公开(公告)号：KR1020130048408A

公开(公告)日：2013-05-10

申请号：KR1020110113246

申请日：2011-11-02

Applicant: 자화전자(주)

Inventor： 박성하 ,  김동만

IPC: H05K1/02 ,  H01L33/64 ,  G02F1/13357 ,  H05K7/20

CPC classification number: H01L2224/48091 ,  H01L2924/00014

Abstract: PURPOSE: Heat dissipation printed circuit board, semiconductor illumination device and display device are provided to improve heat dissipation property by reducing internal temperature deviation. CONSTITUTION: A heat dissipation base substrate(110) is made of thermal conductive polymer. The substrate mounts a heating element in an upper end. A circuit layer is laminated on an insulation layer. A printed circuit board(120) has an aperture. The aperture penetrates into the insulation layer and circuit layer.

Abstract translation: 目的：提供散热印刷电路板，半导体照明装置和显示装置，通过减少内部温度偏差来提高散热性能。 构成：散热基板（110）由导热聚合物制成。 基板在上端安装加热元件。 电路层层叠在绝缘层上。 印刷电路板（120）具有孔径。 孔径穿透绝缘层和电路层。

公开(公告)号：KR1020130015744A

公开(公告)日：2013-02-14

申请号：KR1020110077920

申请日：2011-08-04

Applicant: 자화전자(주)

Inventor： 박성하 ,  김동만

IPC: H05K7/20 ,  F21V29/00 ,  H01L33/64 ,  G02F1/13357

CPC classification number: H01L2224/48091 ,  H01L2924/00014

Abstract: PURPOSE: A heat radiation printed circuit board, semiconductor lighting device and display device are provided to decrease internal temperature by effectively managing generated from a semiconductor light source. CONSTITUTION: A heat radiation base substrate(110) is made of a thermal conductive material. The heat radiation base substrate includes a base unit(112) and a protrusion unit(114). A heat radiator is mounted on the upper end of the protrusion unit. A printed circuit board(120) includes an insulation layer(122), a circuit layer(124) and an opening(126). The circuit layer is laminated on the insulation layer. The opening penetrates through the insulation layer and the circuit layer.

Abstract translation: 目的：提供一种散热印刷电路板，半导体照明装置和显示装置，通过从半导体光源产生的有效管理来降低内部温度。 构成：散热基底（110）由导热材料制成。 散热基底基板包括基座单元（112）和突出单元（114）。 散热器安装在突出单元的上端。 印刷电路板（120）包括绝缘层（122），电路层（124）和开口（126）。 电路层层叠在绝缘层上。 开口穿过绝缘层和电路层。

公开(公告)号：KR1020080017707A

公开(公告)日：2008-02-27

申请号：KR1020060079232

申请日：2006-08-22

Applicant: 자화전자(주)

Inventor： 박성하 ,  홍성민

IPC: H05K7/20

CPC classification number: H05K7/20963 ,  H05K7/20472

Abstract: A heat diffusion sheet and an electronic device adopting the same are provided to increase reliability of the sheet by removing air gap generation probability due to film laminating. A heat diffusion sheet includes a graphite sheet and at least one filler(14) combined or inserted into an edge formed on the graphite sheet. A film laminates at least one plane of the graphite sheet combined or inserted with the filler or laminates only the filler-combined or inserted part of the graphite sheet. An adhesive or a hetero film is further attached to the heat diffusion sheet.

Abstract translation: 提供热扩散片和采用该扩散片的电子装置，以通过除去由于膜层压而引起的气隙产生概率来增加片的可靠性。 散热片包括石墨片和组合或插入形成在石墨片上的边缘中的至少一个填料（14）。 薄膜层压石墨片的至少一个平面，该平面与填料结合或插入，或仅层叠石墨片的填料组合或插入部分。 粘合剂或异质膜进一步附着在热扩散片上。