公开(公告)号：KR1020050058423A

公开(公告)日：2005-06-16

申请号：KR1020057002957

申请日：2003-08-28

Applicant: 아토테크더치랜드게엠베하

Inventor： 슈나이더라인하르트 ,  케니스테판 ,  퀴스너토르슈텐 ,  플뢰제볼프강 ,  렌츠베르트 ,  슈트로이프헤리베르트

IPC: C23C18/00

CPC classification number: C25D17/28 ,  C25D17/06 ,  H05K3/241

Abstract: A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Abstract translation: 在具有非常薄的碱性金属化的印刷电​​路板的电解处理期间的问题是，处理在印刷电路板的表面上的各个区域产生不规则的结果。 在克服这个问题时，本发明提供一种用于电解处理至少表面上导电的工件的装置，其具有至少两个基本相对的侧边缘。 该装置包括用于工件的电流供应装置，所述电流供应装置各自包括位于相对的侧边缘上的接触条，其能够在大致相对的侧边缘处电接触工件。