract translation: 目的：提供使用吸收层的光通信模块，以通过吸收硅光学台和基板之间的应力来防止应力传递到光纤。 构成：衬底（110）由可伐合金材料形成。 焊盘和电路元件形成在硅光学台（120）的上表面上。 V形槽（115）形成在硅光具座的上表面上以固定光纤（150）。 第一和第二半导体芯片（130,140）通过使用AuSn材料粘附在硅光具座的上表面上。 光纤形成在V形槽上。 环氧树脂（160）被涂覆在光纤的上表面上。 吸收层（170）用于吸收从硅光学台传输到基板的应力。

公开(公告)号：KR100396504B1

公开(公告)日：2003-09-02

申请号：KR1020010071831

申请日：2001-11-19

Applicant: 삼성전자주식회사

Inventor： 문기태 ,  추안구 ,  박기수

IPC: G02B6/42

Abstract: PURPOSE: An optical communication module having a reinforced structure is provided to prevent an epoxy due to the external stress by coating a reinforced adhesive on the epoxy. CONSTITUTION: A silicon optical bench(220), the first and the second semiconductor chips(230,240), and an optical fiber(250) are formed on a substrate(210). The substrate is formed with a Kovar material. The silicon optical bench is adhered on the substrate by using AuSn material. A bonding pad and circuit elements are formed on an upper surface of the silicon optical bench. A V-shaped groove is formed on the upper surface of the silicon optical bench in order to fix the optical fiber. The first and the second semiconductor chips are adhered on the upper surface of the silicon optical bench by using the AuSn material. The optical fiber is formed on the V-shaped groove. An epoxy(260) is coated on an upper surface of the optical fiber. A reinforced adhesive(270) is coated on the exposed surface of the epoxy.

Abstract translation: 目的：提供具有增强结构的光通信模块，以通过在环氧树脂上涂覆增强粘合剂来防止由于外部应力而导致的环氧树脂。 构成：在衬底（210）上形成硅光学平台（220），第一和第二半导体芯片（230,240）以及光纤（250）。 衬底由可伐合金材料形成。 硅光学平台通过使用AuSn材料粘附在基板上。 焊盘和电路元件形成在硅光具座的上表面上。 在光学平台的上表面上形成V形槽以固定光纤。 第一和第二半导体芯片通过使用AuSn材料粘附在硅光具座的上表面上。 光纤形成在V形槽上。 环氧树脂（260）涂覆在光纤的上表面上。 强化粘合剂（270）涂覆在环氧树脂的暴露表面上。

公开(公告)号：KR1020030038015A

公开(公告)日：2003-05-16

申请号：KR1020010069419

申请日：2001-11-08

Applicant: 삼성전자주식회사

Inventor： 하선용 ,  문기태 ,  김성민

IPC: G02B6/42

Abstract: PURPOSE: An optical communication module having a heat shield structure is provided to prevent heat transmission to a laser diode by using the heat shield structure. CONSTITUTION: A PCB(Printed Circuit Board)(210) is formed with a Kovar material. A transmission silicon optical bench(230) is adhered on an upper face of the PCB(210) by using an AuSn material. A couple of transmission semiconductor chips(240,250) are adhered on an upper face of the silicon optical bench(230) by using the AuSn material. A reception silicon optical bench(270) is adhered on the upper face of the PCB(210) by using the AuSn material. A V-shaped groove is formed on an upper face of the reception silicon optical bench(270) in order to fix an optical fiber(300). A reception semiconductor chip(280) is adhered on an upper face of the reception silicon optical bench(270) by using the AuSn material. A chip driving portion is adhered to a lower face of the PCB(210). The first heat shield plate(220) is inserted between the transmission silicon optical bench(230) and the PCB(210). The second heat shield plate(260) is inserted between the reception silicon optical bench(270) and the PCB(210).

Abstract translation: 目的：提供一种具有隔热结构的光通信模块，以通过使用隔热结构来防止对激光二极管的热传递。 构成：PCB（印刷电路板）（210）由Kovar材料形成。 通过使用AuSn材料将透射硅光学台（230）粘附在PCB（210）的上表面上。 通过使用AuSn材料将一对传输半导体芯片（240,250）粘附在硅光学台架（230）的上表面上。 接收硅光学台（270）通过使用AuSn材料粘附在PCB（210）的上表面上。 为了固定光纤（300），在接收硅光学台架（270）的上表面上形成V形槽。 接收半导体芯片（280）通过使用AuSn材料粘附在接收硅光学台架（270）的上表面上。 芯片驱动部分粘附到PCB（210）的下表面。 第一隔热板（220）插入在透光硅光学台（230）和PCB（210）之间。 第二隔热板（260）插入在接收硅光学台（270）和PCB（210）之间。

