Abstract:
PURPOSE: Sputtering equipment with an argon-implanted dual bellows is provided to rapidly check the damage of a bellows and avoid an influence upon a process even when the bellows is damaged by installing a leak detecting unit between an internal bellows and an external bellows. CONSTITUTION: A sputtering process is performed in a predetermined space of a chamber. A wafer placement part(13) is installed in the bottom of the chamber. One side of an up-down apparatus(15) is inserted into the chamber and the other side of the up-down apparatus is installed in the outside of the chamber so that the wafer placement part moves up/down. An internal bellows(21) avoids vacuum leak in the chamber according to the driving of the up-down apparatus, installed to surround the up-down apparatus. An external bellows(23) is separated from the internal bellows by a predetermined interval, installed to surround the internal bellows. A gas injection hole(25) injects argon gas to a gap between the internal bellows and the external bellows. A leak detecting unit(27) is installed between the internal bellows and the external bellows.
Abstract:
PURPOSE: An apparatus for inspecting plasma deposition equipment is provided to avoid a process defect by easily detecting introduction of impurity gas caused by a leak even during a process. CONSTITUTION: A semiconductor fabricating process is performed in plasma deposition equipment including a vacuum chamber(300). A current comparator(210) compares detection current with reference current flowing in the vacuum chamber to generate an error signal. A display unit(240) displays that the error signal is generated. A power supply apparatus supplies DC(direct current) power to the vacuum chamber.
Abstract:
본 발명에 따른 반도체장치 제조용 알미늄 쉴드의 티타늄화합물 세정액은, 순수에 과산화수소와 EDTA(Ethylenediamine Tetraacetic Acid) 및 수산화칼륨을 첨가하여 이루어지는 것을 특징으로 한다. 이러한 세정액을 사용하여 세정공정을 실시할 경우, 종래의 알미늄 쉴드 세정방법에서 발생되는, 과다한 시간이 걸리고, 세정액을 수시로 교체시키야 하며, 알미늄 쉴드가 손상되고, 유해한 화학물질을 사용해야 하는 문제점을 줄이거나 없앨 수 있다는 효과가 있다.