公开(公告)号：KR101751223B1

公开(公告)日：2017-06-28

申请号：KR1020110025144

申请日：2011-03-22

Applicant: 삼성전자주식회사

Inventor： 최윤석 ,  문기태 ,  박승호 ,  이종민

IPC: H04M1/725 ,  G06F3/023 ,  G06F3/0488

CPC classification number: G06F3/0233 ,  G06F3/04886 ,  H04M2250/70

Abstract: 본발명은휴대용단말기의문자입력모드에관한것으로, 특히문자입력모드수행시오탈자발생을쉽게확인하기위하여가상키보드상에현재입력되는데이터의정보를함께출력하기위한장치및 방법에관한것으로, 문자입력모드진입시가상키보드영역과문자입력필드영역으로구성된문자입력화면을출력한후, 상기가상키보드영역에현재입력되는데이터의정보를출력하는보조문자입력필드를출력하는출력관리부와, 상기보조문자입력필드, 상기문자입력필드, 상기가상키보드를출력하는표시부를포함하되, 상기출력관리부는상기가상키보드의입력이감지될경우, 입력된위치에해당하는데이터의정보를상기문자입력필드및 상기보조문자입력필드에출력하고, 상기문자입력모드는텍스트데이터, 기호데이터, 이모티콘데이터가운데적어도어느한가지데이터를입력하는모드임을특징으로한다.

Abstract translation: 便携式终端的字符输入模式本发明涉及便携式终端的字符输入模式，更具体地说，涉及一种用于同时输出虚拟键盘上当前输入的数据的信息以容易地检测字符输入模式中的印刷错误的发生的装置和方法， 输出管理单元，用于在模式输入时输出由虚拟键盘区域和字符输入字段区域组成的字符输入屏幕，并输出辅助字符输入字段，用于输出当前输入到虚拟键盘区域的数据的信息; 以及用于输出虚拟键盘的显示单元，其中当感测到虚拟键盘的输入时，输出管理单元将与输入位置对应的数据的信息发送到字符输入栏和辅助字符输入 字段，并且字符输入模式是用于输入文本数据，符号数据和表情符号数据中的至少一个的模式 其特征在于。

公开(公告)号：KR101751225B1

公开(公告)日：2017-06-27

申请号：KR1020100128490

申请日：2010-12-15

Applicant: 삼성전자주식회사

Inventor： 최윤석 ,  문기태

IPC: H04L29/08 ,  H04W4/00 ,  H04W76/02 ,  G06F17/30

CPC classification number: H04W4/00 ,  G06F17/30575 ,  H04L67/025 ,  H04L67/06 ,  H04L67/104 ,  H04L67/1095 ,  H04L67/2857 ,  H04W76/10

Abstract: 본발명은이동통신단말기의원격제어장치및 방법에관한것으로서, 원격제어이벤트발생시원격제어화면을출력하기위한표시부와, 원격제어이벤트발생시대상단말과의원격제어신호및 저장용데이터를송수신하기위한통신부와, 상기통신부에서수신된원격제어신호를처리하고, 저장용데이터를송수신하도록제어하는원격제어처리부및 원격제어신호에따라상기원격제어처리부를제어하며, 상기저장용데이터의송수신요청에따라대상단말로저장용데이터전송또는수신요청메세지를전송하도록제어하는제어부를포함하며, 단말간의저장용데이터를송수신할수 있기때문에단말의사용편의성이증대되는효과가있다.

公开(公告)号：KR101114788B1

公开(公告)日：2012-03-05

申请号：KR1020080133912

申请日：2008-12-24

Applicant: 삼성전자주식회사

Inventor： 백재명 ,  이동현 ,  박경호 ,  문기태

IPC: H04B1/40

Abstract: 본발명은전화수신시 사용자는단말의양 측면에각각장착된파지센서를동시에접촉하고, 상기파지센서가상기동시접촉을감지하면상기단말은매너모드로변경되며, 상기매너모드로변경된상기단말을사용자의얼굴로근접시키고, 상기단말에장착된근접센서가상기근접을감지하면상기단말의통화가시작되며, 상기통화중인단말이얼굴로부터멀어지고, 상기근접센서가상기멀어짐을감지하면상기단말의통화가종료되는단말의조작방법및 장치를제공함으로써, 복잡한버튼조작이나메뉴조작이필요없이간편하고자연스러운사용자인터페이스를제공할수 있다. 또한상기단말에장착된압력센서로상기단말을파지하고있는상태에서, 파지압력을인지하여새로운유저인터페이스를제공하고자한다.

公开(公告)号：KR1020100069531A

公开(公告)日：2010-06-24

申请号：KR1020080133912

申请日：2008-12-24

Applicant: 삼성전자주식회사

Inventor： 백재명 ,  이동현 ,  박경호 ,  문기태

IPC: H04B1/40

CPC classification number: H04M1/72569 ,  H04M19/041 ,  H04M19/047 ,  H04M2250/12

Abstract: PURPOSE: A method and an apparatus for sensing a gripping of a mobile terminal are provided to rapidly switch a current mode into a manner mode by recognizing the pressure of a hand if a call is received while griping the mobile terminal. CONSTITUTION: In order to recognize the contact of a user to a terminal, grip sensors(610) are installed at the both sides of the terminal respectively. A proximity sensor(620) senses that a user face approaches or gets away from the terminal. When a call is received, the grip sensors sense the simultaneous contacts of the user and switch the terminal into a manner mode. The terminal switched into a manner mode senses the approaching of the user, the proximity sensor starts the call of the terminal.

Abstract translation: 目的：提供一种用于感测抓握移动终端的方法和装置，用于通过在抓握移动终端时接收到呼叫时识别手的压力来将当前模式快速切换为模式。 构成：为了识别用户与终端的接触，把手传感器（610）分别安装在终端的两侧。 接近传感器（620）感测到用户面部接近或远离终端。 当接收到呼叫时，把手传感器感测到用户的同时接触并将终端切换成方式模式。 终端切换到方式模式感测到用户的接近，接近传感器开始终端的呼叫。

公开(公告)号：KR1020050078358A

公开(公告)日：2005-08-05

申请号：KR1020040005768

申请日：2004-01-29

Applicant: 삼성전자주식회사

Inventor： 문기태 ,  윤영권 ,  류현호 ,  표선형

IPC: H04B10/40 ,  H04B10/25

CPC classification number: G02B6/4292 ,  G02B6/4202 ,  G02B6/4246

Abstract: A bidirectional optical transmission/reception module includes a sub-mount and a plane optical device that is mounted on the sub-mount for transmitting and receiving an optical signal. The module includes an optical fiber for inputting the optical signal from and outputting the optical signal to the outside of the bi-directional optical transmission/reception module. A stub into which the optical fiber is mounted protrudes conically at one end adjacent to the device to point the fiber end toward and planarly in alignment with the device. A support member has a hole formed at its one upstanding side, and the hole is penetrated by the conical end of the stub.

公开(公告)号：KR1020050071967A

公开(公告)日：2005-07-08

申请号：KR1020040000382

申请日：2004-01-05

Applicant: 삼성전자주식회사

Inventor： 윤영권 ,  표선형 ,  류현호 ,  문기태 ,  마사히코쯔모리

IPC: G02B6/36

CPC classification number: G02B6/4246 ,  G02B6/3636 ,  G02B6/4214 ,  G02B5/26

Abstract: An optical receiver of a bidirectional optical communication module is fabricated through an assembling process in which multiple modules are assembled concurrently. The module includes a first substrate formed with a groove, an optical fiber located in the groove and having a flat surface, a reflective filter inserted between the first substrate and the fiber with a predetermined inclination angle in order to reflect an incident optical signal, a second substrate supporting the fiber and mounted on the first substrate such that the flat surface.

公开(公告)号：KR1020040098687A

公开(公告)日：2004-11-26

申请号：KR1020030030898

申请日：2003-05-15

Applicant: 삼성전자주식회사

Inventor： 이종식 ,  문기태 ,  이재철

IPC: G01N21/88

CPC classification number: G01N23/04 ,  G01N2291/02881 ,  G01N2291/048

Abstract: PURPOSE: A high-resolution monitoring system and a method thereof are provided to monitor a bonding state in real time. CONSTITUTION: A high-resolution monitoring system includes a light source(51) for irradiating a laser ray(54) at a sample(55). A heating device(52) applies heat to the sample(55). A temperature detection device is provided to detect a temperature of the sample. A light detection device(59) is provided to detect the light transmitted to the sample in order to change to an image signal. A controller(62) outputs the image signal received from the light detection device and controls the light source(51) and the heating device(52). The light source(51) radiates an X-ray or an ultrasonic wave. The heating device(52) includes one selected from the group consisting of a laser, a heating wire, and a heating plate. The temperature detection device includes a pyrometer or a thermocouple.

Abstract translation: 目的：提供高分辨率监控系统及其方法，以实时监控接合状态。 构成：高分辨率监视系统包括用于在样本（55）处照射激光束（54）的光源（51）。 加热装置（52）对样品（55）施加热量。 提供温度检测装置以检测样品的温度。 提供光检测装置（59）以检测透射到样品的光，以便改变为图像信号。 控制器（62）输出从光检测装置接收的图像信号并控制光源（51）和加热装置（52）。 光源（51）照射X射线或超声波。 加热装置（52）包括从激光，加热丝和加热板组成的组中选择的一个。 温度检测装置包括高温计或热电偶。